SPC570S40E1
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用于汽车底盘和安全应用的32位Power Architecture MCU

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Product overview

描述

The SPC570Sx is a family of next generation microcontrollers built on the Power Architecture embedded category.

The SPC570Sx family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of Chassis and Safety electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 80 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

  • All features

    • AEC-Q100 qualified
    • High performance e200z0h dual core
      • 32-bit Power Architecture technology CPU
      • Core frequency as high as 80 MHz
      • Single issue 4-stage pipeline in-order execution core
      • Variable Length Encoding (VLE)
    • Up to 544 KB (512 KB code + 32 KB data, suitable for EEPROM emulation) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • Up to 48 KB on-chip general-purpose SRAM
    • Multi-channel direct memory access controller (eDMA paired in lockstep) with 16 channels
    • Comprehensive new generation ASILD safety concept
      • Safety of bus masters (core+INTC, DMA) by delayed lockstep approach
      • Safety of storage (Flash, SRAM) by mainly ECC
      • Safety of the data path to storage and periphery by mainly End-to-End EDC (E2E EDC)
      • Clock and power, generation and distribution, supervised by dedicated monitors
      • Fault Collection and Control Unit (FCCU) for collection and reaction to failure notifications
      • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
      • Boot time MBIST and LBIST for latent faults
      • Check of safety mechanisms availability and error reaction path functionality by dedicated mechanisms
      • Safety of the periphery by application-level measures supported by replicated peripheral bridges and by LBIST
      • Further measures on dedicated peripherals (e.g. ADC supervisor)
      • Junction temperature sensor
      • 8-region system memory protection unit (SMPU) with process ID support (tasks isolation)
      • Enhanced SW watchdog
      • Cyclic redundancy check (CRC) unit
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus Class 3 debug and trace interface
    • Communication interfaces
      • 2 LINFlexD modules, 3 deserial serial peripheral interface (DSPI) modules, and Up to 2 FlexCAN interfaces with 32 message buffers each
    • On-chip CAN/UART Bootstrap loader with Boot Assisted Flash (BAF). Physical Interface (PHY) can be
      • UART and CAN
    • 2 enhanced 12-bit SAR analog converters
      • 1.5 μs conversion time (12 MHz)
      • 16 physical channels (fully shared between the 2 SARADC units)
      • Supervisor ADC concept
      • Programmable Cross Triggering Unit (CTU)
    • Single 3.3 V or 5 V voltage supply
    • 4 general purpose eTimer units (6 channels each)
    • Junction temperature range -40 °C to 150 °C (165 °C grade optional)

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STMicroelectronics - SPC570S40E1

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Quality and Reliability

Part Number Marketing Status Package Grade 符合RoHS级别 Longevity Commitment Longevity Starting Date Material Declaration**
SPC570S40E1CEFAR
Active
TQFP-EP 64 10X10X1.0 MM Automotive Safety Ecopack2 15 2015-10-01T00:00:00.000+02:00
SPC570S40E1CEFAY
Active
TQFP-EP 64 10X10X1.0 MM Automotive Safety Ecopack2 15 2015-10-01T00:00:00.000+02:00

SPC570S40E1CEFAR

Package:

TQFP-EP 64 10X10X1.0 MM

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP-EP 64 10X10X1.0 MM

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

SPC570S40E1CEFAY

Package:

TQFP-EP 64 10X10X1.0 MM

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP-EP 64 10X10X1.0 MM

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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SPC570S40E1CEFAR

经销商的可用性 SPC570S40E1CEFAR

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经销商的可用性 SPC570S40E1CEFAY

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Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

SPC570S40E1CEFAR

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

80

Features set:

ASILD/SIL3,Motor Control

Flash Size (kB) (Data):

32

代理商名称

代理商库存报告日期:

SPC570S40E1CEFAY Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

SPC570S40E1CEFAY

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

80

Features set:

ASILD/SIL3,Motor Control

Flash Size (kB) (Data):

32

代理商名称

代理商库存报告日期:

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商