产品概述
描述
With the B-L4S5I-IOT01A Discovery kit for IoT node, users develop applications with direct connection to cloud servers. The Discovery kit enables a wide diversity of applications by exploiting low-power communication, multiway sensing and Arm® Cortex®-M4 core-based STM32L4+ Series features. The support for ARDUINO® Uno V3 and Pmod™ connectivity provides unlimited expansion capabilities with a large choice of specialized add-on boards.
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所有功能
- Ultra-low-power STM32L4+ Series STM32L4S5VIT6 microcontroller based on the Arm® Cortex®-M4 core with 2 Mbytes of Flash memory and 640 Kbytes of RAM in LQFP100 package
- 64-Mbit Quad-SPI Flash memory from Macronix™
- Bluetooth® 4.1 module (SPBTLE-RF) from STMicroelectronics
- 802.11 b/g/n compliant Wi-Fi® module (ISM43362-M3G-L44) from Inventek Systems
- Dynamic NFC tag based on ST25DV04K with its printed NFC antenna
- 2 digital omnidirectional microphones (MP34DT01) from STMicroelectronics
- Capacitive digital sensor for relative humidity and temperature (HTS221) from STMicroelectronics
- High-performance 3-axis magnetometer (LIS3MDL) from STMicroelectronics
- 3D accelerometer and 3D gyroscope (LSM6DSL) from STMicroelectronics
- 260-1260 hPa absolute digital output barometer (LPS22HB) from STMicroelectronics
- Time-of-flight and gesture-detection sensor (VL53L0X) from STMicroelectronics
- Highly-secure solution (STSAFE-A110) from STMicroelectronics
- 2 push-buttons (user and reset)
- USB OTG FS with Micro-AB connector
- ARDUINO® Uno V3 expansion connector
- Pmod™ expansion connector
- Flexible power-supply options: ST-LINK, USB VBUS or external sources
- On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port
- Comprehensive free software libraries and examples available with the STM32Cube MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR™, Keil®, and STM32CubeIDE
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所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
Board Manufacturing Specifications (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 3.0 | 30 Sep 2021 | 30 Sep 2021 | |
| ZIP | 3.0 | 30 Sep 2021 | 30 Sep 2021 |
物料清单 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 3.1 | 30 Sep 2021 | 30 Sep 2021 |
Schematic Pack (4)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 3.1 | 30 Sep 2021 | 30 Sep 2021 | ||
| 3.1 | 30 Sep 2021 | 30 Sep 2021 | ||
| 3.1 | 30 Sep 2021 | 30 Sep 2021 | ||
| 1.0 | 16 Apr 2020 | 16 Apr 2020 |
质量与可靠性
| 产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
|---|---|---|---|
| B-L4S5I-IOT01A | 批量生产 | Ecopack1 | |
B-L4S5I-IOT01A
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 供应商 | Specific features | WEEE Compliant | 核心产品 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| B-L4S5I-IOT01A | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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B-L4S5I-IOT01A 批量生产
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):
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