产品概述
主要优势
Mainlined OpenSTLinux Distribution
One OpenSTLinux Software compatible with STM32MPU Family. OpenSTLinux expansion packages can be applied on the top to enable the use of additional components.
支持DDR3L带来市场优势
除了支持DDR4/LPDDR4,STM32MP2系列还增加了对DDR3L存储器的支持,帮助您从容应对自2025年中出现的DDR4/LPDDR4短缺与价格飙升,确保产品定价的竞争力与供应链的安全。
描述
STM32MP21xA/D devices are based on the high-performance core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache, and a 128-Kbyte L2 cache. The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency.
STM32MP21xA/D devices also embed a Cortex®-M33 32-bit RISC core operating at up to 300 MHz frequency. The Cortex®-M33 core features a floating-point unit (FPU) single precision which supports Arm® single-precision data-processing instructions, and data types. The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security.
STM32MP21xA/D devices provide an external SDRAM interface supporting external memories up to 4 Gbytes, 16‑bit DDR3L up to 800 MHz, 16‑bit LPDDR4, or DDR4 up to 800 MHz.
The devices incorporate high-speed embedded memories: 456 Kbytes of internal SRAM (including 256-Kbyte AXI SYSRAM), one bank of 64 Kbytes of AHB SRAM, 128 Kbytes of AHB SRAM in backup domain, and 8 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix, and a 128/64-bit multilayer AXI interconnect supporting access to internal and external memories.
Each device offers two ADCs, a low-power secure RTC, 12 general-purpose 16-bit timers, four general-purpose 32‑bit timers, two PWM timers for motor control, five low-power timers, two true random number generator (RNG).
The devices support four multifunction digital filters (MDF)
-
所有功能
- Includes ST state-of-the-art patented technology.
- Cores
- 64-bit single-core Arm® Cortex®-A35
- Up to 1.5 GHz
- 32-Kbyte I + 32-Kbyte D level 1 cache for each core
- 128-Kbyte level 2 cache
- Arm® NEON™ and Arm® TrustZone®
- 32-bit Arm® Cortex®-M33 with FPU/MPU
- Up to 300 MHz
- L1 16-Kbyte I / 16-Kbyte D
- Arm® TrustZone®
- 64-bit single-core Arm® Cortex®-A35
- 存储器
- External DDR memory up to 4 Gbytes
- DDR3L-1600 16-bit
- DDR4-1600 16-bit
- LPDDR4-1600 16-bit
- 456-Kbyte internal SRAM: 256-Kbyte AXI SYSRAM, 64-Kbyte AHB SRAM, 128-Kbyte AHB SRAM with ECC in backup domain, 8-Kbyte SRAM with ECC in backup domain
- One Octo-SPI memory interfaces
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs, and SLC NAND memories with up to 8-bit ECC
- External DDR memory up to 4 Gbytes
- Security/safety
- TrustZone® peripherals, active tamper, environmental monitors, display secure layer, hardware accelerators
- Complete resource isolation framework
- Reset and power management
- 1.71 to 1.95 V and 2.7/3.0 to 3.6 V multiple section I/O supply
- POR, PDR, PVD, and BOR
- On-chip LDO and power-switches for RETRAM, BKPSRAM, and VSW
- Dedicated supplies for Cortex®-A35
- Internal temperature sensor
- Low-power modes: Sleep, Stop, and Standby
- DDR memory retention in Standby mode
- Controls for PMIC companion chip
- Low-power consumption
- Clock management
- Internal oscillators: 64 MHz HSI, 16 MHz MSI, 32 kHz LSI
- External oscillators: 16-48 MHz HSE, 32.768 kHz LSE
- Up to 7× PLLs with fractional mode
- General-purpose inputs/outputs
- Up to 123 secure I/O ports with interrupt capability
- Up to six wake-up inputs
- Up to seven tamper input pins + 5 active tampers output pins
- Up to 123 secure I/O ports with interrupt capability
- Interconnect matrix
- Bus matrices
- 128-, 64-, 32-bit STNoC interconnect, up to 600 MHz
- 32-bit Arm® AMBA® AHB interconnect, up to 300 MHz
- Bus matrices
- 3 DMA controllers to unload the CPU
- 48 physical channels in total
- 3× dual master port, high-performance, general-purpose, direct memory access controller (HPDMA), 16 channels each
- Up to 37 communication peripherals
- 3× I2C FM+ (1 Mbit/s, SMBus/PMBus®)
- 3× I3C (12.5 Mbit/s)
- 3× UART + 4× USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI) + 1× LPUART
- 6× SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)(+1 with OCTOSPI + 4 with USART)
