STM32MP211C

批量生产
Design Win

MPU with Arm Cortex-A35 @ 1.2GHz, Cortex-M33 @ 300MHz, 1xEthernet, Secure Boot, Cryptography, DRAM enc/dec, PKA

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产品概述

主要优势

Mainlined OpenSTLinux Distribution

One OpenSTLinux Software compatible with STM32MPU Family. OpenSTLinux expansion packages can be applied on the top to enable the use of additional components.

支持DDR3L带来市场优势

除了支持DDR4/LPDDR4,STM32MP2系列还增加了对DDR3L存储器的支持,帮助您从容应对自2025年中出现的DDR4/LPDDR4短缺与价格飙升,确保产品定价的竞争力与供应链的安全。

描述

STM32MP21xC/F devices are based on the high-performance core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache, and a 128-Kbyte L2 cache. The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency.

STM32MP21xC/F devices also embed a Cortex®-M33 32-bit RISC core operating at up to 300 MHz frequency. The Cortex®-M33 core features a floating-point unit (FPU) single precision which supports Arm® single-precision data-processing instructions, and data types. The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security.

STM32MP21xC/F devices provide an external SDRAM interface supporting external memories up to 4 Gbytes, 16‑bit DDR3L up to 800 MHz, 16‑bit LPDDR4, or DDR4 up to 800 MHz. The SDRAM content can be encrypted with AES-128 or AES-256 with SCA protection.

The devices incorporate high-speed embedded memories: 456 Kbytes of internal SRAM (including 256-Kbyte AXI SYSRAM), one bank of 64 Kbytes of AHB SRAM, 128 Kbytes of AHB SRAM in backup domain, and 8 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix, and a 128/64-bit multilayer AXI interconnect supporting access to internal and external memories.

Each device offers two ADCs, a low-power secure RTC, 12 general-purpose 16-bit timers, four general-purpose 32‑bit timers, two PWM timers for motor control, five low-power timers, two true random number generator (RNG), two cryptographic acceleration cells and secure AES coprocessor with side channel attack (SCA) protection.

The devices support four multifunction digital filters (MDF)

  • 所有功能

    • Includes ST state-of-the-art patented technology.
    • Cores
      • 64-bit single-core Arm® Cortex®-A35
        • Up to 1.5 GHz
        • 32-Kbyte I + 32-Kbyte D level 1 cache for each core
        • 128-Kbyte level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M33 with FPU/MPU
        • Up to 300 MHz
        • L1 16-Kbyte I / 16-Kbyte D
        • Arm® TrustZone®
    • 存储器
      • External DDR memory up to 4 Gbytes
        • DDR3L-1600 16-bit
        • DDR4-1600 16-bit
        • LPDDR4-1600 16-bit
      • 456-Kbyte internal SRAM: 256-Kbyte AXI SYSRAM, 64-Kbyte AHB SRAM, 128-Kbyte AHB SRAM with ECC in backup domain, 8-Kbyte SRAM with ECC in backup domain
      • One Octo-SPI memory interfaces
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs, and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper, environmental monitors, display secure layer, hardware accelerators
      • Complete resource isolation framework
    • Reset and power management
      • 1.71 to 1.95 V and 2.7/3.0 to 3.6 V multiple section I/O supply
      • POR, PDR, PVD, and BOR
      • On-chip LDO and power-switches for RETRAM, BKPSRAM, and VSW
      • Dedicated supplies for Cortex®-A35
      • Internal temperature sensor
      • Low-power modes: Sleep, Stop, and Standby
      • DDR memory retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
    • Clock management
      • Internal oscillators: 64 MHz HSI, 16 MHz MSI, 32 kHz LSI
      • External oscillators: 16-48 MHz HSE, 32.768 kHz LSE
      • Up to 7× PLLs with fractional mode
    • General-purpose inputs/outputs
      • Up to 123 secure I/O ports with interrupt capability
        • Up to six wake-up inputs
        • Up to seven tamper input pins + 5 active tampers output pins
    • Interconnect matrix
      • Bus matrices
        • 128-, 64-, 32-bit STNoC interconnect, up to 600 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 300 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 3× dual master port, high-performance, general-purpose, direct memory access controller (HPDMA), 16 channels each
    • Up to 37 communication peripherals
      • 3× I2C FM+ (1 Mbit/s, SMBus/PMBus®)
      • 3× I3C (12.5 Mbit/s)
      • 3× UART + 4× USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI) + 1× LPUART
      • 6× SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)(+1 with OCTOSPI + 4 with USART)
      • 4× SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with four inputs
      • 3× SDMMC up to 8-bit (SD/e•MMC™/SDIO)
      • Up to 2× CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 1× USB 2.0 high-speed Host with embedded 480 Mbits/s PHY
      • 1× USB 2.0 high-speed dual role data with embedded 480 Mbits/s PHY
      • Up to 2× Gigabit Ethernet interfaces
        • TSN, IEEE 1588v2 hardware, MII/RMII/RGMII
      • Camera interface #1 (5 Mpixels at 30 fps)
        • MIPI CSI-2®, 2× data lanes up to 2.5 Gbit/s each
        • 8- to 16-bit parallel, up to 120 MHz
        • RGB, YUV, JPG, RawBayer with light ISP
        • Lite-ISP, demosaicing, downscaling, cropping, 3 pixel pipelines
      • Camera interface #2 (1 Mpixels at 15 fps)
        • 8- to 14-bit parallel, up to 80 MHz
        • RGB, YUV, JPG
        • Cropping
      • Digital parallel interface up to 16-bit input or output
    • 5 analog peripherals
      • 2 × ADCs with 12-bit max. resolution (up to 5 Msps each, up to 23 channels)
      • Internal temperature sensor (DTS)
      • 1× multifunction digital filter (MDF) with up to 4 channels/4 filters
      • Internal (VREFBUF) or external ADC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • Up to FHD (1920 × 1080) at 60 fps
        • 3 layers including a secure layer
        • YUV support
    • Up to 28 timers and 5 watchdogs
      • 4× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2× 16-bit advanced motor control timers
      • 10× 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5× 16-bit low-power timers
      • Secure RTC with subsecond accuracy and hardware calendar
      • 4 Cortex®-A35 system timers (secure, nonsecure, virtual, hypervisor)
      • 2× SysTick Cortex®-M33 timer (secure, nonsecure)
      • 5× watchdogs (4× independent and 1× window)
    • Hardware acceleration
      • 2x cryptographic processors (CRYP), AES-128, -192, -256, DES/TDES
      • Secure AES-256 with SCA
      • RSA, ECC, ECDSA with SCA
      • 2x HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC
      • 2x true random number generator
      • CRC calculation unit
      • “On-the-fly” DDR encryption/decryption (AES-128, AES-256)
      • “On-the-fly” OTFDEC Octo-SPI flash memory decryption (AES-128)
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
    • 12288-bit fuses including 96-bit unique ID
    • All packages are ECOPACK2 compliant

