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	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/zh/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>zh</language>
	<lastBuildDate>Wed, 11 Nov 2026 14:40:05 +0100</lastBuildDate>
<item>
	<title><![CDATA[意法半导体助力STM32开发者简化AI模型开发流程]]></title>
	<description><![CDATA[意法半导体优化了ST Edge AI Suite 的工作流程，将四款全新工具融入统一的开发环境，让开发者能够更便捷地在STM32微控制器上部署嵌入式机器学习模型。 Model Explorer是本次更新推出的首款新工具，提供直观的网页界面，方便用户浏览预训练模型并找到适合的AI模型。这些模型此前可通过Model Zoo的GitHub代码仓库获取。Dataset Factory可帮助用户采集原始数据，并将其转换为可用、可靠的数据集， 而Model Factory支持面向特定应用的模型训练、定制、量化及进一步优化，帮助用户针对STM32 MCU优化模型。为在部署前验证性能，Model Bench提供网页界面，借助意法半导体开发板集群，让用户能够远程在硬件上对模型进行基准测试。此外，Model Bench将取代ST Edge AI Developer Cloud。 对此，意法半导体边缘AI解决方案事业群副总裁Stephane Henry表示：“随着本地推理成为当今智能产品的一项关键特征，高效开发和应用AI模型已成为设计人员的首要任务。目前，我们拥有微控制器厂商中规模最大的AI模型库，包含400多个预训练模型，其中有大量面向传感应用的模型，也就是物理AI模型。通过ST Edge AI Suite中的Model Explorer、Model Factory、Dataset Factory和Model Bench，我们将这些支持整合到一个专为基于STM32器件进行开发的设计人员打造的环境中。” 目前，意法半导体已通过Edge AI Suite为超过260,000个项目提供支持，且项目数量仍在持续增长。其用户群体包括来自大型知名科技企业、初创企业等各类规模公司的工程师，以及独立开发者。 从消费电子到工业传感器、控制设备、医疗器械和汽车系统，嵌入式AI是实现具有竞争力的功能、性能和功耗表现的关键。工程师需要新一代工具和工作流程，以选择模型并根据具体用例进行调整，优化内存和计算资源使用，并在目标硬件上验证性能。 ST Edge AI Suite将用户与涵盖4,000多款在售产品型号的广泛STM32生态系统连接起来。与之配套的强大STM32Cube生态系统提供MCU选型和配置工具、软件库及代码示例，并支持用户在自己偏好的集成开发环境（IDE）中开展工作。STM32Cube还为用户提供丰富的评估硬件资源，涵盖低成本STM32 Nucleo开发板、功能齐全的Discovery探索套件，以及支持无线连接、视觉、飞行时间（ToF）、物联网传感、电机驱动等功能的扩展板。 全新工具将于11月下旬推出。欢迎访问以下网址注册，以便接收上线通知：https://content.st.com/new-stm32-edge-ai-tools.html 如需使用当前版本的ST Edge AI Suite，请访问：https://www.st.com/edge-ai-suite 备注：STM32是STMicroelectronics International NV或其关联公司在欧盟和/或其他地区的注册和/或未注册商标。其中，STM32已在美国专利商标局注册。 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93%e5%8a%a9%e5%8a%9bstm32%e5%bc%80%e5%8f%91%e8%80%85%e7%ae%80%e5%8c%96ai%e6%a8%a1%e5%9e%8b%e5%bc%80%e5%8f%91%e6%b5%81%e7%a8%8b.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/800x450px-1.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Fri, 6 Nov 2026 15:32:16 +0100</pubDate>

</item>
<item>
	<title><![CDATA[意法半导体STM32H7P微控制器集数字信号处理、边缘AI与实时控制于一体，满足工业应用的严苛要求]]></title>
	<description><![CDATA[意法半导体STM32H7P微控制器搭载CoreMark®基准测试得分达2773的Arm® Cortex®-M7内核，并新增数字信号处理（DSP）和边缘AI硬件加速功能，以满足数字电源、电机控制、状态监测及其他关键工业应用的需求。 该架构集成了意法半导体的硬件信号处理器（HSP）和Neural-ART™神经网络处理单元（NPU）。HSP是一款兼具高性能、高性价比和高能效的DSP加速器，支持矩阵、向量及数字信号处理运算。通过将这些工作负载从主CPU卸载至HSP，可释放Cortex-M7的处理资源，并减少对专用外部DSP的需求。与在Cortex-M7上通过软件执行相比，HSP可将快速傅里叶变换（FFT）的处理速度最高提升至5倍。 意法半导体STM32市场总监Laurent Vera表示：“STM32H7P进一步拓展了久经验证的STM32H7系列，搭载两个专用硬件加速器和一个主频为520MHz的Cortex-M7内核，性能达到市场上同类替代产品的1.7倍。这些微控制器将更强的实时处理性能与先进的DSP和边缘AI硬件加速能力相结合，帮助工程师面向工业、电力电子、传感及智能边缘应用，打造更智能、响应更迅速的新一代嵌入式系统。此外，更丰富的模拟功能和定时器资源，以及出色的性价比，使其成为太阳能、数字电源和电机控制等电力电子应用的理想选择。” 新款微控制器配备更大容量的紧耦合存储器（TCM），支持快速访问指令和数据，充分释放该架构在实时控制、信号处理和AI推理方面的性能潜力。 针对寻求高性能、高性价比微控制器的客户，新系列以接近此前配备1MB Flash的STM32H7系列产品的价格，提供高达2MB的Flash，用于非易失性代码和数据存储。这使面向通用及大众市场的设计无需转向成本更高的平台，即可获得更强的实时处理性能和更大的存储容量。 除计算能力提升外，STM32H7P还采用了新近推出的STM32G5混合信号系列的先进模拟外设，包括模数转换器（ADC）、数模转换器（DAC）和比较器，以及定时器资源，为控制应用提供有力支持，进一步助力工业应用开发。 Neural-ART NPU突破了纯软件执行对边缘AI工作负载的限制，在提高效率的同时，支持规模更大、结构更复杂的神经网络。该NPU为STM32H7P系列带来高达85 GOPS（每秒850亿次运算）的算力。在运行意法半导体用于太阳能逆变器安全防护的AI电弧故障断路器（AFCI）模型时，其推理速度已被证明达到软件执行的40倍。此外，异常检测模型的运行速度达到软件执行的20倍，AI电池管理系统（BMS）模型的运行速度则达到15倍。 意法半导体Edge AI Suite为嵌入式机器学习开发提供完整环境，包含应用案例以及一系列工具和资源，帮助开发者加快AI模型在STM32上的开发与部署。开发者还可使用DSP配套软件，以及意法半导体的X-CUBE-MCSDK-2电机控制软件工具。 STM32H7P还将支持升级后的STM32Cube生态系统，包括功能增强的STM32CubeMX2配置工具，以及针对代码体积进行优化的最新硬件抽象层HAL2。 为满足严苛工业环境的需求，STM32H7P微控制器支持最高125°C的工作环境温度，并已纳入意法半导体的工业产品长期供货保障计划。此外，带裸露焊盘的LQFP封装选项可进一步提升散热能力，保障产品在高温工业设计中稳定可靠地运行。 STM32H7P系列现已向原始设备制造商（OEM）提供样片，计划于2027年1月量产。NUCLEO-H7P5II评估板和STM32H7P5IDK Discovery探索套件也将于2027年1月上市。更多信息，请访问www.st.com/stm32h7p 备注：STM32是STMicroelectronics International NV或其关联公司在欧盟及／或其他地区的注册及／或未注册商标。其中，STM32已在美国专利商标局注册。 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93stm32h7p%e5%be%ae%e6%8e%a7%e5%88%b6%e5%99%a8%e9%9b%86%e6%95%b0%e5%ad%97%e4%bf%a1%e5%8f%b7%e5%a4%84%e7%90%86%e3%80%81%e8%be%b9%e7%bc%98ai%e4%b8%8e%e5%ae%9e.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/PR2610STM32H7P-s.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Fri, 6 Nov 2026 15:27:04 +0100</pubDate>

</item>
<item>
	<title><![CDATA[意法半导体推出全新STM32工具，提升AI智能体编程准确性]]></title>
	<description><![CDATA[意法半导体推出全新工具STM32Cube for Agentic AI，助力嵌入式软件开发者在基于STM32微控制器（MCU）的项目中应用AI智能体。这些工具从设计之初就旨在支持集成AI智能体的开发流程。 意法半导体集团副总裁兼通用及汽车微控制器事业部总经理Patrick Aidoune表示：“AI智能体正在重塑嵌入式软件开发，重新定义商业预期，并推动开发者的角色向统筹、指导和监督转变。STM32Cube for Agentic AI旨在支持开发者与AI智能体组成的 ‘团队’：一方面，为智能体提供完成任务所需的准确STM32信息；另一方面，为开发者提供表达开发意图和检查输出结果的工具。我们的测试证实，借助这些工具，STM32开发者能够显著提升代码准确性。” OpenAI合作伙伴关系董事总经理Benjamin Schwartz表示： “我们的解决方案将OpenAI模型的智能能力与STM32Cube的准确数据及技能相结合，帮助嵌入式开发者提高工作效率，实现更好的优化效果。” Somfy首席架构师Serge Robin表示： “STM32Cube for Agentic AI让我们更有信心在开发中采用AI智能体。它提供经过验证的配置、参考示例和代码审查功能，支持灵活部署，也让开发者能够在熟悉的开发流程中重新掌握控制权。” STM32Cube for Agentic AI框架可提升AI辅助开发多个环节的效率。它直接提供来自芯片原厂的高质量STM32专属信息，帮助AI智能体确保准确性、规避AI幻觉等风险，并尽可能降低词元(token)使用成本。该框架还可帮助AI智能体选择合适的STM32生态系统资源，例如判断应使用现成的代码示例，还是调用代码生成工具。 用户可选择最适合自身开发流程的上下文配置，既可使用STM32CubeIDE，也可选用其他集成开发环境。无论用户来自原始设备制造商（OEM）还是面向大众市场的企业，都可在验证、调试和优化方面获得所需的额外支持。 借助STM32Cube for Agentic AI，AI智能体能够无缝使用意法半导体提供的经过优化和验证的参考代码示例，并调用结果确定的代码生成工具STM32CubeMX。这可提高代码的准确性和确定性，同时让开发者能够在需要时重新接管代码开发与调试，继续在熟悉的项目和编程环境中工作。 代码生成后，全新的STM32Cube for Agentic AI框架可对代码进行初步审查，核验应用编程接口（API）调用是否正确、检查代码与MCU硬件的交互是否正常，并提供问题的规避建议或替代方案。用户还可使用近期推出的STM32Sidekick工具。该工具可作为一线支持，解答基础技术支持问题，并提供相关资料和内容的链接。 为验证实际效果，意法半导体研究人员让AI智能体为STM32 MCU开发代码。其中，一组可参考STM32Cube for Agentic AI提供的STM32上下文信息和开发指南，另一组则不借助这些支持。结果显示，获得支持的AI智能体成功生成了可正常运行的代码，而另一组未能成功；同时，前者的词元（Token）消耗仅为后者的十五分之一。 STM32Cube for Agentic AI目前处于Beta测试阶段，正筹备于近期公开发布。 备注：STM32是STMicroelectronics International NV或其关联公司在欧盟和/或其他地区的注册和/或未注册商标。其中，STM32已在美国专利商标局注册。 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93%e6%8e%a8%e5%87%ba%e5%85%a8%e6%96%b0stm32%e5%b7%a5%e5%85%b7%ef%bc%8c%e6%8f%90%e5%8d%87ai%e6%99%ba%e8%83%bd%e4%bd%93%e7%bc%96%e7%a8%8b%e5%87%86%e7%a1%ae.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/PR2611AgenticAI_800x450.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Fri, 6 Nov 2026 15:22:49 +0100</pubDate>

</item>
<item>
	<title><![CDATA[ST发布全新混合信号微控制器STM32G5，面向 AI 服务器数字电源和具身智能机器关节实时控制及高端电机应用]]></title>
	<description><![CDATA[服务多重电子应用领域、全球排名前列的半导体公司意法半导体 (STMicroelectronics，简称ST；纽约证券交易所代码:STM) 发布全新STM32G5系列混合信号微控制器（MCU）。该系列将帮助开发者为数据中心、机器人、光伏系统与风力发电机、工业驱动系统及商用无人机打造更高效、更智能、更安全的技术，推动物理AI发展。 意法半导体通用与汽车微控制器事业部总经理Patrick Aidoune表示：“新一代微控制器旨在应对多重挑战，包括高效满足AI数据中心日益增长的能源需求、实现功能更复杂的人形机器人，以及驱动更复杂的电机控制系统。通过STM32G5系列，意法半导体让物理AI所需的计算性能更易获取并融入嵌入式系统，从而提升可持续性、功能安全和信息安全水平。” STM32G5微控制器采用Arm® Cortex®-M33内核，计算性能达到STM32G4系列的两倍。同时，全新及升级的外设进一步提升了电源、电机等设备控制的速度与精度。2027年，STM32G5将在现有单核产品阵容的基础上新增双核产品，提供更高性能和更丰富的外设。 台达电子PSBG材料部高级采购Andy Hsiao表示：“我们的使命是为更美好的明天提供创新、清洁、节能的解决方案，数字电源正是其中的核心。这需要控制平台能够跟上系统复杂度不断提升的步伐。STM32G5提供了下一代数字电源应用所需的性能与灵活性。凭借处理性能、集成外设与内置安全功能的结合，STM32G5成为我们设计中的有力选择，帮助我们在要求严苛的AI和电动汽车应用中降低能量损耗、缩小设计尺寸并提升可靠性。” 睿研智控首席执行官田波表示：“对于人形机器人而言，要实现灵巧的动作，就必须在极其紧凑的空间内融合力量、精度、感知与实时控制。STM32G5的性能超过上一代的两倍，并提供更丰富的外设支持和更强的内置安全功能，使我们能够控制更多电机，在对速度和精度要求严苛的场景中更快响应，并在机械手中集成更多传感器。我们正携手意法半导体，推动灵巧机械手从工厂自动化到医学实验室等场景的实际应用，让日常生活更加便捷。” 赋能数字电源与电机控制的先进功能 STM32G5系列微控制器采用主频为280MHz的Arm® Cortex®-M33内核，并引入全新及升级的外设，包括增强型高分辨率定时器、位置编码器、可编程逻辑阵列和硬件安全功能。 提高能效、降低能源需求对当今的数据中心至关重要，尤其是在AI加速器密集部署的场景中。最新GPU集群的速度和性能不断提升，正推动单机架功率向1MW迈进；到2030年，超大型数据中心的峰值功率需求可能超过2GW。在如此规模下，即使能效仅有小幅提升，也能减少能量损耗和冷却需求。借助高分辨率定时器，设备制造商可以采用精密算法，根据服务器工作负载带来的功率需求变化，动态调整电源单元配置，从而实现最佳效率。此外，凭借更精确的时序控制，STM32G5还能够应对采用碳化硅（SiC）和氮化镓（GaN）宽禁带半导体的电源所需的更高开关频率。 人形机器人对电机控制提出了复杂要求，包括多轴同步驱动，通常还需要提供大电流以产生高扭矩，并始终保持快速响应，确保动作流畅自然。对于手掌和手指等对精度要求更高的机构，则需要更精细的控制，一只机械手的电机数量就可能多达20个。人形机器人是物理AI最直观的应用之一，STM32G5的先进功能有望进一步拓展价格亲民、实用性强的人形机器人市场。 先进的功能安全与信息安全保障 STM32G5微控制器引入全新的PLAy可编程逻辑阵列，让开发者能够通过稳健可靠的定制硬件实现特定功能，减少对外部胶合逻辑电路的需求。 STM32G5集成前沿安全功能，包括安全配置能力，不仅提升了产品价值，也为数据中心应用带来重要优势，有助于满足当前及未来的合规要求。意法半导体将Cortex-M33的Arm TrustZone IP与自有STM32Trust安全功能相结合，其中包括用于安全启动和安全固件更新的不可变信任根（STiRoT）。此外，该系列还配备支持最新算法的先进加密引擎，包括意法半导体的PQC软件库，并提供软件保护、加密密钥等敏感数据的安全存储、防篡改检测、侧信道攻击防护，以及全生命周期安全管理支持。 更完善的开发生态系统 STM32G5拥有面向数字电源和电机控制应用的专用开发生态系统，涵盖硬件、软件、文档及培训资源，帮助开发者加快开发进程，缩短产品上市时间。 最新一代STM32CubeMX2开发工具已支持STM32G5系列。该工具支持全新的开发流程，并提供实时代码预览等先进功能，帮助开发者节省时间、即时获得反馈。此外，优化的图形用户界面、全新的时钟与引脚配置功能以及在线文档，让依赖关系管理和项目更新更加便捷。 STM32G5系列还可借助全新的STM32Cube硬件抽象层（HAL2），全面调用其丰富的硬件功能，同时显著优化内存占用。 更多技术特性： • Cortex-M33内核（主频280MHz时，性能达420 DMIPS，Coremark得分为1136） • 更丰富的硬件加速功能：指令/数据缓存（I/D cache）和程序执行加速器（routine booster） • 可编程逻辑阵列（PLAy）支持在芯片内部实现定制硬件功能 • 首款搭载意法半导体增强型12通道高分辨率定时器的MCU，非常适合数字电源应用 • 电机控制定时器和位置编码器（POSENC） • 丰富的先进模拟外设，包括12位模数转换器（ADC）、运算放大器、12位数模转换器（DAC）及超高速比较器 • STM32 Nucleo开发板（NUCLEO-G564RE），搭载LQFP64封装的STM32G5-512K微控制器 • 电机控制探索套件（B-G564E-MC1S） • 数字电源探索套件（B-G564E-DPOW1） • 数字电源软件库（X-CUBE-DPOWER） • 电机控制软件开发套件（X-CUBE-MCSDK） • LQFP封装提供两种版本，其中增强散热的裸露焊盘版本可满足更严苛的运行工况要求，适用于有此需求的数据中心电源应用 STM32G5微控制器现已量产，片上Flash容量从64Kbytes到512Kbytes，封装选择从小尺寸QFN32到LQFP128；如需了解更多信息，请访问st.com/stm32g5。 STM32是STMicroelectronics International NV或其关联公司在欧盟和/或其他地区的注册和/或未注册商标。其中，STM32已在美国专利商标局注册。 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/st%e5%8f%91%e5%b8%83%e5%85%a8%e6%96%b0%e6%b7%b7%e5%90%88%e4%bf%a1%e5%8f%b7%e5%be%ae%e6%8e%a7%e5%88%b6%e5%99%a8stm32g5%ef%bc%8c%e9%9d%a2%e5%90%91-ai-%e6%9c%8d%e5%8a%a1%e5%99%a8%e6%95%b0%e5%ad%97.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/800x450px.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 5 Nov 2026 08:51:45 +0100</pubDate>

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	<title><![CDATA[2026 STM32峰会：意法半导体发布统一MCU平台，满足工业、汽车及物理AI应用的技术融合需求]]></title>
	<description><![CDATA[服务多重电子应用领域、全球排名前列的半导体公司意法半导体(STMicroelectronics，简称ST；纽约证券交易所代码:STM)宣布，STM32产品组合迎来重大战略升级：打造覆盖工业、汽车和机器人应用的统一STM32微控制器平台。 作为这一战略的重要举措，全新STM32A系列将平台拓展至汽车和安全关键型系统。依托STM32逾20年的发展积累，这一跨领域平台将增强不同应用领域之间的技术延续性与复用能力，涵盖新兴的物理AI系统，帮助开发者加快先进嵌入式系统的上市进程，同时满足各市场在功能安全、信息安全、资质认证和产品长期供货方面的特定要求。 意法半导体微控制器、数字IC与射频产品部总裁Remi El-Ouazzane表示：“嵌入式创新不应要求开发者在每次开发新产品时都从头开始。通过统一的STM32平台，我们正在打造一个值得信赖、可跨市场和跨代际使用的基础平台。业界需要减少碎片化，更加注重推动MCU技术围绕共同基础实现融合，同时最大限度地复用软件。这正是我们致力于将STM32打造为跨行业标杆MCU平台的方式。” 以统一平台满足日益融合的技术需求 随着智能向边缘端延伸，工业和汽车系统在实时控制、安全运行、功能安全、连接及AI处理方面的需求日益趋同。统一的STM32平台为开发团队提供一致的架构和软件基础，使其能够复用经过验证的技术资源，同时根据各类应用在性能、资质认证及生命周期方面的要求，选择适合的产品。 - 产品组合的技术延续性：Arm® Cortex®-M内核与共通的架构设计原则，让开发者能够沿用熟悉的开发方式，在不同STM32 MCU系列之间迁移，更轻松地将经过验证的软件和IP应用于新设计。 - 统一的开发生态系统： MCU软件生态系统STM32Cube与广泛的Arm生态系统共同提供一致的开发环境，并以软件资源、技术支持及意法半导体开发者社区为支撑，帮助客户沿用既有的开发流程。 - 共用的工艺技术：意法半导体的40nm Flash工艺和集成嵌入式相变存储器的18nm FD-SOI工艺，辅以台积电的嵌入式非易失性存储器（eNVM）技术，为未来STM32产品提供可扩展的制造基础。 Arm作为意法半导体长期合作伙伴，与我们怀揣一致的打造统一微控制器平台的愿景。Arm Cortex-M架构已应用于超过1,000亿台设备。作为主要合作伙伴，意法半导体正参与推动Arm Cortex-M产品组合的未来发展，并为物理AI构建所需的高性能MCU基础。这一合作正帮助开发者在汽车、机器人和工业自动化系统等不同应用中复用更多代码。 Arm物理AI执行副总裁Drew Henry表示： “计算领域的下一个重要方向，是让在物理世界中承担移动、制造和作业任务的机器具备智能。依托二十多年的合作积累，Arm与意法半导体正携手推动Cortex-M的发展，满足边缘端感知和控制物理世界的智能化需求，助力释放下一代物理AI系统的潜能。” STM32A将平台拓展至高功能安全与汽车应用市场 全新STM32A系列将STM32平台拓展至高功能安全的系统和汽车系统，帮助客户在复用软件的同时，满足各类应用的资质认证和性能要求。首批三款STM32A微控制器现已向客户提供样片，计划于2027年扩大供应范围： STM32A4面向入门级汽车本地控制节点和安全系统 STM32A5面向工业自动化、机器人及能源系统中的中端安全关键型应用，以及汽车应用 STM32A9面向安全关键型多域控制应用，满足此类应用对实时控制、低延迟、以太网和确定性通信的关键要求。 登陆网站，查看统一微控制器平台的优势并了解我们的客户与合作伙伴的反馈：https://www.st.com.cn/content/st_com/zh/campaigns/unified-stm32-mcu-platform-z11.html 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/2026-stm32%e5%b3%b0%e4%bc%9a%ef%bc%9a%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93%e5%8f%91%e5%b8%83%e7%bb%9f%e4%b8%80mcu%e5%b9%b3%e5%8f%b0%ef%bc%8c%e6%bb%a1%e8%b6%b3%e5%b7%a5%e4%b8%9a%e3%80%81.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/pr2610Convergence_A_s.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Wed, 4 Nov 2026 08:22:33 +0100</pubDate>

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	<title><![CDATA[意法半导体公布2026年第三季度财报]]></title>
