STDES-MKI128V7
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Design Win
Smart MEMS Multi-sensor module

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产品概要

描述

The enhanced embedded sensor topology of the STDES-MKI128V7 MEMS sensor module helps you save development time and effort when developing smart, creative prototypes for a wide range of applications.

This compact board integrates the iNEMO inertial module (LSM6DSO) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LISMDL), a dust-resistant full-mold absolute pressure sensor (LPS22HH), and a relative humidity and temperature sensor (HTS221).

Quality and Reliability

Part Number Marketing Status Package Grade 符合RoHS级别 WEEE Compliant Longevity Commitment Longevity Starting Date Material Declaration**
STDES-MKI128V7
Active
- Industrial - Yes - -

STDES-MKI128V7

Package:

-

Material Declaration**:

Marketing Status

Active

Package

-

Grade

Industrial

RoHS Compliance Grade

-

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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STDES-MKI128V7

经销商的可用性 STDES-MKI128V7

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STDES-MKI128V7 Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STDES-MKI128V7

Supplier:

ST

Core Product:

LSM6DSO, LIS2MDL, LPS22HH, HTS221

代理商名称

代理商库存报告日期:

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商