******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 1.1
* @date    28-June-2021  
* @brief   MB1209 manufacturing files package
******************************************************************************
* COPYRIGHT(c) 2021 STMicroelectronics
*
* The Open Platform License Agreement (Agreement) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (ST), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* Reference Material), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************
========================
* 1.1 - 28-June-2021
========================
    + Update the struture of rev D package.
    + No ODB++ or 3D files available.
========================
* 1.0 - 11-July-2016
========================
    + First official release of REV D
  
******************* (C) COPYRIGHT 2021 STMicroelectronics *****END OF FILE