- 4× SAI (stereo audio: I2S, PDM, SPDIF Tx)
- SPDIF Rx with four inputs
- 3× SDMMC up to 8-bit (SD/e•MMC™/SDIO)
- Up to 2× CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
- 1× USB 2.0 high-speed Host with embedded 480 Mbits/s PHY
- 1× USB 2.0 high-speed dual role data with embedded 480 Mbits/s PHY
- Up to 2× Gigabit Ethernet interfaces
- TSN, IEEE 1588v2 hardware, MII/RMII/RGMII
- Camera interface #1 (5 Mpixels at 30 fps)
- MIPI CSI-2®, 2× data lanes up to 2.5 Gbit/s each
- 8- to 16-bit parallel, up to 120 MHz
- RGB, YUV, JPG, RawBayer with light ISP
- Lite-ISP, demosaicing, downscaling, cropping, 3 pixel pipelines
- Camera interface #2 (1 Mpixels at 15 fps)
- 8- to 14-bit parallel, up to 80 MHz
- RGB, YUV, JPG
- Cropping
- Digital parallel interface up to 16-bit input or output
- 5 analog peripherals
- 2 × ADCs with 12-bit max. resolution (up to 5 Msps each, up to 23 channels)
- Internal temperature sensor (DTS)
- 1× multifunction digital filter (MDF) with up to 4 channels/4 filters
- Internal (VREFBUF) or external ADC reference VREF+
- Graphics
- LCD-TFT controller, up to 24-bit // RGB888
- Up to FHD (1920 × 1080) at 60 fps
- 3 layers including a secure layer
- YUV support
- LCD-TFT controller, up to 24-bit // RGB888
- Up to 28 timers and 5 watchdogs
- 4× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2× 16-bit advanced motor control timers
- 10× 16-bit general-purpose timers (including 2 basic timers without PWM)
- 5× 16-bit low-power timers
- Secure RTC with subsecond accuracy and hardware calendar
- 4 Cortex®-A35 system timers (secure, nonsecure, virtual, hypervisor)
- 2× SysTick Cortex®-M33 timer (secure, nonsecure)
- 5× watchdogs (4× independent and 1× window)
- Hardware acceleration
- ECDSA verification with SCA
- 2x HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC
- 2x true random number generator
- CRC calculation unit
- Debug mode
- Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
- 12288-bit fuses including 96-bit unique ID
- All packages are ECOPACK2 compliant
电路原理图
您可能还会喜欢...
EDA符号、封装和3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
硬件型号 (1)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 6.0 | 05 May 2025 | 05 May 2025 |
System View Description (1)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 1.2 | 05 May 2025 | 05 May 2025 |
IBIS models (1)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 3.3 | 15 Oct 2025 | 15 Oct 2025 |
BSDL files (1)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 3.0 | 15 Oct 2025 | 15 Oct 2025 |
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| STM32MP215DAL3 | 批量生产 | VFBGA 361 10x10X1.0 P 0.5 mm | 工业 | Ecopack2 | - | - | |
| STM32MP215DAM3 | 批量生产 | TFBGA 289 14x14x1.2 P 0.8 mm | 工业 | Ecopack2 | - | - | |
| STM32MP215DAN3 | 批量生产 | VFBGA 273 11x11x1.0 P 0.5 mm | 工业 | Ecopack2 | - | - | |
| STM32MP215DAO3 | 批量生产 | VFBGA 225 8x8x1.0 P 0.5 mm | 工业 | Ecopack2 | - | - | |
STM32MP215DAL3
Package:
VFBGA 361 10x10X1.0 P 0.5 mmMaterial Declaration**:
STM32MP215DAM3
Package:
TFBGA 289 14x14x1.2 P 0.8 mmMaterial Declaration**:
STM32MP215DAN3
Package:
VFBGA 273 11x11x1.0 P 0.5 mmMaterial Declaration**:
STM32MP215DAO3
Package:
VFBGA 225 8x8x1.0 P 0.5 mmMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
You’re now leaving st.com and will be re-directed to our Partner’s website.
For the latest innovations and solutions from ST, sign up for our newsletters.
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | Junction Temperature (°C) (min) | Junction Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32MP215DAM3 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
|
| ||||||||||
| STM32MP215DAL3 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
|
| ||||||||||
| STM32MP215DAO3 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
|
| ||||||||||
| STM32MP215DAN3 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
|
|
STM32MP215DAM3 批量生产
STM32MP215DAL3 批量生产
STM32MP215DAO3 批量生产
STM32MP215DAN3 批量生产