SR5E1E7

批量生产
Design Win Education Education

SR5 E1系列Stellar电气化MCU,32位Arm Cortex-M7汽车MCU双内核,2 MB Flash,丰富的模拟功能,高分辨率定时器,支持HSM,符合ASIL-D标准

下载数据手册 Order Direct

产品概述

描述

The SR5E1E3, SR5E1E5, SR5E1E7 MCU family has been designed to meet the enhanced digital control and high-performance analog requirements requested by the new wide bandgap power technologies, silicon carbide and GAN, from power conversion applications such as on-board charger and DC/DC converters as well as advanced motor control like traction inverter applications.

SR5E1E3, SR5E1E5, SR5E1E7 also offer superior real-time and safe performance with the highest ASIL-D capability, security cryptographic services (HSM) and high efficiency OTA reprogramming capability.

  • 所有功能

      • AEC-Q100 automotive qualified
      • SR5 high-performance analog MCUs offering:
        • Digital and analog high-frequency control requested by new wide-bandgap technologies (silicon carbide and gallium nitride)
        • Superior real-time and functional safety performance (ASIL-D capability)
        • Built-in fast and cost-optimized OTA (over-the-air) reprogramming capability (with built-in dual-image storage)
        • High-speed security cryptographic services (HSM)
    • Cores
      • 2× 32-bit Arm® Cortex®‑M7 with double-precision FPU, L1 cache and DSP instructions running at up to 300 MHz to reach 1284 DMIPS/2.14 DMIPS/MHz/core (Dhrystone 2.1)
        • Split-lock configuration, allowing either 2 cores in parallel or 1 core in lockstep configuration
      • 2 DMA engines in lockstep configuration
    • 存储器
      • Up to 2 MB on-chip flash memory with read while write support
        • 1920 KB code flash memory split in two banks allowing 960 KB OTA reprogramming
        • 160 KB HSM dedicated code flash memory
      • 96 KB data flash memory (64 KB + 32 KB dedicated to HSM)
      • 488 KB on-chip general-purpose SRAM:
        • 2× 32 KB instruction TCM + 2× 64 KB data TCM
        • 256 KB system RAM
        • 40 KB HSM dedicated system RAM
    • Security: hardware security module (HSM)
      • Cybersecurity ISO/SAE 21434 compliance (refer to the cybersecurity reference manual for details)
      • On-chip high-performance security module with EVITA medium support with dedicated RAM and flash memory
      • Based on a Cortex®‑M0+ core running at up to 150 MHz
      • Hardware accelerator for symmetric cryptography
    • Safety: comprehensive new generation ASIL-D safety concept
      • State of the art safety measures at all level of the architecture for most efficient implementation of ISO26262 ASIL-D functionalities
      • FCCU for collection and reaction to failure notifications with enhanced configurability
      • Memory error management unit (MEMU) for collection and reporting of error events in memories
      • Cyclic redundancy check (CRC) unit
    • Enhanced peripherals for fast control loop capability
      • 12 timers:
        • 2× HRTIM (high-resolution and complex waveform builder) in total: 12× 16-bit counters, up to 102 ps resolution, 24 PWM
        • 2× 16-bit 6-channel advanced control timers in total, with up to 12× PWM
        • 2× 32-bit general purpose timers in total, with up to 8× IC/OC/PWM or pulse counter and quadrature encoder input
        • 4× 16-bit general purpose timers in total, with up to 11× PWM, 2 of which paired
        • 2× 16-bit basic timers
      • Enhanced analog-to-digital converter system with:
        • 5 separate 12-bit SAR analog converters, 8 channels each. Sampling rate up to 2.5 MSPS in single mode, 5 MSPS in dual mode
        • 2 separate 16-bit sigma-delta analog converters
      • 12-bit digital-to-analog converters (DAC)
        • 2 buffered external channels 1 MSPS
        • 8 unbuffered internal channels 15 MSPS
      • 8 rail-to-rail analog comparators, 50 ns propagation delay
      • Hardware accelerator
        • 1× CORDIC for trigonometric functions acceleration
    • Communication interfaces
      • 4 modular controller area network (MCAN) modules, all supporting flexible data rate (ISO CAN-FD)
      • 3 UART modules with LIN functionality
      • 4 serial peripheral interface (SPI) modules, 2 multiplexed with I²S interfaces
      • 2 I²C modules
    • Advanced debug and trace for high-performance automotive application development
      • Built around Arm® CoreSight™-600
      • Debug interface: Arm® CoreSight™ JTAG (IEEE 1149.1) or SWD
      • 4 KB embedded trace FIFO for both on- and off-chip tracing
      • Trace port for off-chip tracing: parallel trace port configurable from 1 to 8 data lines
    • Others
      • Power efficiency management, through separate power modes for any selected cores, peripherals or memories
      • Boot assist flash (BAF) supports factory programming using a serial loader through CAN or UART
      • Junction temperature range -40 °C to 150 °C
      • Integrated power supply scheme:
        • Integrated internal SMPS regulator
        • 3.3 V supply & GPIOs

您可能还会喜欢...

EDA符号、封装和3D模型

意法半导体 - SR5E1E7

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 材料声明**
SR5E1E770C30F00X
批量生产
LQFP 176 24x24x1.4 Automotive Safety Cybersecurity Ecopack2
SR5E1E770C30F00Y
批量生产
LQFP 176 24x24x1.4 Automotive Safety Cybersecurity Ecopack2
SR5E1E770C30F01X
批量生产
LQFP 176 24x24x1.4 Automotive Safety Cybersecurity Ecopack2

SR5E1E770C30F00X

Package:

LQFP 176 24x24x1.4

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LQFP 176 24x24x1.4

Grade

Automotive Safety Cybersecurity

RoHS Compliance Grade

Ecopack2

SR5E1E770C30F00Y

Package:

LQFP 176 24x24x1.4

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LQFP 176 24x24x1.4

Grade

Automotive Safety Cybersecurity

RoHS Compliance Grade

Ecopack2

SR5E1E770C30F01X

Package:

LQFP 176 24x24x1.4

Material Declaration**:

Marketing Status

批量生产

Package

LQFP 176 24x24x1.4

Grade

Automotive Safety Cybersecurity

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

Swipe or click the button to explore more details Don't show this again
产品型号
供货状态
Budgetary Price (US$)*/Qty
从ST订购
Order from distributors
包装类型
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Operating temperature (°C)
CPU Clock Frequency (MHz) (max)
Flash Size (kB) (Data)
最小值
最大值
SR5E1E770C30F00X
Available at distributors

经销商的可用性 SR5E1E770C30F00X

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

SR5E1E770C30F00Y
Available at distributors

经销商的可用性 SR5E1E770C30F00Y

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

SR5E1E770C30F01X
Available at distributors

经销商的可用性 SR5E1E770C30F01X

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

SR5E1E770C30F00X 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

SR5E1E770C30F00X

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

300

Flash Size (kB) (Data):

-

代理商名称

代理商库存报告日期:

SR5E1E770C30F00Y 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

SR5E1E770C30F00Y

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

300

Flash Size (kB) (Data):

-

代理商名称

代理商库存报告日期:

SR5E1E770C30F01X 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

SR5E1E770C30F01X

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

300

Flash Size (kB) (Data):

-

代理商名称

代理商库存报告日期:

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商