	<description><![CDATA[服务多重电子应用领域、全球排名前列的半导体公司意法半导体 (STMicroelectronics，简称ST，纽约证券交易所代码:STM) 公布了按照美国通用会计准则¹ (U.S. GAAP) 编制的截至2026年9月26日第三季度财报。此外，本新闻稿还包含非美国通用会计准则¹财务数据指标（详情参阅附录）。 意法半导体第三季度净营收37.6亿美元，毛利率37.3%，营业利润3.67亿美元，净利润2.91亿美元，每股摊薄收益0.31美元（按照非美国通用会计准则¹口径，营业利润4.29亿美元，净利润3.44亿美元，每股摊薄收益0.37美元）。 意法半导体总裁、首席执行官Jean-Marc Chery评论道： “得益于CECP（通信、设备、计算机及外设）业务和个人电子产品营收增长，第三季度净营收高于业绩指引区间中值；毛利率高于业绩指引中值。” 第三季度净营收同比增长17.9%，毛利率37.3%，营业利润率9.8%，净利润2.91亿美元。按照非美国通用会计准则 口径，营业利润率11.4%，净利润3.44亿美元。” 本季度，在订单表现强劲、需求可见度进一步提高的支撑下，市场需求进一步增长，而分销渠道库存持续低于我们的常规目标水平。综合来看，这些指标印证了我们所服务的各个市场持续复苏和长期增长的趋势。” 我们第四季度业绩指引的中值为：净营收41.5亿美元，环比增长约10.5%，同比增长约24.7%；毛利率预计约为39.0%，其中已计入产能闲置费用约40个基点的影响。” “按上述业绩指引中值测算，2026年全年营收约为145亿美元，同比增长22.8%。除各终端市场的周期性复苏外，全年营收同比增长还受到意法半导体自身特有增长动力的支撑，包括AI数据中心和低地球轨道（LEO）卫星通信。毛利率预计约为36.4%；非美国通用会计准则¹毛利率预计约为36.6%，较2025财年提升270个基点。” “在需求仍显著高于供给的环境下，我们继续按照意法半导体的战略路线图扩大产能。我们将继续着力提升盈利能力，以实现中期财务模型所设定的目标。公司特有的增长动力，以及在全公司范围内实施的重塑制造布局、调整全球成本基础计划，将共同推动盈利能力的提升。”]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93%e5%85%ac%e5%b8%832026%e5%b9%b4%e7%ac%ac%e4%b8%89%e5%ad%a3%e5%ba%a6%e8%b4%a2%e6%8a%a5.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 2 Nov 2026 15:39:08 +0100</pubDate>

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	<title><![CDATA[意法半导体拟提议续任Jean-Marc Chery担任总裁兼首席执行官]]></title>
	<description><![CDATA[意法半导体（NYSE：STM）今日宣布，公司监事会已邀请意法半导体总裁兼首席执行官Jean-Marc Chery继续留任，在现任职务上续任一年。Jean-Marc Chery已接受该提议。 因此，监事会将在公司2027年年度股东大会上提请股东批准Jean-Marc Chery以管理委员会主席以及公司总裁兼首席执行官的身份续任一年。 Jean-Marc Chery的领导力与远见，加上对执行的高度重视，为意法半导体确立了清晰的战略方向，推动公司价值主张持续发展，并为意法半导体及其利益相关方创造长期价值奠定了坚实基础。 这一决定体现了公司对保持意法半导体战略连续性、执行纪律以及在Jean-Marc Chery领导下所取得发展势头之重要性的认可。 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93%e6%8b%9f%e6%8f%90%e8%ae%ae%e7%bb%ad%e4%bb%bbjean-marc-chery%e6%8b%85%e4%bb%bb%e6%80%bb%e8%a3%81%e5%85%bc%e9%a6%96%e5%b8%ad%e6%89%a7%e8%a1%8c%e5%ae%98.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 13 Oct 2026 08:35:44 +0200</pubDate>

</item>
<item>
	<title><![CDATA[意法半导体发布基于 ST 可持续技术框架的先进情境感知传感器]]></title>
	<description><![CDATA[意法半导体最新推出的微型运动传感器具备更高精度，可实现准确的事件重建，同时满足最严格的可持续材料标准。 新款六轴传感器，即惯性测量单元（IMU），将应用于健身追踪器、智能标签等消费电子设备，以及工业资产监测、机器人等专业领域，还可用于摄影和农业测绘等无人机应用。同时，它们也属于 ST 可持续技术计划的一部分。 在传感器具备事件还原能力后，智能设备就有能力区分不同类型事件，强化事故告警、工具使用监测、机器人示教、运动成效分析、脑震荡检测等功能。意法半导体新推出两款惯性测量单元就具备这种事件还原能力，消费级惯性测量单元 LSM6DSK320X和工业级惯性测量单元ISM6HGK256X都采用先进的超对称陀螺仪架构，以提升传感器的测量精度，搭配宽动态范围的高精度加速度计。此外，这些功能还能提升无人机飞行稳控、结构状态监测、游戏手柄控制等应用性能。 意法半导体 MEMS 子产品部执行副总裁Simone Ferri表示：“我们这款新六轴运动传感器兼备紧凑的封装尺寸和优异的信号强度与抗干扰能力，将为智能应用带来强大的新功能。此外，新产品满足当前主流可持续材料规范，例如，不含双酚 A、无铅等要求。随着环保法规持续收紧，覆盖更多材料类别，这一特性能够帮助智能技术创新企业应对环境和法规要求。” “ST 新推出的 LSM6DSK320X 传感器具备前所未有的抗振性能，我们在正在推进的参考平台开发中必须立即将其集成并充分利用这一优势。” Betaflight 负责人 Jay Blackman 表示。 此外，Tianhe首席技术官Zebo Zhou博士表也发表了观点，“LSM6DSK320X IMU 是智能与情境感知消费电子技术的新一代性能标杆，涵盖无人机等应用。“无人机飞控对 IMU 提出的要求极为严苛：传感器必须在激烈机动中不发生饱和，在强烈振动下仍保持低噪声，同时还要具备小型化和低功耗特性。在我们评估过的所有器件中，ST 的 LSM6DSK320X 是最理想的选择。” 更多技术信息： 该超对称架构包含两组反相工作的镜像机电结构，可以抵消外界振动和撞击噪声干扰。这种结构搭配全差分信号链路，进一步大幅提高了检测信号的强度和抗干扰能力。 紧凑的内部结构让每颗惯性测量单元IMU都可在一个封装内集成 一个陀螺仪和两个独立的加速度计。双加速度计设计让IMU能够同时测量 ±16g 的小量程扰动和±320g的高g撞击事件，宽动态范围确保IMU不会漏测任何事件，而单加速度计 IMU 在小量程和大量程模式切换期间无法执行测量任务。 LSM6DSK320X消费级IMU和ISM6HGK256X工业级IMU均搭载意法半导体的机器学习内核 (MLC)，将 AI 算力直接嵌入传感器内部，以降低应用功耗，节省系统资源。 除底层基础库外，开发者还可利用意法半导体的扩展库，包括 Motion XLF、传感器融合和环境感知软件，进一步优化功耗性能，提高设计灵活性，适配各类应用场景。 新款IMU支持ST MEMS Studio 开发环境。LSM6DSK320X的转接板STEVAL-MKI257A和 ISM6HGK256X的转接板STEVAL-MKI258KA将于 2026 年 11 月前在意法半导体官网线上商城eSTore和授权代理商分别上架开售。 LSM6DSK320X消费级IMU的工作温度范围是-40℃ ~ +85℃；ISM6HGK256X工业级IMU的工作温度范围是- 40℃ ~ +105℃。工业级产品纳入了意法半导体10 年产品长效供货计划，保障器件长期供应。两款 IMU 均采用 2.5 mm × 3 mm × 0.83 mm 封装。 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为一家半导体垂直整合制造商（IDM），意法半导体与二十多万家客户、成千上万名合作伙伴一起研发产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/%e6%84%8f%e6%b3%95%e5%8d%8a%e5%af%bc%e4%bd%93%e5%8f%91%e5%b8%83%e5%9f%ba%e4%ba%8e-st-%e5%8f%af%e6%8c%81%e7%bb%ad%e6%8a%80%e6%9c%af%e6%a1%86%e6%9e%b6%e7%9a%84%e5%85%88%e8%bf%9b%e6%83%85%e5%a2%83.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/09/N4791D-Sep-22-2026-Advanced-context-aware-sensors_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Mon, 5 Oct 2026 09:48:28 +0200</pubDate>

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<item>
	<title><![CDATA[Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era]]></title>
	<description><![CDATA[In this Q&A, Alexandre BALMEFREZOL, Executive Vice President of ST’s Imaging subgroup, explains how IMG is evolving beyond traditional imaging and why the future of sensors is about perception, not just capturing images. To start, who is ST’s Imaging subgroup and how is imaging evolving in the AI era? IMG is a long-established organization inside STMicroelectronics, with more than 25 years of expertise in optical sensing. Our technologies are already deployed at scale, embedded in billions of devices across multiple markets. We started with camera image sensors and expanded step by step. Today, our mission is much broader: we enable what we call “physical AI”: systems that can sense, interpret, and respond to their environment. That means going beyond conventional imaging to combine vision, depth, and contextual sensing into true machine perception. The industry is moving from imaging designed for human interpretation to sensing designed for machine perception. That shift has two major implications. First, sensors must go beyond visible light to capture additional dimensions of information, such as depth or infrared signals. Second, they must be highly efficient, because much of this data will be processed locally, often under tight power and latency constraints. What does this mean in practice for sensor design, and what is ST’s role in this transformation? It changes the design priorities. Rather than optimizing only for resolution or image quality, we optimize for system-level performance: power consumption, latency, integration complexity and the ease with which the sensor’s output can be used by AI. Our technologies are therefore designed to provide context, not just pixels. They are conceived as elements of a broader system that includes computing, software and algorithms — all co-designed to enable perception. Our role is to make this transition possible with integrated sensing systems. We bring together vision, depth and processing in coherent, optimized solutions. That is why we say imaging is no longer just about cameras; it is about converting light into usable data that powers intelligent behavior at the edge. This is what unlocks the next wave of AI applications in real-world environments. How would you describe IMG’s strategy and positioning today? The industry is shifting from imaging for people to sensing for machines, and our strategy reflects that evolution. With over 3 billion ToF sensors shipped, ST is moving beyond components to deliver integrated sensing systems that combine depth, vision, and AI-ready processing for real-world applications. Our core ambition is to transform light into trusted data that AI can consume directly to understand a scene and support decisions. Instead of following the entire imaging market, we concentrate on domains where sensing truly drives system value: depth sensing, AI-driven vision and highly integrated solutions. This focus positions us not as a commodity camera supplier, but as a partner for advanced perception in fast-growing areas such as industrial automation, robotics and edge intelligence. HOW IS ST DIFFERENTIATED What makes this position credible in the market and where does ST differentiate? There are three main pillars: innovation over the long term, industrial scale, and our portfolio structured around two core platforms: FlightSense for depth sensing and BrightSense for AI vision; forming a complete perception stack for edge AI Over the last decade, we have shipped billions of sensors, notably in Time of Flight (ToF) and global shutter families. That volume confirms our technologies are not only advanced, but also robust and proven in the field. At the same time, because we focus on differentiated sensing, we can sustain strong positions in the segments we target and keep investing in what sets us apart. Our differentiation rests on focus and integration in high-value sensing technologies where perception, performance and system-level integration matter most. A crucial asset is our Integrated Device Manufacturer model along with what we describe as a “pixel to system” approach. We master every step, from pixel architecture and process technology to manufacturing, packaging and system integration. That gives us speed in innovation and the ability to deliver complete sensing solutions rather than standalone parts. How important are your footprint and the IDM model, and what are the practical benefits? It is central to our value proposition. We control the end-to-end chain thanks to our IDM model: sensor design, process development, front-end manufacturing in Europe and back-end operations in Asia, supported by a global network of partners and customers. This structure lets us industrialize innovations quickly, guarantee quality and reliability at scale, and tailor solutions to demanding markets such as automotive and industrial. Customers see three main advantages. First, speed: fully owning the stack means we can shorten development and bring new technologies to market faster. Second, differentiation: we can combine sensing, optics, processing and software into pre-integrated subsystems that simplify our customers’ designs. Third, scalability and robustness: our products are designed for high-volume, consistent manufacturing, which is critical for long-life, safety-critical or mission-critical applications. What role do people play in IMG’s success? They are the decisive factor. More than 800 specialists work in IMG across 13 countries, and a large share of them are dedicated to R&D. That level of commitment to innovation is essential in a domain where technology is both complex and fast-evolving. Our teams combine expertise in semiconductors, optics, photonics, signal processing, software, and systems. This breadth allows us to think in terms of complete solutions rather than isolated components, and to co optimize everything from pixels to algorithms. How does IMG sustain innovation over time? We rely on both strong internal capabilities and a rich external ecosystem. Internally, process technology, product design, and system engineering are closely aligned, enabling a fast and efficient path from research ideas to industrial products. Externally, we work with leading research institutes, as well as universities and industry partners. These collaborations help us explore technologies several years ahead of market demand and secure a continuous innovation pipeline. The balance between internal integration and external partnerships is what allows us to maintain an ambitious roadmap and deliver at scale. WHICH TECHNOLOGIES ENABLE ST’S STRATEGY What are the key technologies behind this strategy? Two pillars stand out: Time of Flight (ToF) depth sensing and AI driven vision technologies such as global shutter and RGB IR imaging. We complement these with advanced capabilities like 3D stacking, metasurface optics, and embedded processing. The goal is for the sensor not only to capture data, but to pre process and structure it so it is directly usable by AI. The real differentiation appears when all these elements are integrated into systems that are smarter, more compact, and more energy efficient. Time-of-Flight