电路原理图

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EDA符号、封装和3D模型

意法半导体 - STM32MP211C

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
STM32MP211CAL3
批量生产
VFBGA 361 10x10X1.0 P 0.5 mm 工业 Ecopack2 10 -
STM32MP211CAM3
批量生产
TFBGA 289 14x14x1.2 P 0.8 mm 工业 Ecopack2 10 -
STM32MP211CAN3
批量生产
VFBGA 273 11x11x1.0 P 0.5 mm 工业 Ecopack2 10 -
STM32MP211CAO3
批量生产
VFBGA 225 8x8x1.0 P 0.5 mm 工业 Ecopack2 10 -

STM32MP211CAL3

Package:

VFBGA 361 10x10X1.0 P 0.5 mm

Material Declaration**:

Marketing Status

批量生产

Package

VFBGA 361 10x10X1.0 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP211CAM3

Package:

TFBGA 289 14x14x1.2 P 0.8 mm

Material Declaration**:

Marketing Status

批量生产

Package

TFBGA 289 14x14x1.2 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP211CAN3

Package:

VFBGA 273 11x11x1.0 P 0.5 mm

Material Declaration**:

Marketing Status

批量生产

Package

VFBGA 273 11x11x1.0 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP211CAO3

Package:

VFBGA 225 8x8x1.0 P 0.5 mm

Material Declaration**:

Marketing Status

批量生产

Package

VFBGA 225 8x8x1.0 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
供货状态
Budgetary Price (US$)*/Qty
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Order from distributors
包装类型
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Junction Temperature (°C) (min)
Junction Temperature (°C) (max)
STM32MP211CAM3
Available at distributors

经销商的可用性 STM32MP211CAM3

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

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STM32MP211CAL3
Available at distributors

经销商的可用性 STM32MP211CAL3

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

STM32MP211CAN3
Available at distributors

经销商的可用性 STM32MP211CAN3

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

STM32MP211CAO3
Available at distributors

经销商的可用性 STM32MP211CAO3

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

STM32MP211CAM3 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP211CAM3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

代理商名称

代理商库存报告日期:

STM32MP211CAL3 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP211CAL3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

代理商名称

代理商库存报告日期:

STM32MP211CAN3 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP211CAN3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

代理商名称

代理商库存报告日期:

STM32MP211CAO3 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP211CAO3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

代理商名称

代理商库存报告日期:

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商