产品概要
描述
BAL-UWB-01E3是一款集成了匹配网络的超小型巴伦，专门适用于3 GHz到8 GHz的超宽带。
该器件使用了意法半导体的IPD技术，并采用了可优化射频性能的非导电玻璃基板。
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性能一览
- 超薄型设计
- 高RF性能
- 节省PCB空间
- 制造高效
- 兼容LGA封装图
- 厚度不大于450 µm
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BAL-UWB-01E3
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所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 | |||
| ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| BAL-UWB-01E3 | Active 产品已量产 | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| BAL-UWB-01E3 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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BAL-UWB-01E3 Active
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