has been around for a while. How mature is this technology today, and what is new with FlightSense? It is highly mature. We have been developing ToF for more than 10 years and have shipped over 3 billion ToF sensors. What is evolving now is not the core technology itself, but the breadth of its deployment. ToF is moving well beyond smartphones into a wide range of systems that need reliable depth information. It is becoming a mainstream building block for perception. Our latest flagship is the VL53L9, a fully integrated 3D LiDAR module. It combines the emitter, receiver, processing, and power management into a compact, calibration free device. It offers more than 2,000 sensing zones, up to 100 frames per second, and a range of up to 9 meters, with a wide field of view. Beyond the raw specifications, it is designed for easy integration and reliable operation, from bright outdoor light to complete darkness. On the vision side, what is the role of BrightSense and why is RGB and Near-Infrared combination important? BrightSense is our family of vision sensors designed specifically for machines. The latest 5 megapixel devices combine innovations such as 3D stacking, 2.25 micron pixels, and a hybrid global/rolling shutter architecture. A single sensor can therefore deliver high image quality and accurate motion capture, functions that used to require different technologies. Integrating RGB and Near Infrared (NIR) in one sensor is crucial for real world operation. It allows systems to operate in both day and night conditions without mechanical filters. This simplifies system design, reduces cost and complexity, and improves robustness, especially for applications that must work reliably around the clock. How are you addressing power consumption, and how do FlightSense and BrightSense work together? Power is a critical design parameter, particularly for always on and battery powered systems. We have developed ultra low power sensors that operate at around 1–2 milliwatts in auto wake up mode. This allows devices such as wearables and smart home products to perform continuous sensing within very tight energy budgets, making always on AI practical in new form factors. Flightsense and Brightsense are complementary pillars of perception. FlightSense provides depth and spatial awareness; BrightSense delivers visual and contextual information. Together, they enable systems that can both map their surroundings and recognize what is happening. In other words, systems that can see, understand, and act. That is the foundation of a real world AI at the edge. HOW THOSE TECHNOLOGIES TRANSLATE INTO USE CASES AND WHAT DOES THIS MEAN FOR CUSTOMERS AND THE MARKET How does this translate into real-world applications and what kind of applications are driving demand? The VL53L9 opens up a wide set of use cases, including robotics, industrial automation, smart buildings, and healthcare. For example, analytics such as people detection or safety monitoring can run directly on a microcontroller. In some scenarios, applications can operate at 30 frames per second while using only about 13% of RAM and 6% of Flash. That level of efficiency is a key enabler for edge AI. We also see strong traction in smart cities, industrial automation, robotics, and security. Across these domains, the requirement is the same: devices must understand their environment, not just record it. That is why we emphasize perception rather than traditional imaging. What is the big takeaway for customers and the market? We are moving beyond individual sensors to complete perception platforms that integrate sensing, processing, and software. This helps customers build smarter, more efficient products faster, with lower power consumption, reduced system complexity, and higher performance. Sensing is becoming a system level capability and by turning light into trusted data, ST’s Imaging division is helping bring AI out of the cloud and into the physical world.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/imaging-sensing-ai-f0023.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Mon, 6 Jul 2026 07:00:26 +0200</pubDate>

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<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[Disclosure of Transactions in Own Shares – Period from June 29, 2026 to July 03, 2026 STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between June 29, 2026 to July 03, 2026 (the “Period”), of 145,390 ordinary shares (equal to 0.02% of its issued share capital) at the weighted average purchase price per share of EUR 63.5445 and for an overall price of EUR 9,238,728.20. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 29-Jun-26 30,390 63.9364 1,943,027.20 XPAR 30-Jun-26 30,000 64.8891 1,946,673.00 XPAR 1-Jul-26 30,000 63.8800 1,916,400.00 XPAR 2-Jul-26 30,000 62.3511 1,870,533.00 XPAR 3-Jul-26 25,000 62.4838 1,562,095.00 XPAR Total for Period 145,390 63.5445 9,238,728.20 Following the share buybacks detailed above, the Company holds in total 18,882,103 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-2.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Mon, 6 Jul 2026 01:00:51 +0200</pubDate>

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<item>
	<title><![CDATA[STMicroelectronics announces timing for Second Quarter 2026 earnings release and conference call]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release second quarter 2026 earnings before the opening of trading on the European Stock Exchanges on July 23, 2026. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its second quarter 2026 financial results and current business outlook on July 23, 2026 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until August 7, 2026. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3399.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Fri, 3 Jul 2026 07:00:26 +0200</pubDate>

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<item>
	<title><![CDATA[STMicroelectronics and the infrastructure of Cloud AI]]></title>
	<description><![CDATA[By Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group, STMicroelectronics. By Marco Cassis, President, President, Analog, Power & Discrete, MEMS and Sensors Group, Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office. Cloud AI is redefining computing at extraordinary speed. As the world\'s largest technology companies race to build AI at scale, the data center from the software and silicon to its power architecture, its networking fabric, and the fundamental physics of how information moves is being reimagined from the ground up. The shift toward accelerated workloads is a structural transformation, and it demands an entirely new generation of infrastructure. Behind every model training run and inference cluster is a fundamental question: how do you deliver enough power, move enough data, and maintain efficiency and reliability as you scale from kilowatts to megawatts, and from megawatts to gigawatts? STMicroelectronics does not design GPUs or AI models. But we play a decisive role in answering that question providing the semiconductor technologies that make AI factories possible, linking the grid to the core through advanced power conversion, high-speed connectivity, and integrated optical interconnects. The data center under pressure The numbers define the challenge. Global data center capacity is projected to nearly double, from around 103 GW in 2025 to 200 GW by 2030, with annual infrastructure spending expected to exceed $1 trillion by the end of the decade. A few years ago, a powerful server rack drew 10 to 15 kW, roughly the load of several household ovens. In the AI era, operators are planning for 500 kW to more than 1 MW per rack: enough to power hundreds of homes. Meanwhile, the data traffic between accelerators is growing in proportion, as training and serving large models requires billions of data points to move between chips every second. Legacy infrastructure was not built for this. Copper interconnects, once the backbone of data center networking, increasingly cannot meet the speed, reach, and energy-per-bit requirements of modern AI clusters. Traditional power architectures struggle with efficiency, thermal management, and physical footprint at megawatt densities. The result is rising costs, mounting complexity, and an industry-wide imperative to rethink how data centers are powered and connected. From copper to light: silicon photonics in the AI fabric The communication demands of large AI clusters have made traditional copper-based networking unsustainable at scale. Copper links struggle with attenuation and crosstalk at high speeds and across the distances needed to connect racks and rows. They also consume too much power per bit, a constraint that becomes critical when a single training cluster may contain tens of thousands of accelerators, all exchanging data continuously. Optical interconnects are becoming the backbone of Cloud AI networks. Light carries more data with lower loss, over longer distances, and with better energy efficiency. For AI training and inference workloads, where job completion time and cluster utilisation depend directly on interconnect performance, this transition is transformational. ST has invested deeply in silicon photonics to enable this shift. The PIC100 silicon photonics platform delivers high-speed, low-loss optical links for intra- and inter-data center applications. Produced on 300 mm wafers and already in high-volume production for leading hyperscalers, PIC100 gives operators a proven, scalable path to optical fabrics in AI deployments. Capacity for this platform is set to quadruple by 2027 and further expand in 2027, a reflection of the pace at which cloud providers are moving toward optical-first network architectures. