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LIS3DH

批量生产
Design Win

3轴MEMS加速度计,超低功耗,±2g/±4g/±8g/±16g满量程,高速I2C/SPI数字输出,内置FIFO和高性能加速度传感器,LLGA 16 3x3x1.0封装

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产品概述

描述

The LIS3DH is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output. The device features ultra-low-power operational modes that allow advanced power saving and smart embedded functions.

The LIS3DH has dynamically user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1 Hz to 5.3 kHz. The self-test capability allows the user to check the functioning of the sensor in the final application. The device may be configured to generate interrupt signals using two independent inertial wake-up/free-fall events as well as by the position of the device itself. Thresholds and timing of interrupt generators are programmable by the end user on the fly. The LIS3DH has an integrated 32-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor. The LIS3DH is available in small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

  • 所有功能

    • Wide supply voltage, 1.71 V to 3.6 V
    • Independent IO supply (1.8 V) and supply voltage compatible
    • Ultra-low-power mode consumption down to 2 μA
    • ±2g/±4g/±8g/±16g dynamically selectable full scale
    • I2C/SPI digital output interface
    • 16-bit data output
    • 2 independent programmable interrupt generators for free-fall and motion detection
    • 6D/4D orientation detection
    • Free-fall detection
    • Motion detection
    • Embedded temperature sensor
    • Embedded self-test
    • Embedded 32 levels of 16-bit data output FIFO
    • 10000 g high shock survivability
    • ECOPACK®, RoHS and “Green” compliant

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EDA符号、封装和3D模型

意法半导体 - LIS3DH

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
LIS3DHTR
批量生产
LGA 16L 3.0x3.0x1 mm Ecopack2 - -

LIS3DHTR

Package:

LGA 16L 3.0x3.0x1 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LGA 16L 3.0x3.0x1 mm

RoHS Compliance Grade

Ecopack2

Longevity Commitment

-

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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LIS3DHTR
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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商