******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 2.1
* @date    06-August-2024
* @brief   MB997 manufacturing files package
******************************************************************************
* COPYRIGHT(c) 2024 STMicroelectronics
*
* The Open Platform License Agreement ("Agreement") is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. ("ST"), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* "Reference Material"), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************

* 2.1 -  06-August-2024 
========================
    + Update package structure.
========================
* 2.0 -  20-July-2020 
========================
    + Added revision C.
    -Changing PCB label MB997 C
    + Added revision D.
    -Changing PCB label MB997 D
    + Added revision E.
    - Updating the certification logos.
    - Changing microphone footprint.


* 1.0 - 10-August-2016
------------------------
    + First official release with Rev B .
		
******************* (C) COPYRIGHT 2024 STMicroelectronics *****END OF FILE
