STM32G0x1提供面向物联网及其集成功能的升级能力。
STM32G0x1器件满足了在模拟、低功耗运行或更多安全应用控制(如物联网应用、家庭娱乐产品、家用电器和工业设备)方面对更高性能的需求。
它支持更高的温度范围(最高可达125°C)和广泛的封装类型,如WLCSP、UFBGA、TSSOP、SON、LQFP和UFQFPN封装。
该产品系列支持从16 KB到512 KB的片上Flash存储器,提供从8引脚、20引脚封装到100引脚封装。
STM32G0x1提供面向物联网及其集成功能的升级能力。
STM32G0x1器件满足了在模拟、低功耗运行或更多安全应用控制(如物联网应用、家庭娱乐产品、家用电器和工业设备)方面对更高性能的需求。
它支持更高的温度范围(最高可达125°C)和广泛的封装类型,如WLCSP、UFBGA、TSSOP、SON、LQFP和UFQFPN封装。
该产品系列支持从16 KB到512 KB的片上Flash存储器,提供从8引脚、20引脚封装到100引脚封装。
STM32Cube MCU package for STM32G0 series
| 产品编号 | Description | 供应商 | Licence type | 支持的设备 |
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