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments. Photonic integrated circuits are combined with custom electronics to create optical engines suited to the full range of deployment models: traditional pluggable modules, near-packaged optics positioned close to the switch or accelerator ASIC, and co-packaged optics where electro-optical integration is deepest. ST is developing PIC100 TSV, an architecture that increases connectivity density and improves thermal performance at the module and system level, targeting the near-packaged and co-packaged optics deployments that will define the next generation of AI switches and accelerator packages. Industry forecasts project silicon photonics growing from roughly a third to nearly two-thirds of all optical technologies used in AI clusters by 2030. ST is positioning to be at the center of that growth. Intelligence at the edge of power and light As AI clusters shift to optical connectivity, they also need an intelligent control layer to configure, monitor, and protect these systems in real time. Advanced power chains and optical fabrics are only as reliable as the intelligence managing them. Optical fibres cannot monitor their own signal integrity; power systems do not self-optimise across thousands of modules without intervention. Microcontrollers and mixed-signal ICs provide the control layer that makes large-scale infrastructure dependable. Inside optical modules, STM32 high-performance microcontrollers act as local orchestrators configuring lasers and detectors, measuring temperature and voltage, exposing telemetry to host systems, and enabling modules to adapt in real time and protect against degradation. High-speed electronics built on ST\'s BiCMOS B55X process technology sit alongside photonic waveguides, driving lasers and amplifying received signals at 100 Gbps, 200 Gbps, and beyond per lane, while remaining power-efficient enough for deployment in thermally constrained AI racks. In the power path, intelligent controllers coordinate conversion stages, implement protection mechanisms, and optimise load sharing under varying operating conditions. Across a hyperscale data center, thousands of such devices collectively provide the visibility and control that Cloud AI infrastructure demands and that operators increasingly cannot do without. From grid-to-core ST supplies the critical semiconductors that power, cool, and connect AI data centers – supporting grid to core, and the core to the user addressing every major node in the Cloud AI chain: Grid → solid-state transformer → 800 VDC distribution → power racks → core power stages → xPU/GPU → optical network At each step, ST contributes specific, differentiated technology: wide-bandgap power devices and high-efficiency converters to move energy from the grid to the core; silicon photonics, BiCMOS electronics, and integrated optical engines to move data faster at lower power; and microcontrollers and mixed-signal ICs to manage, monitor, and orchestrate these systems in real time. Powering the AI factory: SiC, GaN, and 800 VDC AI workloads are fundamentally changing the power profile of data centers. Goldman Sachs estimates that total data center power demand will increase by around 165% between 2023 and 2030. To meet this demand efficiently, operators are migrating from traditional AC distribution and lower-voltage DC schemes to high-voltage DC topologies, with 800 VDC distribution emerging as the architecture of choice for next-generation AI campuses. ST\'s power technologies are designed for this reality. Silicon carbide devices address the high-voltage, high-efficiency conversion stages at the front end: grid interfaces, solid-state transformers, and HVDC distribution. Gallium nitride takes over closer to the load, where high-frequency, compact conversion enables dense power shelves and point-of-load regulators for GPUs, CPUs, and custom accelerators. Advanced controllers and low-voltage devices coordinate the full power path from 800 V down to 50 V, 12 V, 6 V, and below where modern chips operate. Working with partners including NVIDIA, ST has developed a suite of 800 VDC power-conversion architectures aligned with NVIDIA\'s reference designs for next-generation AI data centers. By reducing conversion stages and copper usage, and optimising efficiency across the chain, these solutions help hyperscalers deliver more usable power to more accelerators within the same physical footprint turning the 1 MW rack from an engineering challenge into an operational reality. Building with the hyperscalers Cloud AI is an ecosystem. A multiyear collaboration with Amazon Web Services sees ST supplying advanced connectivity ICs, mixed-signal devices, microcontrollers, and analog and power ICs integrated directly into AWS\'s compute infrastructure. It is a model of deep, long-term engagement. ST\'s work in high-voltage DC power architectures follows the same logic. By co-creating reference designs and validated solutions for 800 VDC distribution and conversion, ST helps accelerate the adoption of efficient, scalable power topologies across the industry not just for a single customer, but as a contribution to where the broader ecosystem is heading. Beyond these anchor partnerships, ST engineers work with original design manufacturers, module vendors, and research institutions to help define the standards and implementation practices that will govern how these building blocks are deployed at scale. Scaling the manufacturing engine Technology leadership is only valuable when it can be delivered in volume. With AI capacity expanding rapidly across regions, ST\'s manufacturing footprint is designed for the scale, resilience, and geographic proximity that hyperscalers require. In Italy, high-volume 200 mm silicon carbide lines supply the high-voltage, high-efficiency devices at the heart of advanced power conversion. In France, our 300 mm fabs produce digital, mixed-signal, and silicon photonics technologies including the PIC100 platform — with a committed roadmap to quadruple photonics capacity by 2027. In China, a joint venture with Sanan Optoelectronics provides 200 mm SiC device manufacturing, securing local supply in one of the world\'s fastest-growing data center markets. This distributed model ensures that as Cloud AI deployment accelerates across geographies, the critical components SiC and GaN power devices, photonic ICs, BiCMOS drivers, microcontrollers are available where and when they are needed. A long-term structural shift The AI buildout is a structural shift in how computing is delivered and where value is created. Data centers are transitioning from megawatts to gigawatts, from AC to high-voltage DC, from copper to optical interconnects. Each of these inflections maps directly onto ST\'s core competencies in connectivity, power, and control. As Cloud AI deployments scale, this segment is expected to become a significant growth engine for ST with cloud AI infrastructure revenue projected to be nicely above $500 million in 2026 and well above $1 billion in 2027. But beyond the financial trajectory, the significance is structural: ST is helping to build a new layer of critical infrastructure for the digital world. Powerful GPUs and sophisticated AI models may capture the headlines. But their performance and the economic value they generate depends on a less visible foundation of optical connectivity, power conversion, and real-time control. ST is building that foundation, systematically, from the grid to the core, so that the next generation of AI factories can operate at the efficiency, density, and scale that the world\'s demand for intelligence requires. Presentation: ST Cloud AI update]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0022.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Fri, 26 Jun 2026 15:20:57 +0200</pubDate>

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	<title><![CDATA[意法半导体推出世界首个内置抗量子硬件加密处理器的移动安全芯片产品ST54M，为下一代互联服务保驾护航]]></title>
	<description><![CDATA[中国——服务多重电子应用领域、全球排名前列的半导体公司意法半导体 (STMicroelectronics，简称ST，纽约证券交易所代码:STM) 推出了一款移动安全芯片，这款名为ST54M的新产品可以帮助智能手机等各类个人消费电子厂商应对即将到来的防御量子攻击安全要求，同时确保用户在各类不同的互联增值服务时获得顺畅无缝的体验。 ST54M在单芯片上整合了创新的抗量子加密 (PQC)硬件加密处理器与NFC、安全单元和eSIM功能，为移动互联和网络增值服务提供了一个功能强大的面向未来的安全解决方案。该解决方案支持各种应用场景，包括非接触式支付、公交票务、门禁控制、数字身份证、驾驶执照、eSIM 和数字车钥匙。 适配各类新增移动应用场景，提供面向未来的安全保护 随着移动终端日益成为金融交易、身份验证、电信业务和门禁等诸多服务的值得信赖的平台，产品开发者需要，一个解决方案，能够兼顾，安全、高性能和便捷性。为了满足这种需求，意法半导体推出了ST54M单芯片移动安全产品，让OEM厂商和生态合作伙伴能够在一个平台上承载多种应用的同时准备好迎接抗量子密码加密PQC时代的到来。 该产品为个人消费电子相关的诸多生态比如运营商、银行、政府、公交系统、汽车厂商、数字钱包和服务提供商而设计，帮助设备制造商开发能兼顾稳定、熟悉的用户体验和更高的长期安全准备的设备。 新上市的ST54M让客户和合作伙伴能够提供抗量子安全实施方案，有足够的时间来满足由行业驱动的预计将在2030年左右强制实施的严苛的抗量子要求。 意法半导体互联安全产品部副总裁、事业部总经理David Richetto表示：“我们正在扩大ST的移动融合平台产品阵容，新产品ST54M可以帮助客户应对不断变化的安全挑战，同时支持用户期望从设备中获得丰富服务的需求。单芯片集成PQC硬件加密处理器与NFC、嵌入式安全单元和eSIM功能，ST54M为设备制造商着手迎接下一代移动体验的到来提供了一条安全的途径。” 专为安全防护、功能集成和射频性能设计 ST54M 是一款先进的集成 了NFC 控制器与安全单元的单芯片移动安全解决方案，支持各类移动安全应用、eSIM 及符合 NFC 标准的终端产品，其核心亮点是内置专门用于处理包括ML-KEM、ML-DSA 等标准算法在內的抗量子硬件加密处理器，助力混合加密方法向纯抗量子密码加密体系升级进化。该硬件加速引擎可满足快速兴起的PQC合规需求，同时能够抵御侧信道攻击与故障注入攻击，是意法半导体长期深耕抗量子安全技术的最新成果，其他成果还包含与 STM32微控制器配合使用的已通过认证的PQC软件库 NesLib-PQML 和 x-cube-pqc。 除了安全架构外，该产品还集成了大容量内存，可以承载多个应用，并配备了增强的射频前端。这些功能支持开发者用更小的天线搭配单端射频配置来实现更高的射频性能，支持更稳定的读写器操作，赋能mPOS、无线充电等安全要求严格的应用场景。该平台已通过Common Criteria 2022 EUCC和EMVCo的认证测试，证明该芯片适合安全敏感的移动应用。 现在客户可以申领ST54M样片，计划于 2026 年 7 月开始量产并完成产品认证。询价价格与样片申请事宜请联系意法半导体当地销售办事处。 更多产品详情访问: www.st.com/st54m 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为 一家半导体垂直整合制造商(IDM)，意法半导体与二十多万家客户、成千上万名合作伙伴一起研发 产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持 续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现 100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/p4784.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 25 Jun 2026 15:00:15 +0200</pubDate>

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	<title><![CDATA[意法半导体发布紧凑型 dToF 三维激光雷达模块，赋能边缘 AI 系统实现高精度空间感知]]></title>
	<description><![CDATA[中国– 服务多重电子应用领域、全球排名前列的半导体公司意法半导体 (STMicroelectronics，简称ST) （纽约证券交易所代码:STM)，今日正式推出 VL53L9小型一体化直接飞行时间 3D 激光雷达模块，为高分辨率空间测距市场树立了一个新的产品标杆。该模块在小巧高性价比的封装中集成尖端技术，输出图像数据可直接用于微控制器(MCU)和高性能传感器上的低算力边缘 AI 系统，适合机器人、工业自动化、智能楼宇、AR/VR、医疗健康等各种应用。 意法半导体集团执行副总裁兼影像子产品部总经理Alexandre Balmefrezol表示：“VL53L9 充分展现了飞行时间传感技术的发展进步，在一个尺寸紧凑的模块内集成100 帧/秒高速、高分辨率深度图像传感器和完整的数据处理架构，可以降低系统集成难度和设计复杂度，帮助客户加快机器人、智能基建、健康监测等应用的研发进度。新品发布也体现了我们新的战略方向，从提供独立的传感器芯片向支持边缘AI的一体化传感器系统发展。” Yole集团市场与技术分析师Anas Chalak表示： “机器人、工业自动化、扩展现实及智能消费设备市场对3D传感器的需求正在快速增长。飞行时间技术正在从智能手机，向各类需要小型化、高性价比、高精度的深度感知的应用领域拓展，涵盖导航、人员监测、手势识别与安防监控等应用。分辨率更高的多区dToF模块正成为推动新一轮 3D 传感技术应用的核心载体 (1)。” ST的FlightSense™ VL53L9可适用于许多行业，包括： - 机器人：提高自主导航的小目标检测、SLAM(同步定位建图) 和避障能力 -工业自动化：准确地测量料罐和料仓内物体体积，提升运营效率与库存管理水平 - 智能楼宇与智能家居：提供可靠的人体存在检测和人数统计功能，同时在保护用户隐私 - 增强/虚拟现实及消费电子：高级手势识别、人体追踪和手指骨骼追踪，改进沉浸式交互体验 - 健康医疗：跌倒检测和状态监测方案，适用于养老看护与病患安全保护 技术信息 提升3D感知的准确度和能效 VL53L9可以测量2268个区位（54×42），视场角更是达到 54°×42°，可以捕捉3D 深度图细节，精准识别小物体、轮廓和边缘。该模块采用意法半导体自研堆叠式BSI SPAD传感器技术，搭配创新的超表面透镜（MOE），能够快速准确地测量测距，测量范围 5 厘米至 9 米，准确度1%，帧率100 帧/秒。 提供边缘AI直接可用数据，集成化设计简化系统集成 VL53L9摒弃传统点扫描技术，采用双扫描泛光照明光源，可以减少运动图像的伪影畸变，消除探测盲区，提升小物体的检测准确度，同时拍摄二维红外图像与三维深度图像。VL53L9大幅简化了数据后处理工作，让低算力小微控制器能够高效运行各类边缘 AI 应用。这款一体化模块还集成dToF处理单元与专用电源管理芯片，出厂前无需任何调校，进一步降低集成难度、系统成本和复杂度。 紧凑封装 VL53L9 是 一个12.8mm × 6.1mm × 4.6mm的可回流焊接的单组件模块，适配多种玻璃盖板，接受1.2V和3.3V双电压电源，提供 MIPI 或 I3C数据输出接口，可兼容各类处理器架构，通过1 类激光安全认证，保障终端使用安全可靠。 生产计划 意法半导体 FlightSense™ VL53L9计划于 2026 年 7 月初量产，向全球客户提供样片和批量发货。 详情访问VL53L9产品页面: https://www.st.com/en/imaging-and-photonics-solutions/vl53l9cx.html (1) 2025 – 2030 period; 来源: 3D Imaging & Sensing 2025 report, Yole Group 关于意法半导体 意法半导体拥有49,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为 一家半导体垂直整合制造商(IDM)，意法半导体与二十多万家客户、成千上万名合作伙伴一起研发 产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持 续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现 100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/p4783.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Mon, 22 Jun 2026 14:28:20 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics prices a US$1.5 billion dual-tranche offering of New Convertible Bonds]]></title>
