产品概述
描述
Stellar integration MCUs have been designed to meet the requirements of domain controllers and ECUs with high integration requested in the architectures of connected, updatable, automated, and electrified cars. They have superior real-time and safe performance (with highest ASIL-D capability). Bringing hardware-based virtualization technology to MCUs, they ease the development and integration of multiple source software onto the same hardware while maximizing the resulting software performance. They offer high-efficiency OTA reprogramming capability with fast new image download and activation. They also provide high-speed security cryptographic services, for instance for network authentication.
-
所有功能
- Highlights
- AEC-Q100 qualified
- SR6 integration MCUs:
- Have superior real-time and safe performance (with highest ASIL-D capability)
- Bring hardware-based virtualization technology to MCUs for simplified multiple software integrations at optimized performance
- Have built-in no downtime OTA reprogramming capability (with built-in dual-image mechanism)
- Offer high-speed security cryptographic services, for example for network authentication
- Cores and accelerators
- 4 × 32-bit Cortex®‑R52+ cores (2 of them with checker cores, and 2 in split-lock configuration):
- Configurable as either 4 cores (2 of them in lockstep configuration) or 3 cores (all of them in lockstep configuration)
- Arm® v8-R compliant
- Single precision floating-point unit (FPU)
- New privilege level for real-time virtualization
- Up to 500 MHz
- 1 core with Neon™ extensions (for example SIMD, dual precision FPU)
- 2 Cortex®‑M4 multipurpose accelerators running at up to 200 MHz, both in lockstep configuration
- 4 eDMA engines in lockstep configuration
- Ethernet switch: L2+ Ethernet switch with 2× 1 GB ports, 2× MACSEC, QoS, AVB, and TSN
- 4 × 32-bit Cortex®‑R52+ cores (2 of them with checker cores, and 2 in split-lock configuration):
- 存储器
- xMemory: up to 31 MB extensible on-chip nonvolatile memory (NVM) depending on ordered part number:
- PCM (phase-change memory) as nonvolatile memory
- Up to 30 MB code NVM, with A/B swap OTA mechanism (up to 2× 15 MB)
- 1024 KB HSM-dedicated code NVM, with A/B swap OTA mechanism (2× 512 KB)
- 384 KB data NVM (256 KB + 128 KB dedicated to HSM)
- Up to 3840 KB on-chip general-purpose SRAM
- xMemory: up to 31 MB extensible on-chip nonvolatile memory (NVM) depending on ordered part number:
- Security: 2nd generation hardware security module
- Cybersecurity: ISO/SAE 21434 compliance (refer to the cybersecurity reference manual for details)
- On-chip high-performance security module with full support for e-safety vehicle intrusion protected applications (EVITA)
- Symmetric and asymmetric cryptography processor
- High-performance lock-stepped AES-light security subsystem for fast ASIL-D cryptographic services
- Two MACsec accelerators integrated on each Ethernet link
- Safety: comprehensive new-generation ASIL-D safety concept
- New state-of-the-art safety measures at all levels of the architecture for most efficient implementation of ISO 26262 ASIL-D functionalities
- Complete hardware virtualization architecture built on Cortex®‑R52+ new privilege mode (best-in-class software isolation, real-time support for multiple virtual machines/applications)
- Device standby/low-power modes
- Versatile low-power modes
- Ultra-low power: standby mode for lowest quiescent current with optimized active subsystem (for example standby RAM) and wake-up capability
- Smart low-power: smart power mode with Cortex®‑M4 subsystem, extended communications interfaces, and ADC peripheral
- Peripheral, I/O, and communication interfaces
- 24 LINFlexD modules
- 1 dual-channel FlexRay controller
- 10 queued serial peripheral interface (SPIQ) modules
- 2 DSPI with shifted PWM serialization support for lighting applications
- 6 I²C interfaces
- Enhanced audio support that enables audio over Ethernet:
- Ethernet controller with AVB support
- Medial clock recovery with integrated audio PLL
- Two integrated interchip sound (I²S)/time-division multiplexed (TDM) interfaces
- Integrated sample rate converters (6 channels on each I²S interface)
- 2 SENT modules (4 channels each)
- 2 PSI5 modules (2 channels each)
- 1 peripheral component interconnect express (PCIe) Gen2 controller
- Gen2 PHY: Gen1 (2.5 GT/s), Gen2 (5.0 GT/s)
- Gen3 MAC
- 2 lanes
- Configurable controller with one or two lanes
- Enhanced analog-to-digital converter system with:
- 4 separate 12-bit SAR analog converters (including one supervisor/safety ADC).
- 1× 9-bit SAR analog converter for device standby/low-power mode
- Advanced timed I/O capability:
- Generic timer module (GTM4184)
- Communication interfaces:
- Two 10/100/1000 Mbit/s Ethernet controllers compliant with IEEE 802.3-2008: IPv4 and IPv6 checksum modules, AVB, VLAN, and EMC optimized SGMII
- Two 10 Mbit/s Ethernet controllers compliant with 10BASE-T1S and the OPEN Alliance 3-pin (OA3p) interface
- 15 modular controller area network (MCAN) modules, and 1 time-triggered controller area network (M_TTCAN), all supporting flexible data rate (ISO CAN FD®)
- 2 CAN XL® interfaces
- External memory interfaces
- 2 octo-SPI IPs to support HyperBus™ memory (flash/RAM) devices
- 1 SDMMC interface
- Highlights
EDA符号、封装和3D模型
意法半导体 - SR6G6C6
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| SR6G6C6A0xx | 建议 | FPBGA 476 21.3X21.3X1.8 | 工业 | - | |
SR6G6C6A0xx
Package:
FPBGA 476 21.3X21.3X1.8Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
Don't show this again
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | CPU Clock Frequency (MHz) (max) | Flash Size (kB) (Data) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||||
| SR6G6C6A0xx | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
|
| |||||||||||
SR6G6C6A0xx 建议
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):
Don't show this again