产品概要
描述
The STPOWER Studio is an online electro-thermal simulation software dedicated to a growing number of STPOWER devices, which is now integrated into the eDesignSuite tool.
The software provides comprehensive power and thermal analysis. It predicts the device performance shortening the design cycle and saving time and resources. Furthermore, the tool helps users to select the best device fitting a specific application mission profile.
STPOWER Studio is based on a very precise built-in electrical and thermal model for each device considering the self-heating effects. It provides a very accurate estimation of power losses as well as junction and case temperatures.
-
性能一览
- Comprehensive power and thermal analysis
- Intuitive and user-friendly interface with grouped device controls
- Very fast computational calculation
- Product selection by family
- Selection of simulation times with very long mission profile duration
- Several thermal set-up input conditions
- Simulation with or without heat sink allowing the user-defined heat sink parameters
- Several PWM modulation techniques
- Self-heating algorithm for temperature estimation
- Additional graphs for power loss analysis vs current load and switching frequency
- Output data for each power device
- Heat sink size estimation enabled (Rth)
- Exportable report and data table files
- Projects stored in user area
- Web connectivity to product resources
- Multilanguage (English, Chinese, Japanese)
- Mini site for user manual (English)
获取软件
| Part Number | 一般描述 | ECCN (EU) | ECCN (US) | 最新版本 | 供应商 | 下载 |
|---|---|---|---|---|---|---|
| EDS-POWERSTUDIO | STPOWER Studio, part of eDesignSuite: dynamic electro-thermal simulation software for STPOWER devices | NEC | EAR99 | ST | Go to site |
特别推荐
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 4.0 | 16 Oct 2023 | 16 Oct 2023 |
简报 (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 18 Oct 2023 | 18 Oct 2023 |
宣传册 (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 15 Jul 2024 | 15 Jul 2024 |
License Agreement (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.6 | 12 Feb 2018 | 12 Feb 2018 |