产品概述
主要优势
描述
The VD16GZ, VB16GZ are part of the new generation of image sensors developed by STMicroelectronics for professional and consumer vision applications. Leveraging state-of-the-art technologies developed by ST's own foundry, the sensors provide outstanding performance in color and near infrared. With their RGB-NIR pattern, the VD16GZ, VB16GZ are perfectly suited for multispectral imaging and for the many applications requiring the simultaneous capture of both color and near infrared images.
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所有功能
- Cutting-edge performance of ST proprietary pixel:
- BSI structure: Provides superior QE, MTF, and angular response.
- Full DTI technology: Further increases sensitivity and sharpness.
- Versatile imaging: Benefits both color and NIR (850 nm, 940 nm) image capture.
- Reliable supply: Proprietary technology from ST foundry in France, ensures a safe supply.
- Easy integration into your system:
- Ultracompact die: Centered design to minimize your system size.
- Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop.
- Low-power consumption: Ideal for battery-powered devices.
- Robust design: Ensures high image quality at various temperatures.
- A complete toolbox of in-sensor features:
- Stunning images: Achieved with in-sensor AE and various corrections.
- Data optimization: Multiple features to optimize data size and frame rates such as crop, and programmable sequences.
- Enhanced controls: 8 GPIOs enabling extra controls such as trigger or LED synchronization.
- Seamless connection to embedded processing platforms:
- MIPI CSI-2 interface: 1 or 2 lanes enabling direct connection to entry-level cost-effective processing platforms.
- Turnkey solutions: Start your development immediately with our sensor boards, modules, and drivers for the VD16GZ, VB16GZ image sensors.
- The VD16GZ, VB16GZ color and near infrared image sensors are also available in monochrome (VB56G3, VD56G3) and color RGB (VB66GY, VD66GY) versions.
- Cutting-edge performance of ST proprietary pixel:
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EDA符号、封装和3D模型
意法半导体 - VD16GZ
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| VD16GZCCA/RW | 批量生产 | DIE | 工业 | N/A | 10 | 2024-01-01T00:00:00.000+01:00 | |
VD16GZCCA/RW
Package:
DIEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| VD16GZCCA/RW | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
VD16GZCCA/RW 批量生产