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VD56G3

批量生产
Design Win Education

紧凑且高灵敏度的1.53百万像素单色全局快门图像传感器

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产品概述

主要优势

捕捉清晰锐利的图像

利用全封装先进全局快门像素技术,实现从可见光到近红外波段的高灵敏度与高清晰度成像,精准捕捉细微细节。

快速、轻松地进行开发

使用全面的评估硬件(PromoduleS-Board等)和免费的软件工具(包括评估软件SDK驱动程序),助力您的项目快速启动。

支持嵌入式视觉

采用紧凑高能效设计,集成先进3D堆叠技术与MIPI CSI-2接口,非常适合基于嵌入式处理器的人体工学电池供电摄像设备。

描述

The VD56G3 and VB56G3 are 1.5-megapixel monochrome CMOS image sensors that deliver exceptional imaging performance in a compact form factor. Built on STMicroelectronics' proprietary technologies, including BSI and full CDTI, they achieve superior QE (quantum efficiency), MTF (modulation transfer function), and angular response for sharp, crystal-clear image capture, even in challenging conditions. With outstanding performance in both visible and near infrared light (850 nm, 940 nm), these sensors are ideal for precision-driven and versatile applications.

Their ultracompact footprint minimizes system size, featuring a small optical format of 4.6 mm (1/4'') at full resolution, enabling the design of compact and ergonomic vision systems. With low-power consumption, they are ideal for battery-powered devices, while their robust design ensures reliable and consistent image quality across a wide range of temperatures.

Smart in-sensor features such as autoexposure, cropping, binning, and programmable sequences simplify development and optimize data throughput. Their MIPI CSI-2 interface (1 or 2 lanes) and I²C control ensures seamless connection to embedded processing platforms.

The sensors offer unmatched flexibility. The VD56G3 is available as a sensor die for ultracompact camera modules, while the VB56G3 comes in an OBGA package for direct PCB integration. They are also part of a sensor family that includes color (RGB) versions VD66GY and VB66GY, and RGB-NIR versions VD16GZ and VB16GZ for even greater flexibility.

Supported by turnkey sensor boards, evaluation modules, and free drivers, the VD56G3 and VB56G3 accelerate development and empower engineers to build innovative, high-performance imaging solutions with ease and confidence.

  • 所有功能

    • Resolution: 1.53 MP (1124 x 1364)
    • Chroma: Monochrome
    • Optical format: 1/4’’ (4.61 mm)
    • State-of-the-art pixel technology:
      • Pixel pitch: 2.61 µm
      • Shutter type: Global shutter
      • Technologies: GS (global shutter), BSI (backside illumination), CDTI (continuous digital time integration), and 3D stacking (three-dimensional stacking).
    • Embedded features:
      • Image quality optimization: Autoexposure, defective pixel correction, binning, and more.
      • Data and frame rate optimization: Cropping, subsampling, and more.
      • Others: Context management, temperature sensor, and more.
    • Interfaces:
      • Output: MIPI CSI-2 (1 or 2 lanes) with RAW8 and RAW10 output formats
      • Control: I²C
    • Comprehensive evaluation hardware:
      • VD56G3 promodules (CAM-56G3)
      • VD56G3 S-Board (STEVAL-56G3MAI)
      • EVK Main (STEVAL-EVK-U0I)
    • Compatible software tools:
      • PC Evaluation software: STSW-IMG501
      • PC Software Development Kit (SDK): STSW-IMG507_56G3
      • Embedded platform drivers: STSW-IMG502

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EDA符号、封装和3D模型

意法半导体 - VD56G3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

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质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
VD56G3CCA/RW
批量生产
DIE 工业 N/A 10 2024-01-01T00:00:00.000+01:00

VD56G3CCA/RW

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DIE

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批量生产

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DIE

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Industrial

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(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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VD56G3CCA/RW
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VD56G3CCA/RW 批量生产

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商