产品概要
描述
MPX23001是一款面向大批量应用的微型压力传感器封装，非常适合作为子模块组件或一次性单元使用。
其独特的Chip Pak理念为系统设计提供了极大的灵活性，同时为设计人员提供了一种经济的解决方案。这种新型芯片载体封装采用基于压阻技术的独特传感器裸片，并具备片上薄膜温度补偿与校准功能。
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性能一览
- 集成温度补偿与校准
- 输出信号与电源电压成比率
- 聚砜外壳材料（符合ISO 10993标准）
- 提供易于使用的卷带和盘装
EDA Symbols, Footprints and 3D Models
STMicroelectronics - MPX2300D
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MPX2300DT1 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
MPX2300DT1 Active
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
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