STM32H7A3VI

概述

样片和购买

解决方案

文件

CAD资源

工具与软件

质量与可靠性

开始

Partner products

銷售公文包

Please enter your desired search query and search again

产品概述

描述

STM32H7A3xI/G devices are based on the high-performance Arm^® Cortex^®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex^® -M7 core features a floating point unit (FPU) which supports Arm^® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7A3xI/G devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H7A3xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory up to 2 Mbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG). The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

所有功能
内核

32-bit Arm^® Cortex^®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

存储器

Up to 2 Mbytes of Flash memory with read while write support, plus 1 Kbyte of OTP

~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain

2x Octo-SPI memory interfaces with on-the-fly decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode

Flexible external memory controller with up to 32-bit data bus:
SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous mode

SDRAM/LPSDR SDRAM,

8/16-bit NAND Flash memory

CRC calculation unit

安保

ROP, PC-ROP, active tamper, secure firmware upgrade support

General-purpose input/outputs

Up to 168 I/O ports with interrupt capability
Fast I/Os capable of up to 133 MHz

Up to 164 5 V-tolerant I/Os

Low-power consumption

Stop: down to 32 µA with full RAM retention

Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)

V_BAT: 0.8 µA with RTC and LSE ON

Clock management

Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI

External oscillators: 4-50 MHz HSE, 32.768 kHz LSE

3× PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode

Reset and power management

2 separate power domains, which can be independently clock gated to maximize power efficiency:
CPU domain (CD) for Arm^® Cortex^® core and its peripherals , which can be independently switched in Retention mode

mart run domain (SRD) for reset and clock control, power management and some peripherals

1.62 to 3.6 V application supply and I/Os

POR, PDR, PVD and BOR

Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs

Dedicated MMC power supply

High power efficiency SMPS step-down converter regulator to directly supply V_CORE or an external circuitry

Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry

Voltage scaling in Run and Stop mode

Backup regulator (~0.9 V)

Low-power modes: Sleep, Stop and Standby

V_BAT battery operating mode with charging capability

CPU and domain power state monitoring pins

Interconnect matrix

5 DMA controllers to unload the CPU

1× high-speed general-purpose master direct memory access controller (MDMA)

2× dual-port DMAs with FIFO and request router capabilities

1× basic DMA with request router capabilities

1x basic DMA dedicated to DFSDM
Up to 35 communication peripherals

4× I2C FM+ interfaces (SMBus/PMBus)

5× USART/5x UARTs (ISO7816 interface, LIN, IrDA, modem control) and 1x LPUART

6× SPIs, including 4 with muxed full-duplex I2S audio class accuracy via internal audio PLL or external clock and 1 x SPI/I2S in LP domain (up to 125 MHz)

2x SAIs (serial audio interface)

SPDIFRX interface

SWPMI single-wire protocol master I/F

MDIO Slave interface

2× SD/SDIO/MMC interfaces (up to 133 MHz)

2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)

1× USB OTG interfaces (1HS/FS)

HDMI-CEC

8- to 14-bit camera interface up to 80 MHz

8-/16-bit parallel synchronous data input/output slave interface (PSSI)

11 analog peripherals

2× ADCs with 16-bit max. resolution (up to 24 channels, up to 3.6 MSPS)

1× analog and 1x digital temperature sensors

1× 12-bit single-channel DAC (in SRD domain) + 1× 12-bit dual-channel DAC

2× ultra-low-power comparators

2× operational amplifiers (8 MHz bandwidth)

2× digital filters for sigma delta modulator (DFSDM), 1x with 8 channels/8 filters and 1x in SRD domain with 2 channels/1 filter

Graphics

LCD-TFT controller up to XGA resolution

Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load

Hardware JPEG Codec

Chrom-GRC™ (GFXMMU)

Up to 19 timers and 2 watchdogs

2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 280 MHz)

2× 16-bit advanced motor control timers (up to 280 MHz)

10× 16-bit general-purpose timers (up to 280 MHz)

3× 16-bit low-power timers (up to 280 MHz)

2× watchdogs (independent and window)

1× SysTick timer

RTC with sub-second accuracy and hardware calendar

Debug mode

SWD & JTAG interfaces

4 Kbytes Embedded Trace Buffer

1x 32-bit, NIST SP 800-90B compliant, true random generator

96-bit unique ID

All packages are ECOPACK2 compliant
阅读更多阅读较少信息

电路原理图

下載

EDA符号、封装和3D模型

所有资源

展开所有类别

	资源标题	版本	更新时间

System View Description (1)

	资源标题	版本	更新时间
ZIP	STM32H7 System View Description	1.9	23 Nov 2023	23 Nov 2023 STM32H7 System View Description 1.9

IBIS models (1)

	资源标题	版本	更新时间
ZIP	STM32H7 IBIS models	5.0	11 Mar 2024	11 Mar 2024 STM32H7 IBIS models 5.0

BSDL files (1)

	资源标题	版本	更新时间
ZIP	STM32H7 Boundary Scan Decription Language (BSDL) files	4.0	19 May 2020	19 May 2020 STM32H7 Boundary Scan Decription Language (BSDL) files 4.0

质量与可靠性

产品型号	Marketing Status	包	等级规格	符合RoHS级别	材料声明**
STM32H7A3VIH6	批量生产	TFBGA 100 8x8x1.2 P 0.8 mm	工业	Ecopack2	PDF XML
STM32H7A3VIH6Q	批量生产	TFBGA 100 8x8x1.2 P 0.8 mm	工业	Ecopack2	PDF XML
STM32H7A3VIT6	批量生产	LQFP 100 14x14x1.4 mm	工业	Ecopack2
STM32H7A3VIT6Q	批量生产	LQFP 100 14x14x1.4 mm	工业	Ecopack2