Combining the intrinsic features of ST's 3rd-generation STPOWER SiC technology with the high thermal performance of the top side cooling package, the SCT055HU65G3AG is ideal for OBC and DC/DC converters in electric vehicle applications, and power conversion for industrial.
The SCT055HU65G3AG features a very low RDS(on) over the entire temperature range combined with low capacitance and very high switching operations, which improve application performance in frequency, energy efficiency, system size and weight reduction. Furthermore, the advanced surface mounted (SMD) HU3PAK package with top side cooling allows a smaller form factor, higher design flexibility and better thermal performance while increasing the power density.
Thanks to the additional Kelvin-source pin, designers can achieve better efficiency due to reduced turn-on/off switching losses.
For more info on the HU3PAK package, visit the page Top-side cooling SMD packages for automotive applications.