	<description><![CDATA[Not for release, publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law. This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction. STMicroelectronics N.V. (the “Company” or “ST”) announces today the pricing of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of ST (the “Shares”) (the “New Convertible Bonds”). The New Convertible Bonds will be issued in two tranches, one of US$750 million with a maturity of 5 years (the “2031 Convertible Bonds”) and one of US$750 million with a maturity of 7 years (the “2033 Convertible Bonds”). The terms of the New Convertible Bonds contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash and Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. The offering proceeds, net of costs, will be used by ST for general corporate purposes, including the early redemption of the outstanding US$750 million Zero Coupon Convertible Bonds due 2027 (ISIN: XS2211997239) announced earlier today. Offering of New Convertible Bonds The Company will issue the dual-tranche New Convertible Bonds as follows: The 2031 Convertible Bonds will not bear interest, will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2031, unless previously redeemed, converted or purchased and cancelled; and The 2033 Convertible Bonds will bear interest at an annual rate of 0.625%, payable semi-annually in arrear. The 2033 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2033, unless previously redeemed, converted or purchased and cancelled. The initial conversion price for the New Convertible Bonds has been set: In relation to the 2031 Convertible Bonds, at US$ 119.9813, representing a premium of 55%; and In relation to the 2033 Convertible Bonds, at US$ 121.9165, representing a premium of 57.5%, in each case over the volume-weighted average price of a Share between opening of trading today and pricing of the offering on the Euronext Milan Market, organised and managed by Borsa Italiana S.p.A., converted into US dollars at the prevailing exchange rate at the time of pricing. Settlement of the New Convertible Bonds is expected to take place on or about June 23rd, 2026. Application will be made for the New Convertible Bonds to be admitted to trading on the Open Market (Freiverkehr) segment of the Frankfurt Stock Exchange within 90 days of settlement. In the context of the offering of the New Convertible Bonds, the Company has committed to a lock-up period from (and including) the pricing date to (and including) 90 days after closing in respect of the Shares and related securities. The issuance of the New Convertible Bonds has been approved by the managing board and the supervisory board of the Company. BNP PARIBAS and J.P. Morgan acted as Joint Global Coordinators and Joint Bookrunners and Citigroup, Goldman Sachs Bank Europe SE, Intesa Sanpaolo, Morgan Stanley Europe SE, Natixis, Société Générale and UniCredit acted as Joint Bookrunners in respect of the offering. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com. * * * * * Issuer’s LEI: 213800Z8NOHIKRI42W10 * * * * * Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of the Market Abuse Regulation (EU) 596/2014 (“MAR”). * * * * * IMPORTANT NOTICE IN RELATION TO THE BONDS NO ACTION HAS BEEN TAKEN BY THE ISSUER, THE JOINT BOOKRUNNERS OR ANY OF THEIR RESPECTIVE AFFILIATES THAT WOULD PERMIT AN OFFERING OF THE BONDS OR POSSESSION OR DISTRIBUTION OF THIS PRESS RELEASE OR ANY OFFERING OR PUBLICITY MATERIAL RELATING TO THE BONDS IN ANY JURISDICTION WHERE ACTION FOR THAT PURPOSE IS REQUIRED. PERSONS INTO WHOSE POSSESSION THIS PRESS RELEASE COMES ARE REQUIRED BY THE ISSUER AND THE JOINT BOOKRUNNERS TO INFORM THEMSELVES ABOUT, AND TO OBSERVE, ANY SUCH RESTRICTIONS. THIS PRESS RELEASE IS NOT FOR DISTRIBUTION, DIRECTLY OR INDIRECTLY IN OR INTO THE UNITED STATES OR TO U.S. PERSONS (AS DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT OF 1933, AS AMENDED) (THE “U.S. SECURITIES ACT”). THIS PRESS RELEASE IS NOT AN OFFER TO SELL SECURITIES OR THE SOLICITATION OF ANY OFFER TO BUY SECURITIES, NOR SHALL THERE BE ANY OFFER OF SECURITIES IN ANY JURISDICTION IN WHICH SUCH OFFER OR SALE WOULD BE UNLAWFUL. THE BONDS AND THE SHARES TO BE DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE U.S. SECURITIES ACT AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO, OR FOR THE ACCOUNT OR BENEFIT OF, U.S. PERSONS (AS SUCH TERMS ARE DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT) ABSENT REGISTRATION OR AN EXEMPTION FROM THE APPLICABLE REGISTRATION REQUIREMENTS UNDER THE U.S. SECURITIES ACT. THERE WILL BE NO PUBLIC OFFER OF THE BONDS IN THE UNITED STATES. THE OFFERING WHEN MADE, ANY OFFERING DOCUMENTATION RELATING TO THE OFFERING AND THIS PRESS RELEASE ARE ONLY ADDRESSED TO, AND DIRECTED IN THE UNITED KINGDOM (“UK”) AND MEMBER STATES OF THE EUROPEAN ECONOMIC AREA (THE “EEA”) AT PERSONS WHO ARE “QUALIFIED INVESTORS” WITHIN THE MEANING OF THE PROSPECTUS REGULATION IN RESPECT OF EACH MEMBER STATE OF THE EEA, AND THE POATRs IN RESPECT OF THE UNITED KINGDOM, RESPECTIVELY (“QUALIFIED INVESTORS”) AND HAVE BEEN PREPARED ON THE BASIS THAT (I) ANY OFFER OF NEW CONVERTIBLE BONDS IN ANY MEMBER STATE OF THE EEA WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE PROSPECTUS REGULATION FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS AND (II) ANY OFFER OF NEW CONVERTIBLE BONDS IN THE UK WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE POATRs FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS. THE EXPRESSION \"PROSPECTUS REGULATION\" MEANS REGULATION (EU) 2017/1129 (AS AMENDED OR SUPERSEDED) AND THE EXPRESSION “POATRs” MEANS THE PUBLIC OFFERS AND ADMISSIONS TO TRADING REGULATIONS 2024. SOLELY FOR THE PURPOSES OF THE PRODUCT GOVERNANCE REQUIREMENTS CONTAINED WITHIN: (A) EU DIRECTIVE 2014/65/EU ON MARKETS IN FINANCIAL INSTRUMENTS, AS AMENDED (“MIFID II”); (B) ARTICLES 9 AND 10 OF COMMISSION DELEGATED DIRECTIVE (EU) 2017/593 SUPPLEMENTING MIFID II; (C) LOCAL IMPLEMENTING MEASURES IN THE EEA; (D) REGULATION (EU) NO 600/2014 AS IT FORMS PART OF UNITED KINGDOM DOMESTIC LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 (“EUWA”) (“UK MIFIR”); AND (E) THE FCA HANDBOOK PRODUCT INTERVENTION AND PRODUCT GOVERNANCE SOURCEBOOK (TOGETHER, THE “PRODUCT GOVERNANCE REQUIREMENTS”), AND DISCLAIMING ALL AND ANY LIABILITY, WHETHER ARISING IN TORT, CONTRACT OR OTHERWISE, WHICH ANY “MANUFACTURER” (FOR THE PURPOSES OF THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS) MAY OTHERWISE HAVE WITH RESPECT THERETO, THE BONDS HAVE BEEN SUBJECT TO A PRODUCT APPROVAL PROCESS, WHICH HAS DETERMINED THAT: (I) THE TARGET MARKET FOR THE BONDS IS (A) IN THE EEA, ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ONLY, EACH AS DEFINED IN MIFID II AND (B) IN THE UNITED KINGDOM, ELIGIBLE COUNTERPARTIES (AS DEFINED IN THE FCA HANDBOOK CONDUCT OF BUSINESS SOURCEBOOK) AND PROFESSIONAL CLIENTS (AS DEFINED IN UK MIFIR); AND/OR (II) ALL CHANNELS FOR DISTRIBUTION OF THE BONDS TO ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ARE APPROPRIATE AS PERMITTED BY MIFID II (THE “TARGET MARKET ASSESSMENT”). ANY PERSON SUBSEQUENTLY OFFERING, SELLING OR RECOMMENDING THE BONDS (A \"DISTRIBUTOR\") SHOULD TAKE INTO CONSIDERATION THE MANUFACTURERS’ TARGET MARKET ASSESSMENT; HOWEVER, A DISTRIBUTOR SUBJECT TO THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS IS RESPONSIBLE FOR UNDERTAKING ITS OWN TARGET MARKET ASSESSMENT IN RESPECT OF THE BONDS (BY EITHER ADOPTING OR REFINING THE MANUFACTURERS’ TARGET MARKET ASSESSMENT) AND DETERMINING APPROPRIATE DISTRIBUTION CHANNELS. THE TARGET MARKET ASSESSMENT IS WITHOUT PREJUDICE TO THE REQUIREMENTS OF ANY CONTRACTUAL OR LEGAL SELLING RESTRICTIONS IN RELATION TO ANY OFFERING OF THE BONDS. FOR THE AVOIDANCE OF DOUBT, THE TARGET MARKET ASSESSMENT DOES NOT CONSTITUTE: (A) AN ASSESSMENT OF SUITABILITY OR APPROPRIATENESS FOR THE PURPOSES OF MIFID II OR UK MIFIR; OR (B) A RECOMMENDATION TO ANY INVESTOR OR GROUP OF INVESTORS TO INVEST IN, OR PURCHASE, OR TAKE ANY OTHER ACTION WHATSOEVER WITH RESPECT TO THE BONDS. THE BONDS ARE NOT INTENDED TO BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO AND SHOULD NOT BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA OR THE UNITED KINGDOM. FOR THESE PURPOSES, A RETAIL INVESTOR (A) IN THE EEA, MEANS A PERSON WHO IS ONE (OR MORE) OF: (I) A RETAIL CLIENT AS DEFINED IN POINT (11) OF ARTICLE 4(1) OF MIFID II; OR (II) A CUSTOMER WITHIN THE MEANING OF DIRECTIVE (EU) 2016/97 (AS AMENDED), WHERE THAT CUSTOMER WOULD NOT QUALIFY AS A PROFESSIONAL CLIENT AS DEFINED IN POINT (10) OF ARTICLE 4(1) OF MIFID II AND (B) IN THE UK, MEANS A PERSON WHO IS NOT A PROFESSIONAL CLIENT, AS DEFINED IN POINT (8) OF ARTICLE 2(1) OF REGULATION (EU) NO 600/2014 AS IT FORMS PART OF DOMESTIC LAW BY VIRTUE OF THE EUWA. CONSEQUENTLY, (I) NO KEY INFORMATION DOCUMENT REQUIRED BY REGULATION (EU) NO 1286/2014, AS AMENDED (THE “PRIIPS REGULATION”) FOR OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE EEA HAS BEEN PREPARED AND THEREFORE OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA MAY BE UNLAWFUL UNDER THE PRIIPS REGULATION AND (II) NO DISCLOSURE DOCUMENT REQUIRED BY THE FCA PRODUCT DISCLOSURE SOURCEBOOK (“DISC”) FOR OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE UNITED KINGDOM HAS BEEN PREPARED AND THEREFORE OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE UNITED KINGDOM MAY BE UNLAWFUL UNDER DISC AND THE CONSUMER COMPOSITE INVESTMENTS (DESIGNATED ACTIVITIES) REGULATIONS 2024. IN ADDITION, THIS PRESS RELEASE IS FOR DISTRIBUTION ONLY TO PERSONS WHO (I) HAVE PROFESSIONAL EXPERIENCE IN MATTERS RELATING TO INVESTMENTS FALLING WITHIN ARTICLE 19(5) OF THE FINANCIAL SERVICES AND MARKETS ACT 2000 (FINANCIAL PROMOTION) ORDER 2005 (AS AMENDED THE “FINANCIAL PROMOTION ORDER”), (II) ARE PERSONS FALLING WITHIN ARTICLE 49(2)(A) TO (D) (“HIGH NET WORTH COMPANIES, UNINCORPORATED ASSOCIATIONS ETC.\") OF THE FINANCIAL PROMOTION ORDER, (III) ARE OUTSIDE THE UNITED KINGDOM, OR (IV) ARE PERSONS TO WHOM AN INVITATION OR INDUCEMENT TO ENGAGE IN INVESTMENT ACTIVITY (WITHIN THE MEANING OF SECTION 21 OF THE FINANCIAL SERVICES AND MARKETS ACT 2000) IN CONNECTION WITH THE ISSUE OR SALE OF ANY SECURITIES MAY OTHERWISE LAWFULLY BE COMMUNICATED OR CAUSED TO BE COMMUNICATED (ALL SUCH PERSONS TOGETHER BEING REFERRED TO AS “RELEVANT PERSONS”). THIS PRESS RELEASE IS DIRECTED ONLY AT RELEVANT PERSONS AND MUST NOT BE ACTED ON OR RELIED ON BY PERSONS WHO ARE NOT RELEVANT PERSONS. ANY INVESTMENT OR INVESTMENT ACTIVITY TO WHICH THIS PRESS RELEASE RELATES IS AVAILABLE ONLY TO RELEVANT PERSONS AND WILL BE ENGAGED IN ONLY WITH RELEVANT PERSONS. ANY DECISION TO PURCHASE ANY OF THE BONDS SHOULD ONLY BE MADE ON THE BASIS OF AN INDEPENDENT REVIEW BY A PROSPECTIVE INVESTOR OF THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. NEITHER THE JOINT BOOKRUNNERS NOR ANY OF THEIR RESPECTIVE AFFILIATES ACCEPT ANY LIABILITY ARISING FROM THE USE OF, OR MAKE ANY REPRESENTATION AS TO THE ACCURACY OR COMPLETENESS OF, THIS PRESS RELEASE OR THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. THE INFORMATION CONTAINED IN THIS PRESS RELEASE IS SUBJECT TO CHANGE IN ITS ENTIRETY WITHOUT NOTICE UP TO THE SETTLEMENT DATE. EACH PROSPECTIVE INVESTOR SHOULD PROCEED ON THE ASSUMPTION THAT IT MUST BEAR THE ECONOMIC RISK OF AN INVESTMENT IN THE BONDS OR THE SHARES TO BE ISSUED OR TRANSFERRED AND DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS (TOGETHER WITH THE BONDS, THE “SECURITIES”). NONE OF THE ISSUER OR THE JOINT BOOKRUNNERS MAKE ANY REPRESENTATION AS TO (I) THE SUITABILITY OF THE SECURITIES FOR ANY PARTICULAR INVESTOR, (II) THE APPROPRIATE ACCOUNTING TREATMENT AND POTENTIAL TAX CONSEQUENCES OF INVESTING IN THE SECURITIES OR (III) THE FUTURE PERFORMANCE OF THE SECURITIES EITHER IN ABSOLUTE TERMS OR RELATIVE TO COMPETING INVESTMENTS. THE JOINT BOOKRUNNERS ARE ACTING ON BEHALF OF THE ISSUER AND NO ONE ELSE IN CONNECTION WITH THE BONDS AND WILL NOT BE RESPONSIBLE TO ANY OTHER PERSON FOR PROVIDING THE PROTECTIONS AFFORDED TO CLIENTS OF THE JOINT BOOKRUNNERS OR FOR PROVIDING ADVICE IN RELATION TO THE SECURITIES. EACH OF THE ISSUER, THE JOINT BOOKRUNNERS AND THEIR RESPECTIVE AFFILIATES EXPRESSLY DISCLAIMS ANY OBLIGATION OR UNDERTAKING TO UPDATE, REVIEW OR REVISE ANY STATEMENT CONTAINED IN THIS PRESS RELEASE WHETHER AS A RESULT OF NEW INFORMATION, FUTURE DEVELOPMENTS OR OTHERWISE.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/3398.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 16 Jun 2026 17:22:50 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces (i) a US$1.5 billion dual-tranche offering of New Convertible Bonds and (ii) the early redemption of its 2027 Convertible Bonds]]></title>
