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ST25DA-C

评估
Design Win

Dynamic NFC/RFID tag IC for NFC Matter commissioning

下载数据摘要

产品概述

描述

The ST25DA-C device is an NFC dynamic tag integrated circuit providing the upcoming Matter commissioning flow over NFC, and cryptographic services.

The ST25DA-C offers a solution for commissioning a new device on a Matter network without requiring external power. On the NFC interface, it offers NFC Forum T4A Tag and Matter NFC Transport Layer applications. It implements secure storage, cryptographic primitives, and protocols to handle Matter Passcode-Authenticated Session Establishment (PASE) based on SPAKE2+ protocol, authentication of Matter device conformance with Matter device attestation, Node Operational Certificate (NOC), offline configuration of the operational network (Thread), and online signature service required for Certificate-Authenticated Session Establishment (CASE).

Based on a Common Criteria (CC) certified secure hardware, the device is designed to be the NFC component of a smart IoT device, acting as an NFC secure companion to the main microcontroller.

It exposes an NFC Forum Type 4 interface to communicate with a smartphone, and a high-speed (400 kHz) I²C interface to communicate with the main microcontroller.

  • 所有功能

    • Contact interface
      • 1.62 V to 3.3 V supply voltage range
      • ESD protection:
        • Human body model (HBM): 6 kV for digital and antenna pads
        • Charge device model (CDM): 1 kV based on a STMicroelectronics module
      • Two-wire I²C serial interface supporting fast mode (up to 400 kHz)
    • Contactless interface
      • Power supplied by 13.56 MHz carrier
      • Complies with ISO/IEC 14443 Type A
      • Complies with NFC Forum Type 4 Tag
      • 78 pF tuning capacitor, with automatic antenna tuning for optimized performance
      • Automatic CPU frequency adaptation for optimum power consumption
      • 7-byte unique identifier (UID) on each die
    • Security features
      • Secure MCU
      • Active shield
      • Monitoring of environmental parameters
      • Protection mechanism against faults
      • Protection against side-channel attacks
      • Unique serial number on each die
      • NIST 800-90B compliant true random-number generator (TRNG)
      • Elliptic curve digital signature algorithm (ECDSA) with SHA-256 for digital signature generation and verification
      • Elliptic curve Diffie-Hellman (ECDH) for key establishment
      • Symmetric cryptography with AES-CCM for data confidentiality and integrity
      • Symmetric cryptography with AES-CTR for data privacy
    • Matter services
      • Stores Matter onboarding data in NFC Forum Type 4 tag
      • Performs commissioning over NFC Transport Layer (NTL):
        • Powered either by VCC pin or 13.56 MHz contactless carrier
        • SPAKE2+
      • Secure storage for certificates and keys needed for Matter commissioning
      • Provides Matter signature generation and verification over I²C
    • 内存
      • More than 3 KB of non-volatile memory is allocated for Matter certificates, keys, and attributes.
    • Operating temperature
      • From -25°C to +85°C
      • 8 pins UFDFPN8 (2 x 3 mm)
    • All packages are ECOPACK2 compliant.

EDA符号、封装和3D模型

意法半导体 - ST25DA-C

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
ST25DA-C
评估
UFDFPN 8 2x3x0.6 工业 N/A - -
ST25DACGEN1-AC7
预览
UFDFPN 8 2x3x0.6 工业 Ecopack2 - -
ST25DACGEN1-AL6
预览
WLCSP 16L DIE K470 0.330 TH 工业 Ecopack2 - -
TST25DA-C
建议
- 工业 - - -

ST25DA-C

Package:

UFDFPN 8 2x3x0.6

Material Declaration**:

Marketing Status

评估

Package

UFDFPN 8 2x3x0.6

Grade

Industrial

RoHS Compliance Grade

N/A

ST25DACGEN1-AC7

Package:

UFDFPN 8 2x3x0.6

Material Declaration**:

Marketing Status

预览

Package

UFDFPN 8 2x3x0.6

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DACGEN1-AL6

Package:

WLCSP 16L DIE K470 0.330 TH

Material Declaration**:

Marketing Status

预览

Package

WLCSP 16L DIE K470 0.330 TH

Grade

Industrial

RoHS Compliance Grade

Ecopack2

TST25DA-C

Package:

-

Material Declaration**:

Marketing Status

建议

Package

-

Grade

Industrial

RoHS Compliance Grade

-

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
供货状态
Budgetary Price (US$)*/Qty
从ST订购
Order from distributors
包装类型
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Operating temperature (°C)
免费样片
ESample Max Qty
最小值
最大值
ST25DACGEN1-AC7
Available at distributors

经销商的可用性 ST25DACGEN1-AC7

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

ST25DACGEN1-AL6
Available at distributors

经销商的可用性 ST25DACGEN1-AL6

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

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ST25DA-C
Available at distributors

经销商的可用性 ST25DA-C

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

TST25DA-C
Available at distributors

经销商的可用性 TST25DA-C

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

ST25DACGEN1-AC7 预览

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

ST25DACGEN1-AC7

Operating Temperature (°C)

Min:

Max:

免费样片:

-

ESample Max Qty:

-

代理商名称

代理商库存报告日期:

ST25DACGEN1-AL6 预览

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

ST25DACGEN1-AL6

Operating Temperature (°C)

Min:

Max:

免费样片:

-

ESample Max Qty:

-

代理商名称

代理商库存报告日期:

ST25DA-C 评估

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

ST25DA-C

Operating Temperature (°C)

Min:

Max:

免费样片:

-

ESample Max Qty:

-

代理商名称

代理商库存报告日期:

TST25DA-C 建议

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

TST25DA-C

Operating Temperature (°C)

Min:

Max:

免费样片:

-

ESample Max Qty:

-

代理商名称

代理商库存报告日期:

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商