产品概要
描述
The STDRIVEG600 is a high-speed half-bridge gate driver optimized to drive high-voltage N-channel power MOSFETs or enhanced mode GaN HEMTs. It features an integrated bootstrap diode and allows supplying external switches up to 20 V.
The EVSTDRIVEG600DM board is easy to use and quick and adapt for evaluating the characteristics of STDRIVEG600 driving 600V MDmesh DM2 Power MOSFET with fast recovery diode.
It provides an on-board programmable dead time generator and a 3.3 V linear voltage regulator to supply external logic controllers like microcontrollers.
Spare footprints are also included to allow customizing the board for the final application, such as separate input signal or single PWM signal, use of optional external bootstrap diode, separate supply for VCC, PVCC or BOOT and the use of low-side shunt resistor for peak current mode topologies.
The EVSTDRIVEG600DM is 54 x 88 mm wide, FR-4 PCB resulting in 20 °C/W Rth(J‑A) in still air.
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性能一览
- Half-Bridge topology featuring 600V STDRIVEG600 gate driver
- Equipped with 115 mΩ 600V MDmesh DM2 Power MOSFET STL33N60DM2 with fast recovery diode.
- MOSFET in PowerFLAT 8x8 HV package with Kelvin source or alternative DPAK footprint.
- HV bus up to 450V (capacitor rating limited)
- 4.75 to 20 V VCC gate driver supply voltage
- On-board adjustable deadtime generator to convert single PWM signal into independent high-side and low-side deadtimes.
- Separated inputs with external deadtime can also be used
- On-board 3.3V regulator for external circuitry supply
- 20°C/W junction-to-ambient thermal resistance to evaluate large power topologies
- Optional low-side shunt
- RoHS compliant.
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
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Board Manufacturing Specifications (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 2.0 | 20 Nov 2023 | 20 Nov 2023 |
BOM (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 2.0 | 20 Nov 2023 | 20 Nov 2023 |
Schematic Pack (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 2.0 | 20 Nov 2023 | 20 Nov 2023 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| EVSTDRIVEG600DM | Active 产品已量产 | CARD | Industrial | Ecopack1 | - | - | - | |
EVSTDRIVEG600DM
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | Board production status | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EVSTDRIVEG600DM | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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EVSTDRIVEG600DM Active