产品概要
描述
The CLOUD-ST25TA02KB is a ready-to-use demonstration board intended to evaluate the ST25TA02KB-P device.
The ST25TA02KB-P is a dynamic NFC/RFID tag IC with a digital General Purpose Output (GPO), embedding a 2 Kbit EEPROM that supports NDEF tag applications for NFC Forum Type 4.
The device communicates using the ISO/IEC 14443 Type A protocol, and is fully powered by the RF field. When the GPO output is used, an external reference voltage is required to set the high level voltage of the GPO signal to be directly compatible with the I/O voltage of the MCU or Host, without the need for any level shifter.
The GPO signal is active High when asserted, and can be used as a rising edge interrupt. It may be configured through the RF interface for various uses, like indicating Field Detection (by default) to wake-up an MCU, or Host like a Bluetooth® or a Wi-Fi® chipset.
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性能一览
- Ready-to-use printed circuit board with
- ST25TA02KB-P NFC/RFID Tag in UFDFPN5 ECOPACK®2 package
- 19 mm2 single layer inductive antenna, etched on the PCB
- Contactless interface
- TruST25™ digital signature
- NFC Forum Type 4 Tag
- ISO/IEC 14443 Type A
- 106 kbps data rate
- Internal 50 pF tuning capacitance, enabling design of small inductive antennas
- Memory
- 256 Byte (2 Kbit) EEPROM with NDEF data support
- 200-year data retention
- 1 million erase-write cycles endurance
- 128-bit password data protection
- 20-bit event counter for read or write access with anti-tearing feature
- Digital pad
- Configurable general purpose output (GPO) indicating, for example, RF field detection
- Ready-to-use printed circuit board with
特别推荐
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
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Board Manufacturing Specifications (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 28 Aug 2018 | 28 Aug 2018 |
BOM (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| XLS | 1.0 | 28 Aug 2018 | 28 Aug 2018 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| CLOUD-ST25TA02KB | Active 产品已量产 | CONTRACTS | Industrial | Ecopack2 | - | - | - | |
CLOUD-ST25TA02KB
Package:
CONTRACTSMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CLOUD-ST25TA02KB | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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CLOUD-ST25TA02KB Active