产品概述
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所有功能
- AEC-Q100 qualified
- High performance e200z420
- 32-bit Power Architecture technology CPU
- Core frequency as high as 120 MHz
- Variable Length Encoding (VLE)
- 2112 KB (2048 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
- 176 KB HSM dedicated flash memory (144 KB code + 32 KB data)
- 128 KB on-chip general-purpose SRAM (in addition to 64 KB core local data RAM
- Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
- Multi-channel direct memory access controller (eDMA) with 64 channels
- 1 interrupt controller (INTC)
- Comprehensive new generation ASIL-B safety concept
- ASIL-B of ISO 26262
- FCCU for collection and reaction to failure notifications
- Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
- Cyclic redundancy check (CRC) unit
- Enhanced low power support
- Ultra low power STANDBY
- Smart Wake-up Unit
- Fast wake-up and execute from RAM
- Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution
- Body cross triggering unit (BCTU)
- Triggers ADC conversions from any eMIOS channel
- Triggers ADC conversions from up to 2 dedicated PIT_RTIs
- Enhanced analog-to-digital converter system with:
- 2 independent fast 12-bit SAR analog converters
- 1 supervisor 12-bit SAR analog converter
- 1 10-bit SAR analog converter with STDBY mode support
- Communication interfaces
- 1 Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
- 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
- 14 LINFlexD modules
- 7 Deserial Serial Peripheral Interface (DSPI) modules
- Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
- Nexus Development Interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
- Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
- Junction temperature range -40 °C to 150 °C
EDA符号、封装和3D模型
质量与可靠性
产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | 材料声明** |
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SPC584B60E3BDC0X | 批量生产 | TQFP 100 14x14x1.0 | Automotive Safety | Ecopack2 | |
SPC584B60E3MHC0X | 批量生产 | TQFP 100 14x14x1.0 | Automotive Safety | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | CPU Clock Frequency (MHz) (max) | Features set | Flash Size (kB) (Data) | ||
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最小值 | 最大值 | ||||||||||||||||
SPC584B60E3BDC0X | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
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SPC584B60E3MHC0X | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
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SPC584B60E3BDC0X 批量生产
SPC584B60E3MHC0X 批量生产