产品概要
描述
该器件采用“基岛”布局的平面工艺制造。由此产生的晶体管显示出非常高的增益性能和非常低的饱和电压。
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All features
- 卷带式表面贴装TO-252功率封装
- 与NPN型MJD31CT4互补
EDA Symbols, Footprints and 3D Models
STMicroelectronics - MJD32CT4
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
SPICE models (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 05 Jul 2024 | 05 Jul 2024 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| MJD32CT4 | Active 产品已量产 | DPAK | Industrial | Ecopack2 | 10 | 2024-06-10T00:00:00.000+02:00 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| MJD32CT4 | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
MJD32CT4 Active
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
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