产品概述
主要优势
描述
The VD66GY is part of a brand-new complete series of image sensors developed by STMicroelectronics for professional and consumer vision applications. Leveraging state-of-the-art technologies developed by STMicroelectronics own foundry, the sensor provides outstanding performance enabling to capture bright and sharp color images. With its clever design and complete toolbox of on-chip functions, it is the ideal solution for the design of tomorrow’s smart and optimized systems.
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所有功能
- Cutting-edge performance of ST proprietary pixel:
- BSI structure provides superior QE, MTF, and angular response.
- Full DTI technology further increases sensitivity and sharpness.
- Excellent response across the whole color spectrum.
- Proprietary technology from ST foundry in France, ensuring safe supply.
- Easy integration into your system:
- Ultracompact die with centered design to minimize your system size.
- Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop.
- Low power, ideal for battery-powered devices.
- Robust design and image quality in temperature.
- A complete toolbox of in-sensor features:
- Stunning images with in-sensor autoexposure and various corrections.
- Multiple features to optimize data size and frame rates such as crop, binning, and programmable sequences.
- 8 GPIOs enabling extra controls such as trigger or LED synchronization.
- Seamless connection to embedded processing platforms:
- 1 or 2 lanes MIPI CSI-2 interface enabling straight connection to entry-level cost-effective processing platforms.
- Start immediately your development with our turnkey sensor boards, modules, and drivers for the VD66GY image sensor.
- The VD66GY color image sensor is also available in monochrome (VD56G3) and RGB-NIR versions (VD16GZ).
- Cutting-edge performance of ST proprietary pixel:
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EDA符号、封装和3D模型
意法半导体 - VD66GY
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| VD66GYCCA/RW | 批量生产 | DIE | 工业 | N/A | 10 | 2024-01-01T00:00:00.000+01:00 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| VD66GYCCA/RW | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
VD66GYCCA/RW 批量生产