VB1943 | 产品 - 意法半导体

概述

开始

Partner products

銷售公文包

Product overview

Key Benefits

无缝彩色与红外成像

借助意法半导体片上RGB-IR分离与智能升级技术简化设计并降低成本，无需额外元件即可输出500万像素级清晰的彩色与红外图像。

双全局与卷帘快门

凭借惊艳的片上HDR技术，能够捕捉完美而生动的图像，兼具无伪影的纯净画质、卓越的动态范围与优化的感光能力。

简化计算机视觉开发

强大的片上处理能力与MIPI CSI-2输出接口可简化系统集成并降低功耗，为嵌入式视觉应用提供卓越的图像质量。

描述

The VB1943 and VD1943 are 5.1 megapixel, 2.25 µm global, and rolling shutter image sensors. They are designed for a wide spectrum of applications that require capturing color and NIR images. Operation of these sensors combines global and rolling shutter technology with an extended dynamic range.

VB1943, VB5943: Webpage illustration .png

Leveraging from preeminent 3D stacking and ST patented processes, these sensors perform outstandingly in the NIR (940 nm) and visible region. In global shutter mode, they can capture up to 100 frames per second in a 2560 x 1984 resolution format.

The VB1943 and VD1943 sensors can be used in rolling shutter mode, taking advantage of low dark noise capability. They can operate in an 18-bit HDR mode compressed down to 12 or 10 bits through a customizable PWL.

The RGB-NIR input image is processed by the integrated advanced ISP. It can reconstruct a full resolution NIR smart upscaled monochrome image or a 2x2 color Bayer image NIR depolluted.

For computer vision applications, acquisition can be switched to global shutter mode with an NIR light source. Switching to global shutter mode with an external NIR light source greatly reduces the system power consumption that is required to drive the illumination.

All features
Resolution: 5.1 megapixel sensor (2560 x 1984)

Chroma: RGB-NIR, NIR or Bayer

Optical format: 1/2.5 inch

Image array size: 5.8 mm x 4.5 mm

Pixel technology:

3D stacked sensor with 2.25 μm x 2.25 μm BSI pixel size

Global and rolling shutter technology

Functions:

Dual and single exposure modes with separated controls of RGB pixels and NIR pixels

Automatic/external synchronization mode

Independent horizontal and vertical image flip

Automatic dark calibration

Dynamic defective pixel correction

Integrated noise reduction feature
Advanced image processing:

Embedded 18-bit high dynamic range pixel reconstruction

Embedded Bayer reconstruction with NIR depollution

Embedded NIR smart upscale to full resolution monochrome output

Four programmable contexts with versatile sequencing management

Frame rates:

Up to 100 frames per second at full resolution in global shutter mode

Up to 50 frames per second at full resolution in rolling shutter mode

Interfaces:

MIPI CSI-2 interface (dual/quad lanes, max. 1.5 Gbps/lane)

MIPI CCI control interface up to 1 MHz

4 programmable GPIOs (general-purpose input/output) to control external illuminators:Output is synchronized with sensor integration periodsPWM (pulse-width modulation) control

Additional features: Integrated temperature sensor

Package options:

Available as bare die

Available in OBGA package

OBGA package:

Package size: 10.3 x 8.9 mm

Ball matrix: 10 x 9 balls, pitch 0.8 mm
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