	<description><![CDATA[Not for release, publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law. This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction. STMicroelectronics N.V. (the “Company” or “ST”) announces today the launch of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of ST (the “Shares”) (the “New Convertible Bonds”) and the early redemption of the outstanding US$750 million Zero Coupon Convertible Bonds due 2027 (ISIN: XS2211997239, the “2027 Convertible Bonds”). The New Convertible Bonds will be offered in two tranches (with a minimum size of US$500 million per tranche) with a maturity of 5 years (the “2031 Convertible Bonds”) and 7 years (the “2033 Convertible Bonds”), respectively. The terms of the New Convertible Bonds are expected to contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash and Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. The offering proceeds, net of costs, will be used by ST for general corporate purposes, including the early redemption of the 2027 Convertible Bonds. Offering of New Convertible Bonds The Company proposes to issue the dual-tranche New Convertible Bonds as follows: The 2031 Convertible Bonds will bear interest at an annual rate between 0.00% and 0.50%, payable semi-annually in arrear. The 2031 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2031, unless previously redeemed, converted or purchased and cancelled; and The 2033 Convertible Bonds will bear interest at an annual rate between 0.625% and 1.125%, payable semi-annually in arrear. The 2033 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2033, unless previously redeemed, converted or purchased and cancelled. The initial conversion price for the New Convertible Bonds is expected to be set: In relation to the 2031 Convertible Bonds, at a premium between 47.5% – 52.5%; and In relation to the 2033 Convertible Bonds, at a premium between 50% – 55%, in each case over the volume-weighted average price of a Share between opening of trading today and pricing of the offering on the Euronext Milan Market, organised and managed by Borsa Italiana S.p.A., converted into US dollars at the prevailing exchange rate at the time of pricing. The final terms of the New Convertible Bonds are expected to be determined and announced later today and settlement is expected to take place on or about June 23rd, 2026. Application will be made for the New Convertible Bonds to be admitted to trading on the Open Market (Freiverkehr) segment of the Frankfurt Stock Exchange within 90 days of settlement. In the context of the offering of the New Convertible Bonds, the Company will commit to a lock-up period from (and including) the pricing date to (and including) 90 days after closing in respect of the Shares and related securities. The issuance of the New Convertible Bonds has been approved by the managing board and the supervisory board of the Company. BNP PARIBAS and J.P. Morgan are acting as Joint Global Coordinators and Joint Bookrunners and Citigroup, Goldman Sachs Bank Europe SE, Intesa Sanpaolo, Morgan Stanley Europe SE, Natixis, Société Générale and UniCredit are acting as Joint Bookrunners in respect of the offering. Early redemption of the 2027 Convertible Bonds The Company will today give notice to the holders of the 2027 Convertible Bonds to redeem all of the 2027 Convertible Bonds on July 16th, 2026, at their principal amount in accordance with Condition 7(b)(i) of the Terms and Conditions of the 2027 Convertible Bonds. Holders of the 2027 Convertible Bonds are entitled to exercise their right to convert their 2027 Convertible Bonds into Shares, cash or a combination of Shares and cash by reference to the prevailing conversion price, currently US$45.10 per Share, subject to the relevant Conversion Date occurring on or before July 1st, 2026 in accordance with Condition 6(a)(i) of the Terms and Conditions of the 2027 Convertible Bonds. If holders of such 2027 Convertible Bonds exercise their conversion right, the Company may decide to settle such exercise through the payment of cash and delivery of Shares pursuant to the Net Share Settlement provisions of Condition 6(a)(iii) of the Terms and Conditions of the 2027 Convertible Bonds. * * * * * Issuer’s LEI: 213800Z8NOHIKRI42W10 * * * * * Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of the Market Abuse Regulation (EU) 596/2014 (“MAR”). * * * * * IMPORTANT NOTICE IN RELATION TO THE BONDS NO ACTION HAS BEEN TAKEN BY THE ISSUER, THE JOINT BOOKRUNNERS OR ANY OF THEIR RESPECTIVE AFFILIATES THAT WOULD PERMIT AN OFFERING OF THE BONDS OR POSSESSION OR DISTRIBUTION OF THIS PRESS RELEASE OR ANY OFFERING OR PUBLICITY MATERIAL RELATING TO THE BONDS IN ANY JURISDICTION WHERE ACTION FOR THAT PURPOSE IS REQUIRED. PERSONS INTO WHOSE POSSESSION THIS PRESS RELEASE COMES ARE REQUIRED BY THE ISSUER AND THE JOINT BOOKRUNNERS TO INFORM THEMSELVES ABOUT, AND TO OBSERVE, ANY SUCH RESTRICTIONS. THIS PRESS RELEASE IS NOT FOR DISTRIBUTION, DIRECTLY OR INDIRECTLY IN OR INTO THE UNITED STATES OR TO U.S. PERSONS (AS DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT OF 1933., AS AMENDED) (THE “U.S. SECURITIES ACT”).). THIS PRESS RELEASE IS NOT AN OFFER TO SELL SECURITIES OR THE SOLICITATION OF ANY OFFER TO BUY SECURITIES, NOR SHALL THERE BE ANY OFFER OF SECURITIES IN ANY JURISDICTION IN WHICH SUCH OFFER OR SALE WOULD BE UNLAWFUL. THE BONDS AND THE SHARES TO BE DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE U.S. SECURITIES ACT AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO, OR FOR THE ACCOUNT OR BENEFIT OF, U.S. PERSONS (AS SUCH TERMS ARE DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT) ABSENT REGISTRATION OR AN EXEMPTION FROM THE APPLICABLE REGISTRATION REQUIREMENTS UNDER THE U.S. SECURITIES ACT. THERE WILL BE NO PUBLIC OFFER OF THE BONDS IN THE UNITED STATES. THE OFFERING WHEN MADE, ANY OFFERING DOCUMENTATION RELATING TO THE OFFERING AND THIS PRESS RELEASE ARE ONLY ADDRESSED TO, AND DIRECTED IN THE UNITED KINGDOM (“UK”) AND MEMBER STATES OF THE EUROPEAN ECONOMIC AREA (THE “EEA”) AT PERSONS WHO ARE “QUALIFIED INVESTORS” WITHIN THE MEANING OF THE PROSPECTUS REGULATION IN RESPECT OF EACH MEMBER STATE OF THE EEA, AND THE POATRs IN RESPECT OF THE UNITED KINGDOM, RESPECTIVELY (“QUALIFIED INVESTORS”) AND HAVE BEEN PREPARED ON THE BASIS THAT (I) ANY OFFER OF NEW CONVERTIBLE BONDS IN ANY MEMBER STATE OF THE EEA WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE PROSPECTUS REGULATION FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS AND (II) ANY OFFER OF NEW CONVERTIBLE BONDS IN THE UK WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE POATRs FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS. THE EXPRESSION \"PROSPECTUS REGULATION\" MEANS REGULATION (EU) 2017/1129 (AS AMENDED OR SUPERSEDED) AND THE EXPRESSION “POATRs” MEANS THE PUBLIC OFFERS AND ADMISSIONS TO TRADING REGULATIONS 2024. SOLELY FOR THE PURPOSES OF THE PRODUCT GOVERNANCE REQUIREMENTS CONTAINED WITHIN: (A) EU DIRECTIVE 2014/65/EU ON MARKETS IN FINANCIAL INSTRUMENTS, AS AMENDED (“MIFID II”); (B) ARTICLES 9 AND 10 OF COMMISSION DELEGATED DIRECTIVE (EU) 2017/593 SUPPLEMENTING MIFID II; (C) LOCAL IMPLEMENTING MEASURES IN THE EEA; (D) REGULATION (EU) NO 600/2014 AS IT FORMS PART OF UNITED KINGDOM DOMESTIC LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 (“EUWA”) (“UK MIFIR”); AND (E) THE FCA HANDBOOK PRODUCT INTERVENTION AND PRODUCT GOVERNANCE SOURCEBOOK (TOGETHER, THE “PRODUCT GOVERNANCE REQUIREMENTS”), AND DISCLAIMING ALL AND ANY LIABILITY, WHETHER ARISING IN TORT, CONTRACT OR OTHERWISE, WHICH ANY “MANUFACTURER” (FOR THE PURPOSES OF THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS) MAY OTHERWISE HAVE WITH RESPECT THERETO, THE BONDS HAVE BEEN SUBJECT TO A PRODUCT APPROVAL PROCESS, WHICH HAS DETERMINED THAT: (I) THE TARGET MARKET FOR THE BONDS IS (A) IN THE EEA, ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ONLY, EACH AS DEFINED IN MIFID II AND (B) IN THE UNITED KINGDOM, ELIGIBLE COUNTERPARTIES (AS DEFINED IN THE FCA HANDBOOK CONDUCT OF BUSINESS SOURCEBOOK) AND PROFESSIONAL CLIENTS (AS DEFINED IN UK MIFIR); AND/OR (II) ALL CHANNELS FOR DISTRIBUTION OF THE BONDS TO ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ARE APPROPRIATE AS PERMITTED BY MIFID II (THE “TARGET MARKET ASSESSMENT”). ANY PERSON SUBSEQUENTLY OFFERING, SELLING OR RECOMMENDING THE BONDS (A \"DISTRIBUTOR\") SHOULD TAKE INTO CONSIDERATION THE MANUFACTURERS’ TARGET MARKET ASSESSMENT; HOWEVER, A DISTRIBUTOR SUBJECT TO THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS IS RESPONSIBLE FOR UNDERTAKING ITS OWN TARGET MARKET ASSESSMENT IN RESPECT OF THE BONDS (BY EITHER ADOPTING OR REFINING THE MANUFACTURERS’ TARGET MARKET ASSESSMENT) AND DETERMINING APPROPRIATE DISTRIBUTION CHANNELS. THE TARGET MARKET ASSESSMENT IS WITHOUT PREJUDICE TO THE REQUIREMENTS OF ANY CONTRACTUAL OR LEGAL SELLING RESTRICTIONS IN RELATION TO ANY OFFERING OF THE BONDS. FOR THE AVOIDANCE OF DOUBT, THE TARGET MARKET ASSESSMENT DOES NOT CONSTITUTE: (A) AN ASSESSMENT OF SUITABILITY OR APPROPRIATENESS FOR THE PURPOSES OF MIFID II OR UK MIFIR; OR (B) A RECOMMENDATION TO ANY INVESTOR OR GROUP OF INVESTORS TO INVEST IN, OR PURCHASE, OR TAKE ANY OTHER ACTION WHATSOEVER WITH RESPECT TO THE BONDS. THE BONDS ARE NOT INTENDED TO BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO AND SHOULD NOT BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA OR THE UNITED KINGDOM. FOR THESE PURPOSES, A RETAIL INVESTOR (A) IN THE EEA, MEANS A PERSON WHO IS ONE (OR MORE) OF: (I) A RETAIL CLIENT AS DEFINED IN POINT (11) OF ARTICLE 4(1) OF MIFID II; OR (II) A CUSTOMER WITHIN THE MEANING OF DIRECTIVE (EU) 2016/97 (AS AMENDED), WHERE THAT CUSTOMER WOULD NOT QUALIFY AS A PROFESSIONAL CLIENT AS DEFINED IN POINT (10) OF ARTICLE 4(1) OF MIFID II AND (B) IN THE UK, MEANS A PERSON WHO IS NOT A PROFESSIONAL CLIENT, AS DEFINED IN POINT (8) OF ARTICLE 2(1) OF REGULATION (EU) NO 600/2014 AS IT FORMS PART OF DOMESTIC LAW BY VIRTUE OF THE EUWA. CONSEQUENTLY, (I) NO KEY INFORMATION DOCUMENT REQUIRED BY REGULATION (EU) NO 1286/2014, AS AMENDED (THE “PRIIPS REGULATION”) FOR OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE EEA HAS BEEN PREPARED AND THEREFORE OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA MAY BE UNLAWFUL UNDER THE PRIIPS REGULATION AND (II) NO DISCLOSURE DOCUMENT REQUIRED BY THE FCA PRODUCT DISCLOSURE SOURCEBOOK (“DISC”) FOR OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE UNITED KINGDOM HAS BEEN PREPARED AND THEREFORE OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE UNITED KINGDOM MAY BE UNLAWFUL UNDER DISC AND THE CONSUMER COMPOSITE INVESTMENTS (DESIGNATED ACTIVITIES) REGULATIONS 2024. IN ADDITION, THIS PRESS RELEASE IS FOR DISTRIBUTION ONLY TO PERSONS WHO (I) HAVE PROFESSIONAL EXPERIENCE IN MATTERS RELATING TO INVESTMENTS FALLING WITHIN ARTICLE 19(5) OF THE FINANCIAL SERVICES AND MARKETS ACT 2000 (FINANCIAL PROMOTION) ORDER 2005 (AS AMENDED THE “FINANCIAL PROMOTION ORDER”), (II) ARE PERSONS FALLING WITHIN ARTICLE 49(2)(A) TO (D) (“HIGH NET WORTH COMPANIES, UNINCORPORATED ASSOCIATIONS ETC.