VD56GA
Preview
Design Win
1.1 MPixel Image sensor with Global Shutter. Automotive-grade, Functional Safety, Cybersecurity, CSP Package

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产品概要

Key Benefits

ST DeepNIR technology

Delivers exceptional QE and outstanding sharpness in the NIR spectrum, ideal for challenging applications such as under-display cameras.

Compact design

Measuring just 3.6 x 3.1 mm, it is ideal for space-constrained installations and compact, discreet next-generation in-cabin camera designs.

Safe by design

Built for reliable in-cabin use, with extended temperature range, robust cybersecurity, and support for ISO 26262 and ISO/SAE 21434 safety standards.

描述

The VD56GA is a 1.1 megapixel global shutter image sensor with superhigh performance 2.43 μm pixels, allowing virtual 2-megapixels compliancy for automotive driver monitoring applications.

The virtual 2-megapixel performance is enabled by the ST DeepNIR technology featuring unrivaled MTF performance.

This ST DeepNIR technology offers excellent sensitivity with 43% QE at 940 nm enabling the VD56GA to operate with only one low-power LED.

The small CSP package footprint, more than three times smaller than the previous generation, combined with the ISO26262 and ISO21434 compliancy, makes VD56GA the optimal image sensor for driver monitoring systems.

  • 性能一览

    • Automotive compliancy
      • AEC-Q100 grade 2 under qualification
      • Operating junction temperature: -40°C to 125°C
      • ISO26262 compliant to support ASILB system integration
      • ISO21434 compliant with exhaustive cybersecurity features
    • Ultracompact and high MTF 1.1 megapixel image sensor
      • Global shutter architecture, 3D BGS stacked sensor 40 nm/65 nm
      • 2.43 μm x 2.43 μm BSI pixel with ST DeepNIR technology
      • 1.1 megapixel monochrome sensor (1152 x 920) operating at 60 frames per second
      • Package: CSP
        • Size: 3.7 mm x 3.1 mm
        • Matrix: 6 x 5 balls
        • Ball pitch: 550 μm
      • Optical format < 1/5’’ (3.58 mm diag)
      • µlens shift to match 20° linear CRA
    • Unique imaging performance for virtual 2-megapixel performance
      • Absolute quantum efficiency 41% @ 940 nm
      • Outstanding MTF performance
    • Easy and up-to-date integration
      • Embedded autoexposure with tunable ROI
      • 8- and 10-bit output (PWL 10 bit to 8 bit), YUV (monochrome) 422 8-bit
      • Dual lane transmitter MIPI CSE FSED up to 1.5 Gbps per lane
      • Three programmable GPIOs:
        • Output synchronized with sensor integration periods
        • PWM (pulse-width modulation) control
      • Region of interest, two image context management
      • Automatic dark calibration and defective pixel correction
      • Image cropping
      • Mirror/flip readout
      • Analog binning 2 x 2 and analog subsampling ½

EDA Symbols, Footprints and 3D Models

STMicroelectronics - VD56GA

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Footprints

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3D models

Quality and Reliability

Part Number Marketing Status Package Grade 符合RoHS级别 Longevity Commitment Longevity Starting Date Material Declaration**
VD56GA
Proposal
CSP Industrial - - -
VD56GATA38
Preview
SENSOR TSV DIE Automotive Safety Cybersecurity Ecopack2 - -
VD56GATA38/1
Preview
SENSOR TSV DIE Automotive Safety Cybersecurity Ecopack2 - -

VD56GA

Package:

CSP

Material Declaration**:

Marketing Status

Proposal

Package

CSP

Grade

Industrial

RoHS Compliance Grade

-

VD56GATA38

Package:

SENSOR TSV DIE

Material Declaration**:

Marketing Status

Preview

Package

SENSOR TSV DIE

Grade

Automotive Safety Cybersecurity

RoHS Compliance Grade

Ecopack2

VD56GATA38/1

Package:

SENSOR TSV DIE

Material Declaration**:

Marketing Status

Preview

Package

SENSOR TSV DIE

Grade

Automotive Safety Cybersecurity

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商