产品概述
描述
The STM32L562E-DK Discovery kit is a complete demonstration and development platform for Arm® Cortex®-M33 with Arm® TrustZone® and ARMv8-M mainline security extension core-based STM32L562QEI6Q microcontroller, with 512 Kbytes of flash memory and 256 Kbytes of SRAM.
The STM32L562E-DK Discovery kit uses the STM32L562QEI6Q innovative ultra-low-power oriented features to enable prototyping for many wearable or sensor applications, with state-of-the-art energy efficiency, secure boot, and TrustZone®-based software isolation.
For even more user-friendliness, the on-board STLINK-V3E debugger provides out-of-the-box loading and debugging capabilities, as well as a USB Virtual COM port bridge.
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所有功能
- STM32L562QEI6Q microcontroller featuring 512 Kbytes of flash memory and 256 Kbytes of SRAM in a BGA132 package
- 1.54" 240 × 240 pixel-262K color TFT LCD module with a parallel interface and touch‑control panel
- USB Type-C® Sink device FS
- On-board energy meter: 300 nA to 150 mA measurement range with a dedicated USB interface
- SAI audio codec
- MEMS digital microphones
- 512-Mbit Octo‑SPI flash memory
- Bluetooth® Low Energy V4.1 module
- iNEMO 3D accelerometer and 3D gyroscope
- Two user LEDs
- User and reset push-buttons
- Board connectors:
- USB Type-C®
- microSD™ card
- Stereo headset jack including analog microphone input
- JTAG debugger
- DPM dynamic-power measurement interface for external device
- STMod+ expansion connector with fanout expansion board for Wi‑Fi®, Grove, and mikroBUS™ compatible connectors
- Pmod™ expansion connector
- Audio MEMS daughterboard expansion connector
- ARDUINO® Uno V3 expansion connector
- Flexible power-supply options: ST-LINK USB VBUS, USB connector, or external sources
- On-board STLINK-V3E debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port
- Comprehensive free software libraries and examples available with the STM32CubeL5 MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
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所有资源
资源标题 | 版本 | 更新时间 |
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Board Manufacturing Specifications (4)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
ZIP | 2.2 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 2.2 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 2.0 | 22 Jun 2023 | 22 Jun 2023 | |
ZIP | 1.1 | 22 Jun 2023 | 22 Jun 2023 |
物料清单 (2)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
ZIP | 2.1 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 2.0 | 22 Jun 2023 | 22 Jun 2023 |
Schematic Pack (3)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
1.1 | 15 Oct 2024 | 15 Oct 2024 | ||
1.0 | 26 Sep 2019 | 26 Sep 2019 | ||
1.0 | 22 Jun 2023 | 22 Jun 2023 |
质量与可靠性
产品型号 | Marketing Status | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
---|---|---|---|---|---|
STM32L562E-DK | 批量生产 | Ecopack1 | - | - | |
STM32L562E-DK
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 供应商 | Specific features | WEEE Compliant | 核心产品 | |
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STM32L562E-DK | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
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STM32L562E-DK 批量生产