产品概述
描述
This power module features a fourpack topology in an ACEPACK 1 module with NTC and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics which are represented by the gen.2 technology. This modular solution can be used to realize complex topologies characterized by very high power density in order to meet the higest efficiency requirements.
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所有功能
- ACEPACK 1 power module:
- DBC Cu-Al2O3-Cu based
- Insulation voltage UL certified of 2.5 kVrms
- Press-fit contact pins
- Fourpack topology:
- 1200 V SiC MOSFET
- RDS(on) typical 25 mΩ
- Very high-power density
- Very low switching energies
- Switching characteristic almost independent from temperature
- Integrated NTC temperature sensor
- ACEPACK 1 power module:
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Power Supply Design Tool
LED Lighting Design Tool
Digital Power Workbench
Power Tree Designer
AC Switches Simulator
Rectifier Diodes Simulator
STPOWER Studio
Twister Sim
TVS Simulator
Estimate
Active Filters
Comparators
Low side Current Sensing
High side Current Sensing
NFC Inductance
UHF Link Budget
NFC Tuning Circuit
EDA符号、封装和3D模型
样片和购买
产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
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A1F25M12W2-F1 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
A1F25M12W2-F1 NRND