产品概述
描述
The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope.
ST’s family of modules leverages a robust and mature manufacturing process already used for the production of micromachined accelerometers.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are based on CMOS technology that allows designing a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LSM330DL has a dynamic, user-selectable full-scale acceleration range of ±2g/±4g/±8g/±16g and an angular rate of ±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can be either activated or put in low-power / power-down mode separately for power-saving optimized applications. The LSM330DL is available in a plastic land grid array (LGA) package.
Several years ago ST successfully pioneered the use of this package for accelerometers. Today, ST has the broadest manufacturing capability in the world and unrivalled expertise for the production of sensors in a plastic LGA package.
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所有功能
- Analog supply voltage 2.4 V to 3.6 V
- Digital supply voltage I/Os, 1.8V
- Low-power mode
- Power-down mode
- 3 independent acceleration channels and 3 angular rate channels
- ±2g/±4g/±8g/±16g dynamic, selectable full-scale acceleration range
- ±250/±500/±2000 dps dynamic, selectable full-scale angular rate
- SPI/I2C serial interface (16-bit data output)
- Programmable interrupt generator for free-fall and motion detection
- ECOPACK®, RoHS, and “Green” compliant
EDA符号、封装和3D模型
意法半导体 - LSM330DL
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符号
封装
3D模型