STA1385

批量生产
Design Win

Telemaco3P automotive family of telematics and connectivity microprocessor

下载数据摘要

产品概述

描述

STA1385 is a fully automotive, power efficient System-On-Chip, targeting cost effective processing solutions for innovative Telematics and Connectivity applications including Cyber-security protection.

It features a powerful Dual ARM Cortex-A7 processor, an embedded and independent Hardware Security Module (HSM), an isolated sub-system based on ARM Cortex-M3 for vehicle CAN interface and a full set of standard connectivity interfaces, including a dual Gbit ETH AVB controller and Flexray.

  • 所有功能

    • AEC-Q100 qualified Grade 2 Core and Infrastructure
    • Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support
    • Memory organization:Embedded Vehicle Interface
      • L1 Cache: 32 KB I, 32 KB D
      • L2 Cache: 256 KB
      • Total embedded SRAM: 768 KB
    • Isolated Cortex-M3 core
      • L1 Cache: 8 KB I
    • 256 KB reserved embedded SRAM (extendible to 768 KB)
    • 1x CAN Standard (C_CAN)
    • 2x CAN FD (M_CAN)
    • 1x Flexray
    • 1x SD/MMC/SDIO SDR50 (SD/MMC0)
    • 1x SD/MMC/SDIO SDR25 (SD/MMC1)
    • 1x USB 2.0 DR with HS PHY and HSIC
    • 1x USB 2.0 DR with HS PHY
    • 2x ETH AVB MAC with RMII/RGMII
    • HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)
    • Cryptographic Functions Accelerators
      • Symmetric keys: MP AES
      • Public keys: RSA, ECC
      • Hash: MD5, SHA1, SHA2
    • True Random Number Generator
    • User pogrammable OTP memory (eHSM OTP)
    • 16-bit DDR3L-1066 (533 MHz)
    • 16-bit LPDDR2-800 (400 MHz)
    • SQI Interface
    • 8-bit Parallel NAND (1 chip select)
    • 1x 6-channel 10-bits ADC
    • 3x I2C multi-master/slave interfaces
    • 6x UART controller
    • 3xI2S audio interfaces
    • 3x Synchronous Serial Port (SSP/SPI)
    • 5x 32-bit GPIO ports
    • JTAG based in-circuit emulator (ICE) with Embedded Trace Module
    • VDD, VDD_ARM: 1.14 V-1.21 V
    • VDD_IO_3V3: 3.3 V ±10%
    • VDD_IO_SDMMC0: 1.8 V-3.3 V ±10%
    • VDD_IO_BOOT: 1.8 V/3.3 V ±10%
    • VDD_IO_ON: 3.3 V ± 10%
    • VDDQ: 1.35 V ± 5% (DDR3L)
    • Junction temperature range: -40 C/ +150 C

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EDA符号、封装和3D模型

STMicroelectronics - STA1385

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封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 材料声明**
STA1385EOAS2
批量生产
LFBGA 361 16x16x1.7 汽车应用 Ecopack2
STA1385EOAS2TR
批量生产
LFBGA 361 16x16x1.7 汽车应用 Ecopack2

STA1385EOAS2

Package:

LFBGA 361 16x16x1.7

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LFBGA 361 16x16x1.7

Grade

Automotive

RoHS Compliance Grade

Ecopack2

STA1385EOAS2TR

Package:

LFBGA 361 16x16x1.7

Material Declaration**:

Marketing Status

批量生产

Package

LFBGA 361 16x16x1.7

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
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包装类型
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Country of Origin
ECCN (US)
ECCN (EU)
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最小值
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STA1385EOAS2TR
Available at distributors

经销商的可用性 STA1385EOAS2TR

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STA1385EOAS2
Available at distributors

经销商的可用性 STA1385EOAS2

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地区 库存 最小订购量 第三方链接

代理商库存报告日期:

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STA1385EOAS2TR 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STA1385EOAS2TR

Operating Temperature (°C)

Min:

Max:

STA1385EOAS2 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STA1385EOAS2

Operating Temperature (°C)

Min:

Max:

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商