i3 Product Development exists to help clients solve their biggest innovation challenges at any step in the product development process. For clients struggling to bring their next idea to life, i3 is a premium partner that can transform concepts to reality at rapid speed through engineering and design.
Their state-of-the-art facilities house prototyping capabilities, including advanced CNC machining, precision painting, 3D printing, and sheet metal fabrication. In addition, their electronics lab and strategic partnerships with nearby contract manufacturers facilitate rapid prototyping of PCB assemblies with remarkable efficiency.
i3's multidisciplinary team of industry experts collaborates across diverse product categories, guiding clients from initial concept to ongoing support.
With almost 30 years of experience in new product development, i3 was founded in 1995. They have worked on over 4,000 projects spanning diverse industries, including medical, industrial, agriculture, consumer goods, food service, and sports & fitness.
With roots in mechanical engineering and industrial design, i3 has broadened its capabilities to include electrical engineering, UX/UI design, and software engineering. They developed Cygnus, a software support product utilizing Bluetooth technology to enable real-time customer assistance through video and chat functionalities.
In 2023, i3 was acquired by Helios Technologies. This strategic partnership aims to utilize i3's custom solutions and support offerings to expand Helios's reach into new end markets.
Services offered by i3 Product Development
Powered by Helios and their manufacturing support capabilities, i3’s teams act as an extension of their clients' capabilities. Their ability to start at any stage in the product development process gives i3 the edge to i3 providing engineering design services for companies large and small, their offerings include:
Electrical Engineering
- Electrical system architecture
- Schematic capture
- Printed Circuit Board layout
- Low power design
- High power design
- Motor control and power management
Mechanical Engineering
- Mechanical design
- Analytical engineering
- Solid & surface modeling
- Plastic design
- DFMA
Embedded Software & Firmware Development
- Embedded systems architecture
- Bare metal or RTOS development
- Embedded Linux development and drivers
- IoT and cloud connectivity
Software Development
- Android & iOS apps
- Cloud architecture
- Front-end & back-end development
- Software quality assurance (SQA) testing
UX/UI Design
- Wireframing & design
- Usability testing
- Interactive prototyping
Rapid Prototyping
- 3D printing
- Cast urethane
- Metal fabrication
- CNC machining
- Painting & finishing
i3 Product Development in STMicroelectronics ecosystem
i3 Product Development’s extensive experience with ST’s microcontrollers & microprocessors allows them to create cutting edge embedded systems and products, maximizing what is important to you, whether that be battery-optimized low power design or feature-rich user-interfaces on connected devices.
产品和服务范围:
• Design Services
公司总部地址:
1869 Haynes Drive, Sun Prairie, Wisconsin, United States
公司主要联系人:
Chris Sherwin
公司网站:
www.i3pd.com
合作伙伴产品 | 描述 | 相关意法半导体产品 |
---|---|---|
i3 Product Development design services | Experts in design and engineering from conception to production | STM32 High Performance MCUs STM32 Arm Cortex MPUs |
法律免责声明
除了本网站所载的使用条款、意法半导体销售条款和条件以及隐私政策,以下条款和条件适用于所有意法半导体合作伙伴计划。
尽管意法半导体已经尝试在网站上提供准确的信息,但意法半导体对信息的准确性不承担任何责任。意法半导体在本网站提供的所有信息均按“原样”提供,并包括所有错误,且无任何形式的保证,无论是明示的、默示的还是法定的。意法半导体可能随时更改或停止其合作伙伴计划或其产品或服务,恕不另行通知。对于非意法半导体产品或服务的任何提述仅供参考,不构成意法半导体的认可。在本网站上使用“合作伙伴”一词不表示或暗示意法半导体与任何其他公司之间存在任何合作伙伴关系或代理关系或任何法律或信托关系,或该公司是意法半导体的任何形式的关联公司。意法半导体合作伙伴计划的合作伙伴提供单独的许可,用于购买或使用其产品和/或服务以及与意法半导体设备相关的技术。请直接与适当的合作伙伴联系以获得许可条款、价格、支持和关于该合作伙伴的产品和/或服务的任何其他信息。这些产品和/或服务的条款和条件可能因合作伙伴而异,并可直接由该合作伙伴单独许可。意法半导体不对合作伙伴提供的产品和服务的适用性做出任何声明或保证,因此意法半导体特此明确拒绝合作伙伴提供的任何产品或服务的所有保证和条件,无论是明示的、默示的还是法定的,包括但不限于适销性、适用于特定目的、所有权、不侵权或因交易过程、使用或行业实践所产生的任何保证和条件。在任何情况下,意法半导体都不承担任何类型的直接、间接、附带、特殊、典型、后果性或惩罚性损害赔偿或其他损害赔偿,无论何种原因造成,包括但不限于使用损失、利润损失或收入损失,无论是基于合同责任理论、严格责任或侵权行为(包括疏忽或其他过失)提出的还是以何种方式产生的,或是与您参与或依赖合作伙伴计划,您使用或无法使用或购买合作伙伴的产品和/或服务,或产品和/或服务的性能,您与合作伙伴的关系,您使用或无法使用或依赖意法半导体门户网站或意法半导体在该门户网站上提供的任何信息有关的,即使意法半导体已被告知这些损害的可能性。与第三方网站的链接,如果由意法半导体提供,不受意法半导体的控制,意法半导体对链接网站的任何内容、材料、意见、建议或陈述或任何此类内容和材料的准确性或可靠性,以及链接网站中包含的任何链接,或对这些站点的任何更改或更新概不负责。意法半导体对从任何链接网站接收到的任何形式的传输概不负责,包括但不限于网络广播或音频传输。访问任何链接网站或链接网站中包含的任何链接的风险由用户自己承担。意法半导体提供这些链接只是为了方便,包含任何链接并不意味着意法半导体对第三方网站的任何保证(默示、明示或其他)或任何认可。
You’re now leaving st.com and will be re-directed to our Partner’s website.
For the latest innovations and solutions from ST, sign up for our newsletters.