产品概述
主要优势
描述
The VD56G3 and VB56G3 are 1.5-megapixel monochrome CMOS image sensors that deliver exceptional imaging performance in a compact form factor. Built on STMicroelectronics' proprietary technologies, including BSI and full CDTI, they achieve superior QE (quantum efficiency), MTF (modulation transfer function), and angular response for sharp, crystal-clear image capture, even in challenging conditions. With outstanding performance in both visible and near infrared light (850 nm, 940 nm), these sensors are ideal for precision-driven and versatile applications.
Their ultracompact footprint minimizes system size, featuring a small optical format of 4.6 mm (1/4'') at full resolution, enabling the design of compact and ergonomic vision systems. With low-power consumption, they are ideal for battery-powered devices, while their robust design ensures reliable and consistent image quality across a wide range of temperatures.
Smart in-sensor features such as autoexposure, cropping, binning, and programmable sequences simplify development and optimize data throughput. Their MIPI CSI-2 interface (1 or 2 lanes) and I²C control ensures seamless connection to embedded processing platforms.
The sensors offer unmatched flexibility. The VD56G3 is available as a sensor die for ultracompact camera modules, while the VB56G3 comes in an OBGA package for direct PCB integration. They are also part of a sensor family that includes color (RGB) versions VD66GY and VB66GY, and RGB-NIR versions VD16GZ and VB16GZ for even greater flexibility.
Supported by turnkey sensor boards, evaluation modules, and free drivers, the VD56G3 and VB56G3 accelerate development and empower engineers to build innovative, high-performance imaging solutions with ease and confidence.
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所有功能
- Resolution: 1.53 MP (1124 x 1364)
- Chroma: Monochrome
- Optical format: 1/4’’ (4.61 mm)
- State-of-the-art pixel technology:
- Pixel pitch: 2.61 µm
- Shutter type: Global shutter
- Technologies: GS (global shutter), BSI (backside illumination), CDTI (continuous digital time integration), and 3D stacking (three-dimensional stacking).
- Embedded features:
- Image quality optimization: Autoexposure, defective pixel correction, binning, and more.
- Data and frame rate optimization: Cropping, subsampling, and more.
- Others: Context management, temperature sensor, and more.
- Interfaces:
- Output: MIPI CSI-2 (1 or 2 lanes) with RAW8 and RAW10 output formats
- Control: I²C
- Comprehensive evaluation hardware:
- VD56G3 promodules (CAM-56G3)
- VD56G3 S-Board (STEVAL-56G3MAI)
- EVK Main (STEVAL-EVK-U0I)
- Compatible software tools:
- PC Evaluation software: STSW-IMG501
- PC Software Development Kit (SDK): STSW-IMG507_56G3
- Embedded platform drivers: STSW-IMG502
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EDA符号、封装和3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| VD56G3CCA/RW | 批量生产 | DIE | 工业 | N/A | 10 | 2024-01-01T00:00:00.000+01:00 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| VD56G3CCA/RW | | | distributors 无法联系到经销商,请联系我们的销售办事处 | |||||||||||
VD56G3CCA/RW 批量生产