VL53L9CX
Evaluation
Design Win
面向消费级市场的3D dToF一体化激光雷达模块,内置片上处理功能

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产品概要

描述

The VL53L9CX is a state of the art, dToF 3D lidar (light detection and ranging) module with market leading resolution of up to 2.3k zones enhancing the ST FlightSense product family. Housed in a miniature reflowable package, it integrates all necessary components to make it a true all-in-one and easy to integrate module. The VL53L9CX includes a SPAD array, postprocessing SoC, two VCSELs powered by a dedicated BCD VCSEL driver providing a flood illumination, physical infrared filters, metasurface optical elements (MOE), and an embedded PMIC. The module is Class 1 laser safe, offering skin protection in addition.

The use of a MOE above the VCSELs allows to project an optimized rectangular FoV onto the scene. The receiver lens focuses the reflection of this light onto the SPAD array.

Unlike conventional IR sensors, the VL53L9CX uses ST's latest generation BSI stacked direct ToF technology, which allows absolute distance measurement whatever the target color and reflectance. It provides accurate ranging from below 5 cm up to 8.8 m. The VL53L9CX can stream processed data at maximum frame rate (100 Hz), which makes it the fastest, truly integrated 3D lidar camera module on the market. Available output data: depth, 2D IR with active illumination, 2D IR without active illumination, reflectance, and confidence.

The VL53L9CX achieves the best ranging performance, including under strong ambient light conditions, with a range of cover glass materials. Multizone distance measurements are possible up to 54 x 42 zones, with a wide 55°x42° FoV, which can be reduced by software.

  • 性能一览

    • Fast and accurate 3D direct Time-of-Flight (dToF) camera module
      • Multizone ranging output with up to 54 x 42 separate zones and binning options
      • On-chip processing streaming 2D IR image, depth and ambient maps
      • Confidence level and reflectance maps generated in postprocessing
      • Ranging from <5 cm up to 8.8 m
      • Up to 100 Hz frame rate capability
      • On-chip histogram processing and algorithmic compensation minimize or remove the impact of cover glass crosstalk and veiling glare
    • Fully integrated miniature module with wide field of view (FoV)
      • Scan by two vertical-cavity surface-emitting lasers (VCSEL) flood illumination940 nm invisible light and integrated analog driver
      • 55°x42° (71° diagonal) FoV using metasurface optical elements (MOE) on both transmitter and receiver
      • Receiving array of single photon avalanche diodes (SPADs)
      • Size: 12.8 x 6.1 x 4.6 mm
    • Easy integration
      • True all-in-one module with integrated SPAD sensor and VCSEL PMIC
      • Single reflowable component
      • Interface: I3C & MIPI CSI
      • Flexible power supply options:Supports dual power supply operation: 1.2 V & 3.3 V
      • Compatible with a wide range of cover glass materials

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STMicroelectronics - VL53L9CX

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Quality and Reliability

Part Number Marketing Status Package Grade 符合RoHS级别 Longevity Commitment Longevity Starting Date Material Declaration**
VL53L9CXV0VE/1
Evaluation
OPTICAL LGA 12.1X5.1X4.5MM Industrial Ecopack2 - -

VL53L9CXV0VE/1

Package:

OPTICAL LGA 12.1X5.1X4.5MM

Material Declaration**:

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Marketing Status

Evaluation

Package

OPTICAL LGA 12.1X5.1X4.5MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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VL53L9CXV0VE/1

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VL53L9CXV0VE/1 Evaluation

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商