\") OF THE FINANCIAL PROMOTION ORDER, (III) ARE OUTSIDE THE UNITED KINGDOM, OR (IV) ARE PERSONS TO WHOM AN INVITATION OR INDUCEMENT TO ENGAGE IN INVESTMENT ACTIVITY (WITHIN THE MEANING OF SECTION 21 OF THE FINANCIAL SERVICES AND MARKETS ACT 2000) IN CONNECTION WITH THE ISSUE OR SALE OF ANY SECURITIES MAY OTHERWISE LAWFULLY BE COMMUNICATED OR CAUSED TO BE COMMUNICATED (ALL SUCH PERSONS TOGETHER BEING REFERRED TO AS “RELEVANT PERSONS”). THIS PRESS RELEASE IS DIRECTED ONLY AT RELEVANT PERSONS AND MUST NOT BE ACTED ON OR RELIED ON BY PERSONS WHO ARE NOT RELEVANT PERSONS. ANY INVESTMENT OR INVESTMENT ACTIVITY TO WHICH THIS PRESS RELEASE RELATES IS AVAILABLE ONLY TO RELEVANT PERSONS AND WILL BE ENGAGED IN ONLY WITH RELEVANT PERSONS. ANY DECISION TO PURCHASE ANY OF THE BONDS SHOULD ONLY BE MADE ON THE BASIS OF AN INDEPENDENT REVIEW BY A PROSPECTIVE INVESTOR OF THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. NEITHER THE JOINT BOOKRUNNERS NOR ANY OF THEIR RESPECTIVE AFFILIATES ACCEPT ANY LIABILITY ARISING FROM THE USE OF, OR MAKE ANY REPRESENTATION AS TO THE ACCURACY OR COMPLETENESS OF, THIS PRESS RELEASE OR THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. THE INFORMATION CONTAINED IN THIS PRESS RELEASE IS SUBJECT TO CHANGE IN ITS ENTIRETY WITHOUT NOTICE UP TO THE SETTLEMENT DATE. EACH PROSPECTIVE INVESTOR SHOULD PROCEED ON THE ASSUMPTION THAT IT MUST BEAR THE ECONOMIC RISK OF AN INVESTMENT IN THE BONDS OR THE SHARES TO BE ISSUED OR TRANSFERRED AND DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS (TOGETHER WITH THE BONDS, THE “SECURITIES”). NONE OF THE ISSUER OR THE JOINT BOOKRUNNERS MAKE ANY REPRESENTATION AS TO (I) THE SUITABILITY OF THE SECURITIES FOR ANY PARTICULAR INVESTOR, (II) THE APPROPRIATE ACCOUNTING TREATMENT AND POTENTIAL TAX CONSEQUENCES OF INVESTING IN THE SECURITIES OR (III) THE FUTURE PERFORMANCE OF THE SECURITIES EITHER IN ABSOLUTE TERMS OR RELATIVE TO COMPETING INVESTMENTS. THE JOINT BOOKRUNNERS ARE ACTING ON BEHALF OF THE ISSUER AND NO ONE ELSE IN CONNECTION WITH THE BONDS AND WILL NOT BE RESPONSIBLE TO ANY OTHER PERSON FOR PROVIDING THE PROTECTIONS AFFORDED TO CLIENTS OF THE JOINT BOOKRUNNERS OR FOR PROVIDING ADVICE IN RELATION TO THE SECURITIES. EACH OF THE ISSUER, THE JOINT BOOKRUNNERS AND THEIR RESPECTIVE AFFILIATES EXPRESSLY DISCLAIMS ANY OBLIGATION OR UNDERTAKING TO UPDATE, REVIEW OR REVISE ANY STATEMENT CONTAINED IN THIS PRESS RELEASE WHETHER AS A RESULT OF NEW INFORMATION, FUTURE DEVELOPMENTS OR OTHERWISE. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3397.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 16 Jun 2026 06:19:19 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics expands ST87M01 NB-IoT module platform with certifications for North America and Brazil]]></title>
	<description><![CDATA[STMicroelectronics has completed certification of ST87M01 NB-IoT modules in North America and Brazil, letting IoT projects in both regions leverage the modules’ 5G-ready connectivity, optional extra features, and supply-chain advantages. The approved modules for the USA and Canada markets, FCC, PTCRB and ISED certified, include NB-IoT Release 15 cellular connectivity and additional options of GNSS and Wi-Fi positioning for outdoor and indoor localization and asset tracking. ST is working with Onomondo — a global IoT network operator trusted by enterprises worldwide — to bring these certified modules to market with a ready-to-use connectivity layer, giving customers an accelerated and fully managed path to deployment across North America. \"With FCC, PTCRB, and ISED certification now in place, the ST87M01 is fully ready to power IoT deployments across the USA and Canada. Our collaboration with Onomondo adds a further dimension to this — giving customers a proven global connectivity platform to deploy, manage, and scale their applications across North America with speed and confidence,\" said Domenico Arrigo, General Manager, Application Specific Product Division, STMicroelectronics. Wanig Le Pennec, Director of Global Partnerships at Onomondo, added, “Our work with ST brings energy-efficient, compact modules and global connectivity into one certified solution, giving teams across North America a faster route into these markets, with full visibility into every device and the control to optimize performance and manage costs as their fleet grows.\" The ST87M01 module platform has also achieved Anatel certification in Brazil, further expanding its global footprint. With NB-IoT connectivity and optional GNSS/Wi-Fi positioning, the ST87M01 unlocks the full potential of Brazil\'s fastest-growing IoT verticals — smart metering, smart street lighting, monitoring livestock and agriculture sensors, and asset tracking. Customers can now bring to market compact, energy-efficient, and highly scalable solutions that are fully aligned with the demands of Brazil\'s evolving connected infrastructure. ST’s Domenico Arrigo commented, \"Brazil represents one of the most dynamic and fast-growing IoT markets in Latin America, driven by strong government initiatives and a thriving enterprise ecosystem. With Anatel certification now secured, the ST87M01 brings its geolocation capabilities, outstanding energy efficiency, and large-scale deployment simplicity to customers who are ready to realize those opportunities.” The modules available for each market are: • Region-specific part numbers for USA and Canada: ST87M01-2001 with NB-IoT connectivity; ST87M01-2301 with NB-IoT and GNSS/Wi-Fi positioning. • Anatel -certified modules in Brazil: ST87M01-1000 with NB-IoT; ST87M01-1100 and ST87M01-1101 with NB-IoT and GNSS/Wi-Fi positioning. Close integration of all features in one device saves integration engineering challenges and costs. Further information for editors ST87M01 modules are already widely deployed in utility metering, smart city, and industrial IoT solutions including smart meters, asset trackers, remote monitoring, smart buildings, and smart factories throughout Europe, Middle East, and Africa (EMEA). The modules comply with the European Radio Equipment Directive, including Section 3.3 cybersecurity requirements. They are also certified by the Global Certification Forum (GCF), including multiple GSM bands and 3GPP test specifications for NB-IoT, RSP, UICC, and ETSI USIM. All ST87M01 modules are entirely designed, built, and supported by ST, giving customers peace of mind regarding production, shipping, and security. Building IoT devices using ST87M01 modules lets developers access ST’s extensive ecosystem that includes development tools, hardware kits, reference designs, software libraries, application examples, and antenna-design assistance. The resources available for developers include ST87M01 firmware, ST’s Easy Connect software library, a Windows-PC graphical tool for configuring module settings and downloading firmware images. The tools provide a console to send commands, as well as panels for monitoring network and radio connections, managing positioning services, and debugging. Developers can leverage these tools to integrate the ST87M01 with their host-system microcontroller or embed firmware directly in the ST87M01 for simple applications and use-cases. Dedicated evaluation kits are available for the new region-specific modules. Drawing less than 0.5µA in standby, and less than 1.2µA while operating in power-saving mode (PSM), the modules meet typical market demands for low power consumption and extended battery life in the field. ST87M01 modules are in production now in a compact 10.6mm x 12.8mm package just 2.4 mm high. Information about samples and pricing requests is available through local ST sales offices worldwide. Visit https://www.st.com/st87m01 for more information.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/n4781.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/N4781D-Jun-10-2026-ST87M01-NB-IoT-for-AME-markets_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Wed, 10 Jun 2026 14:00:32 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics and the LEO opportunity]]></title>
	<description><![CDATA[By Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group. A new space economy is taking shape The space industry can be seen as evolving along two broad paths. Traditional space includes geostationary and medium Earth orbit systems used for established applications such as broadcasting, meteorology, and GNSS. These programs are mission-critical, but they are characterized by large satellites, long development cycles, and highly predictable service models. Low Earth orbit (LEO) is different. It is built around smaller satellites, much faster deployment, lower latency, and business models designed for mass adoption. This shift is not just about orbit altitude; it is about economics. LEO opens the door to broader connectivity, higher deployment volumes, and stronger semiconductor content per system. That change has been enabled by three major technology inflections. First, launch costs have fallen dramatically thanks to reusable rockets. Second, satellites have become lighter, more standardized, and more digital, with software-defined payloads and inter-satellite optical links increasingly common. Third, user terminals have evolved from traditional parabolic antennas into electronically steered phased arrays capable of tracking fast-moving satellites with precision and reliability. Together, these shifts have created an ecosystem where silicon content matters more than ever. ST’s position: from early participation to market leadership ST has been active in space for more than 45 years, with a long track record across both traditional and new space programs. In LEO, the company was involved from the beginning and has since become the leading semiconductor player in the market. That leadership is already visible in the numbers. ST’s LEO-related revenue reached approximately $600 million in 2025, up from about $175 million in 2021, representing a CAGR of roughly 36%. This is an impressive starting point, but the opportunity is still in its early innings. The market is expanding quickly, the customer base is broadening, and the underlying technology roadmap continues to deepen semiconductor content across satellites, gateways, and user terminals. Why LEO is scaling so fast The economics of LEO are being transformed by scale. Gartner estimates that LEO services spending will approach $15 billion globally in 2026. The growth is continuing across three major service categories: broadband, direct-to-cell, and eventually orbital data centers. Broadband is the largest opportunity today. LEO constellations can connect underserved regions, improve resilience for corporate and government users, and provide connectivity for mobility applications such as aviation, maritime, and eventually automotive. In a world where almost 3 billion people remain on the wrong side of the digital divide, the importance of global broadband access is difficult to overstate. The second growth engine is direct-to-cell, which enables phones and IoT devices to connect directly to satellites acting as cell towers in space. This expands connectivity into previously unreachable areas and opens growth in roaming-free services and asset tracking. The third frontier is orbital data centers. While still early, the concept is gaining traction as the cost of launch per kilogram is reduced and the economics of putting compute in orbit become more credible. A highly semiconductor-intensive ecosystem Over the next five years, LEO will scale rapidly into a true communications ecosystem. Space-based downlink capacity is expected to grow around 10x by 2030, gateway infrastructure will expand by estimated 1.6x, and subscribers could rise from about 10 million today to more than 200 million. LEO is not just a communications market. It is a semiconductor market. ST’s