STWLC88

批量生产
Design Win

Qi-compliant inductive wireless charger power receiver for 50W applications

下载数据摘要

产品概述

描述

The STWLC88 is a highly integrated wireless power receiver solution suitable for applications up to 50W. The chip has been designed to support the latest Qi specifications for inductive communication protocol with Extended Power Profile (EPP) and proprietary STSuperCharge (STSC) protocol for fast charging.

This solution requires low external BOM count. Because of the integrated low impedance synchronous rectifier and low drop-out linear regulator, STWLC88 achieves high efficiency and low power dissipation.

The STWLC88 features embedded FTP non-volatile memory to enable I2C interface customization and support of proprietary communication and charging protocols.

The STWLC88 is also capable of operating in transmitter (Tx) mode to share power for charging other devices with the output power up to 12W depending on the coil used.

The Flip Chip (4.07 x 4.49 mm) and low BOM count makes it very suitable for very compact application.

  • 所有功能

    • Up to 50 W output power
    • Up to 12 W output power in Tx mode
    • Qi EPP 1.2.4 inductive wireless standard communication protocol compliant
    • Integrated 27 V synchronous rectifier with ≥ 98% efficiency
    • Low drop-out linear regulator with output current and input voltage control loops
    • Programmable LDO regulator with output voltage up to 20 V in steps 25 mV
    • 32-bit, 64 MHz ARM Cortex microcontroller core
    • RAM/FTP (Few Times Programmable) Firmware patching and advance features
    • 8-channels, 10-bit A/D converter
    • 8 configurable GPIOs
    • I2C Slave, Master interface
    • Supports external flash for design in
    • High speed SPI (master) for external interface
    • Accurate current sense system for Foreign Object Detection (FOD)
    • Q-factor measurement for Object Detection in Transmitter mode
    • ASK V/I Modulator
    • Overvoltage, overcurrent and thermal protection
    • Wide rectifier input frequency of 50-300 kHz
    • Flip chip 110 bumps (4.07 x 4.49 mm)

EDA符号、封装和3D模型

STMicroelectronics - STWLC88

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封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 材料声明**
STWLC88JR
批量生产
WLCSP 4.077X4.490X0.471 110 0.4P 工业 N/A

STWLC88JR

Package:

WLCSP 4.077X4.490X0.471 110 0.4P

Material Declaration**:

Marketing Status

批量生产

Package

WLCSP 4.077X4.490X0.471 110 0.4P

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
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Operating temperature (°C)
Output Power (W) (typ)
等级规格
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STWLC88JR
Available at distributors

经销商的可用性 STWLC88JR

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STWLC88JR 批量生产

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产品型号:

STWLC88JR

Operating Temperature (°C)

Min:

Max:

Output Power (W) (typ):

50

等级规格:

Industrial

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商