产品概述
描述
The EVLSPIN3P2 demonstration board is a fully integrated H-bridge motor driver, which allows the evaluation of all the STSPIN3P2 features.
The board includes the minimum set of electrical components recommended in the device datasheet. This configuration allows the user to connect the load, power supply, and microcontroller directly, without additional external component design or connection.
The board can be stacked with an X-Nucleo MCU control board through Arduino® connectors or driven directly by external pins.
STSPIN3P2 is a full-bridge product series that expands the capability of STSPIN family for low-voltage DC motors.
The level of protection offered by STSPIN3P is excellent, with a comprehensive set of features. The device is protected from overvoltage, undervoltage, overtemperature, and cross conduction.
The STSPIN3P series is assembled in a QFN 6×6 mm triple-pad 26+2L package equipped with three exposed islands for optimized dissipation performance. This package is designed for harsh industrial environments and offers improved thermal performance due to exposed die pads.
The input signals INA and INB can interface directly with the microcontroller to select the motor direction and the brake condition. Two selection pins, SEL0 and SEL1, are available to access information on the MultiSense pin and PH_OUT pin.
The MultiSense pin enables monitoring the motor current by delivering a current proportional to the motor current value and provides the diagnostic feedback. The PH_OUT pin provides feedback on the OUT status, confirming that the motor operates correctly.
The PWM, with a frequency of up to 25 kHz, allows control of the motor speed under all conditions.
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所有功能
- Power system-in-package integrating gate driver and high-current power MOSFETs:
- RDS(ON) = 82 mΩ per leg (STSPIN3P21)
- RDS(ON) = 45 mΩ per leg (STSPIN3P22)
- RDS(ON) = 30 mΩ per leg (STSPIN3P23)
- Up to 16 V power supply and 35 Arms output current
- Maximum transient supply voltage: 32 V
- Maximum standby current: 1 μA at 25 °C
- Multisense monitoring functions
- Analog motor current feedback
- Chip temperature monitoring
- Undervoltage shutdown
- Overvoltage clamp
- Thermal shutdown
- Cross-conduction protection
- X-Nucleo form factor with Arduino® connectors
- RoHS compliant
- Power system-in-package integrating gate driver and high-current power MOSFETs:
质量与可靠性
| 料号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | WEEE Compliant | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|---|
| EVLSPIN3P23 | 批量生产 产品已量产 | CARD | 工业 | Ecopack1 | - | - | - | |
EVLSPIN3P23
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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样片和购买
| 料号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 供应商 | 核心产品 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EVLSPIN3P23 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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EVLSPIN3P23 批量生产