opportunity spans all three layers of the ecosystem: • Satellites • Gateways • User terminals Each layer has different technical requirements, but all rely on advanced silicon content. A key factor is the scale: the market is shipping thousands of satellites per year, thousands of gateways, and millions, eventually tens of millions, of user terminals. That combination creates a very large addressable market. Based on our current view, we estimate that LEO broadband electronics SAM was around $650 million in 2025, growing to roughly $2 billion in 2028 and close to $3 billion by 2030, excluding additional upside from orbital data centers. Technology differentiation: where ST wins ST’s competitive strength in LEO comes from the combination of our process technologies, packaging capabilities, and manufacturing scale. FD-SOI for satellites and microcontrollers: ST’s Fully Depleted Silicon On Insulator, or FD-SOI, supplied from our 300 mm fab in France and through foundry partnerships, is a key enabler for ASICs and microcontrollers in space systems. It offers a combination of performance, power efficiency, radiation robustness, and embedded memory capabilities. This matters because satellites need electronics that are reliable, efficient, and resilient in harsh conditions. In LEO, where platforms must be lighter and more integrated, these attributes are essential. BiCMOS for user terminals: For user terminals, BiCMOS is the best technology on the planet for front-end modules. These modules perform signal amplification, transmit and receive switching, filtering, and phase shifting for beamforming. They are central to the cost, performance, and scalability of phased-array antennas. ST’s BiCMOS platform is especially strong in Ku-band cost-optimized designs and Ka-band performance designs, both served from our French manufacturing base. Panel-Level Packaging: On the back end, ST’s Panel-Level Packaging, or PLP, is a genuine differentiator. Unlike traditional round-wafer packaging, PLP uses large rectangular panels, enabling high-volume production, strong RF and thermal performance, and miniaturization. The combination of BiCMOS and PLP is particularly powerful. Neither technology alone would be as compelling as the two together. This is a classic example of how our IDM model delivers technology excellence plus manufacturing execution. ST employee holding a BiCMOS PLP panel Starlink as proof of scale The clearest proof point for ST’s LEO capability is our long-standing collaboration with SpaceX. The relationship spans more than a decade and has involved co-development across key technologies for satellites and user terminals. So far, we have delivered more than 7.5 billion ICs into the program, with active silicon covering roughly 20,000 square meters, or the equivalent of four American football fields. The scale is extraordinary, and it demonstrates that ST can support industrial-grade space programs at very high volume. Economics, scale, and customer concentration Today the LEO market remains relatively concentrated. In the next five years, more players may emerge with the scale and capital intensity to matter, including Amazon Leo (formerly ‘Project Kuiper’), Terawave, OneWeb, European projects, and new emerging constellations. This concentration creates both opportunity and discipline. We believe we can sustain a leading position because of our process integration, packaging capabilities, and manufacturing independence. Product life cycles in user terminals are also short, around 18 months per generation, which reinforces the importance of our IDM model with the capability for industrial scale, rapid ramp-up, and tight execution. This is precisely the kind of environment where our manufacturing model creates advantage. The long-term ambition Our message is straightforward. We expect space to become a major growth driver, with an ambition to generate well above €3 billion in cumulative revenue from space over the 2026 to 2028 period. On the LEO side specifically, this includes broadband and direct-to-cell, with orbital data centers as potential upside. The broader significance is that ST is building a leadership position in a market that is only beginning to expand. LEO is no longer a niche space project. It is becoming a communications infrastructure layer, and eventually perhaps a compute layer, for the planet. For ST, the opportunity is not just about serving satellites. It is about supplying the technologies that make the new space economy scalable, efficient, and economically viable. Presentation: ST: The LEO Opportunity]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0021.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 4 Jun 2026 07:00:47 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics high-performance vibration sensor with in-sensor AI offers a compelling alternative to piezosensor to fast-growing industrial condition-monitoring market]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an intelligent vibration sensor designed for industrial condition monitoring applications that require high accuracy, reliability, and energy efficiency. Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advanced digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range, up to 125°C, to withstand harsh environments, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments. Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities to optimize production flow. “Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensor, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.” “The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range, wide bandwidth, and high-temperature capability, combined with ease of adoption and a cost-effective, simplified circuit design, allowed us to replace the incumbent piezosensor technology. Moreover, the integrated ISPU 2.0 processor positions complex signal processing and rapid AI inference close to the sensing element, enabling smarter system responses,” said Andrea Torcelli, Chief Technology Officer at Bonfiglioli S.P.A. By enabling predictive and prioritized maintenance, remote condition monitoring allows companies to improve equipment uptime and operating efficiency while eliminating unexpected failures and enhancing safety. Fortune Business Insights states the global market for this technology will exceed $5 billion by 2032, growing at over 9% CAGR[1] . [1] https://www.fortunebusinessinsights.com/machine-condition-monitoring-market-112654 Further technical information: The IIS3DWB10IS vibration sensor is the first digital sensor with wide bandwidth and embedded processing to deliver performance meeting the needs of high-end industrial condition monitoring applications offering a compelling alternative to piezoelectric sensors. Accurate measurement of vibrations above 10 kHz, with a large dynamic range up to 200g, combines with a noise floor as low as 35 µg/sqrt(Hz). This is comparable to the noise performance of piezoelectric sensors. Moreover, the IIS3DWB10IS delivers equivalent accuracy and sensitivity, adding digital-sensing advantages including smaller size, lower power consumption, simplified electrical and mechanical design, and greater flexibility in the computational partitioning. ISPU 2.0 (Intelligent Sensor Processing Unit) introduces new hardware accelerators to perform real-time signal processing and AI at the edge. These hardware accelerators make frequently used functions faster and more power efficient. The core is C-programmable and contains on-chip program and data RAM. The supporting ecosystem provides software libraries that facilitate executing typical vibration monitoring algorithms in the ISPU, including FFT, filtering, envelope, velocity severity, and anomaly detection. With 40 MIPS and 40 MFLOPS digital signal processing, the ISPU 2.0 delivers up to four times the processing performance of the previous generation. In addition, the ISPU 2.0 sensor interface supports six times faster data transfer with the MEMS circuitry. The IIS3DWB10IS also contains a 2048x80-bit FIFO register and an accurate temperature sensor. The sensor’s rugged MEMS-based design supports operation up to 125°C. The IIS3DWB10IS is supported in ST’s 10-year industrial longevity program. The IIS3DWB10IS is packaged as a 4.5 mm x 4.5 mm x 1.5 mm 16-lead LGA package with wettable flanks that facilitate automatic optical inspection in high-quality surface-mount assembly processes. The product is scheduled to be available by July 2026 from $25 for orders of 1000 pieces. Please visit https://www.st.com/IIS3DWB10IS for more information. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4778.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4778D-Jun-3-2026-IIS3DWB10IS-smart-vibrometer_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Wed, 3 Jun 2026 07:00:58 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics raises its revenue ambition for Data Centers amidst continued strong demand for AI infrastructure]]></title>
	<description><![CDATA[In light of continued strong AI infrastructure-led demand and based on recent progress made on capacity ramp-up, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is raising its revenue ambition for Data Centers. Data center revenues are now expected at about $1 billion in 2026 (compared to “nicely above $500 million” expected previously). Assuming the current dynamic continues and with the current engagements we have, revenues could double in 2027 (compared to “well above $1 billion” expected previously). Forward-looking Information Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors: changes in global trade policies, including the continuation, adoption and expansion of tariffs and trade barriers and sanctions, that are affecting and could further affect the macro-economic environment and are adversely impacting and could further adversely impact the demand for our products; uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which are impacting and may further impact production capacity and end-market demand for our products; customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all; the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities; unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our research and development and manufacturing programs, which benefit from public funding; financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers; availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation); the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology; theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation; the impact of intellectual property claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets; variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations; the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts; natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results; industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs. Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions. Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2025 as filed with the Securities and Exchange Commission (“SEC”) on February 26, 2026. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances. Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3396.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
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	<pubDate>Tue, 2 Jun 2026 07:01:57 +0200</pubDate>

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